Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Article Type
Subject Area
Topics
Date
Availability
1-2 of 2
Keywords: ultrasonic bonding
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Journal of Tribology
Article Type: Technical Papers
J. Tribol. July 2003, 125(3): 576–581.
Published Online: June 19, 2003
... by the Tribology Division for publication in the ASME JOURNAL OF TRIBOLOGY . Manuscript received by the Tribology Division May 17, 2002 revised manuscript received August 20, 2002. Associate Editor: C.-P. R. Ku. 17 May 2002 20 August 2002 19 06 2003 ultrasonic bonding lead bonding...
Journal Articles
Journal:
Journal of Tribology
Article Type: Technical Papers
J. Tribol. October 2001, 123(4): 725–731.
Published Online: December 6, 2000
...Yeau-Ren Jeng; Jeng-Haur Horng Wire bonding is a popular joining technique in microelectronic interconnect. In this study, the effects of applied load, surface roughness, welding power and welding time on bonding strength were investigated using an ultrasonic bonding machine and a pull tester...
