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Keywords: interconnected systems
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Journal Articles
Article Type: Technical Papers
J. Tribol. October 2001, 123(4): 725–731.
Published Online: December 6, 2000
... interconnected systems ultrasonic bonding integrated circuit packaging mechanical contact Bonding strength is dependent on many variables, such as welding time, applied force, interface temperature, surface roughness and ultrasonic power. Several studies 7 8 had tried to examine the effects...