1-6 of 6
Computer cooling
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Thermal management system of vapor compression for downhole instrument

Accepted Manuscript
Qiuyang Tao, Minghui Wei, Hongjun Chen, Aihua Deng, Yilin He
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research Papers
J. Thermal Sci. Eng. Appl.
Paper No: TSEA-23-1053
DOI: https://doi.org/10.1115/1.4062555
Published Online: May 16, 2023
View Article titled, Thermal management system of vapor compression for downhole instrument
Open the PDF for Thermal management system of vapor compression for downhole instrument in another window
Topics: Compression, Heat, Instrumentation, Thermal management, Vapors, Cooling, Exergy, Insulation, High temperature, Computer cooling
Journal Articles

Embedded Microfluidic Cooling in Aluminum Nitride (AlN) HTCC Substrate for High-power RF Chip Array

Accepted Manuscript
Yupu Ma, Tao Wei, Jiyu Qian, Jian Peng
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research Papers
J. Thermal Sci. Eng. Appl.
Paper No: TSEA-23-1003
DOI: https://doi.org/10.1115/1.4062400
Published Online: April 21, 2023
View Article titled, Embedded Microfluidic Cooling in Aluminum Nitride (AlN) HTCC Substrate for High-power RF Chip Array
Open the PDF for Embedded Microfluidic Cooling in Aluminum Nitride (AlN) HTCC Substrate for High-power RF Chip Array in another window
Topics: Aluminum, Cooling, Heat, Microfluidics, Energy dissipation, Microchannels, Electronics, Heat flux, Aluminum alloys, Computational fluid dynamics
Journal Articles

User Preference-Oriented Design of Heat Dissipating Elements for Densely Packaged Transistors With Consideration of Design Robustness

Mark Christian E. Manuel, Kuan Sung Hsu, Shu-Ping Lin, Po Ting Lin
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. June 2017, 9(2): 021012.
Paper No: TSEA-16-1057
DOI: https://doi.org/10.1115/1.4035837
Published Online: March 7, 2017
View Article titled, User Preference-Oriented Design of Heat Dissipating Elements for Densely Packaged Transistors With Consideration of Design Robustness
Open the PDF for User Preference-Oriented Design of Heat Dissipating Elements for Densely Packaged Transistors With Consideration of Design Robustness in another window
Topics: Computer cooling, Design, Heat, Preferences, Response surface methodology, Robustness, Temperature, Cooling, Flow (Dynamics), Transistors
Journal Articles

Compact Gravity Driven and Capillary-Sized Thermosyphon Loop for Power Electronics Cooling

Francesco Agostini, Thomas Gradinger, Didier Cottet
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2014, 6(3): 031003.
Paper No: TSEA-13-1121
DOI: https://doi.org/10.1115/1.4026184
Published Online: January 31, 2014
View Article titled, Compact Gravity Driven and Capillary-Sized Thermosyphon Loop for Power Electronics Cooling
Open the PDF for Compact Gravity Driven and Capillary-Sized Thermosyphon Loop for Power Electronics Cooling in another window
Topics: Computer cooling, Condensers (steam plant), Cooling, Flow (Dynamics), Fluids, Gravity (Force), Temperature, Thermal resistance, Refrigerants, Pressure drop
Journal Articles

Analysis of Liquid-Cooled Heat Sink Used for Power Electronics Cooling

Hemin Hu, Jiahui Zhang, Xiaoze Du, Lijun Yang
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2011, 3(2): 021001.
DOI: https://doi.org/10.1115/1.4004079
Published Online: July 13, 2011
View Article titled, Analysis of Liquid-Cooled Heat Sink Used for Power Electronics Cooling
Open the PDF for Analysis of Liquid-Cooled Heat Sink Used for Power Electronics Cooling in another window
Topics: Flow (Dynamics), Heat sinks, Heat transfer, Shapes, Temperature, Coolants, Pressure drop, Computer cooling, Density, Heat
Journal Articles

Nanofluid Properties and Their Effects on Convective Heat Transfer in an Electronics Cooling Application

Jessica Townsend, Rebecca J. Christianson
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2009, 1(3): 031006.
DOI: https://doi.org/10.1115/1.4001123
Published Online: March 16, 2010
View Article titled, Nanofluid Properties and Their Effects on Convective Heat Transfer in an Electronics Cooling Application
Open the PDF for Nanofluid Properties and Their Effects on Convective Heat Transfer in an Electronics Cooling Application in another window
Topics: Computer cooling, Nanofluids, Thermal conductivity, Viscosity, Water, Temperature, Fluids, Nanoparticles, Particulate matter, Flow (Dynamics)