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Journal Articles

Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics

Behnam Garakani, Udara S. Somarathna, Ashraf Umar, Gurvinder Singh Khinda, Mohamed Youssef M. Abdelatty, El Mehdi Abbara, Sari Al Zerey, Mike Hopkins, Sai Srinivas, Chuck Kinzel, Christopher Halseth, Mark Ronay, Mark D. Poliks

J. Electron. Packag. September 2023, 145(3): 031006.

Paper No: EP-22-1008

DOI: https://doi.org/10.1115/1.4056640

Published Online: February 1, 2023

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Topics: Fatigue, Liquid metals, Tension, Transmission lines, Cycles, Fatigue testing, Reliability, Wearable devices, Metals, Simulation

Journal Articles

Reviewer's Recognition

J. Electron. Packag. June 2023, 145(2): 020201.

Paper No: EP-23-1002

DOI: https://doi.org/10.1115/1.4056725

Published Online: February 1, 2023

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Journal Articles

Improving the Power Output of a Partially Shaded Photovoltaic Array Through a Hybrid Magic Square Configuration With Differential Evolution-Based Adaptive P&O MPPT Method

Vijay Muniyandi, Saravanan Manimaran, Ashok Kumar Balasubramanian

J. Sol. Energy Eng. October 2023, 145(5): 051001.

Paper No: SOL-22-1196

DOI: https://doi.org/10.1115/1.4056621

Published Online: January 27, 2023

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Topics: Shades and shadows, Solar cell arrays

Journal Articles

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

Xin Wei, Sa'd Hamasha, Ali Alahmer, Mohamed El Amine Belhadi

J. Electron. Packag. September 2023, 145(3): 031005.

Paper No: EP-22-1066

DOI: https://doi.org/10.1115/1.4056559

Published Online: January 27, 2023

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Topics: Ball-Grid-Array packaging, Cycles, Fatigue, Finishes, Solder joints, Stress, Fatigue life, Solders, Alloys

Journal Articles

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the BoR and PoEF Tests

Ming-Yi Tsai, T. C. Kuo

J. Electron. Packag.

Paper No: EP-22-1060

DOI: https://doi.org/10.1115/1.4056717

Published Online: January 23, 2023

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Topics: Bending strength, Silicon, Stress, Buckling, Displacement, Failure mechanisms, Testing

Journal Articles

Origami With Rotational Symmetry: A Review on Their Mechanics and Design

Lu Lu, Sophie Leanza, Ruike Renee Zhao

Appl. Mech. Rev. September 2023, 75(5): 050801.

Paper No: AMR-22-1094

DOI: https://doi.org/10.1115/1.4056637

Published Online: January 23, 2023

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Topics: Design, Mechanical behavior, Shapes, Trusses (Building), Geometry, Deformation

Journal Articles

Machine Learning Non-Reciprocity of a Linear Waveguide With a Local Nonlinear, Asymmetric Gate: Case of Strong Coupling

C. Wang, A. Mojahed, S. Tawfick, A. Vakakis

J. Comput. Nonlinear Dynam. March 2023, 18(3): 031004.

Paper No: CND-22-1054

DOI: https://doi.org/10.1115/1.4056587

Published Online: January 19, 2023

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Topics: Acoustics, Artificial neural networks, Excitation, Gates (Closures), Machine learning, Waveguides, Computer simulation, Simulation, Steady state, Stability

Journal Articles

Flaw Detection in Multi-Laser Powder Bed Fusion Using In Situ Coaxial Multi-Spectral Sensing and Deep Learning

Amit Surana, Matthew E. Lynch, Abdalla R. Nassar, Greg C. Ojard, Brian A. Fisher, David Corbin, Ryan Overdorff

J. Manuf. Sci. Eng. May 2023, 145(5): 051005.

Paper No: MANU-22-1330

DOI: https://doi.org/10.1115/1.4056540

Published Online: January 19, 2023

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Topics: Flaw detection, Lasers, Sensors, Image segmentation, Resolution (Optics), Semantics, Time series, Testing

Proceedings Papers

Encapsulating and Inkjet-Printing Electronics on Flexible Substrates for Harsh Environment

Sahil Wankhede, Xian Du, Ali Alshehri, Keith Brashler, Doru Turcan

Proc. ASME. IAM2022, 2022 International Additive Manufacturing Conference, V001T03A001, October 19–20, 2022

Paper No: IAM2022-92250

DOI: https://doi.org/10.1115/IAM2022-92250

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Topics: Electronics, Printing

Journal Articles

Mandrel Bend Test of Screen-Printed Silver Conductors

Rui Chen, Justin Chow, Yi Zhou, Suresh K. Sitaraman

J. Electron. Packag. September 2023, 145(3): 031004.

Paper No: EP-22-1072

DOI: https://doi.org/10.1115/1.4056530

Published Online: January 11, 2023

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Topics: Cycles, Flexible electronics, Silver, Reliability, Inks, Damage, Imaging

Journal Articles

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller

J. Electron. Packag. March 2023, 145(1): 011109.

Paper No: EP-22-1035

DOI: https://doi.org/10.1115/1.4056477

Published Online: January 11, 2023

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Topics: Adhesives, Electronics, Reliability, Surface preparation, Temperature, Stress, Inks, Silver

Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey

J. Electron. Packag. March 2023, 145(1): 010301.

Paper No: EP-22-1094

DOI: https://doi.org/10.1115/1.4056558

Published Online: January 11, 2023

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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices

Journal Articles

Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications

Giuseppe Mauromicale, Michele Calabretta, Giuseppe Scarcella, Giacomo Scelba, Alessandro Sitta

J. Electron. Packag. September 2023, 145(3): 031003.

Paper No: EP-22-1049

DOI: https://doi.org/10.1115/1.4056413

Published Online: December 23, 2022

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Topics: Power semiconductor devices, Simulation, Design, Automotive industry, System-in-package, Thermomechanics, Cycles

Journal Articles

Decoupling Uniaxial Tensile Prestress and Waveguide Effects From Estimates of the Complex Shear Modulus in a Cylindrical Structure Using Transverse-Polarized Dynamic Elastography

Melika Salehabadi, Joseph Crutison, Dieter Klatt, Thomas J. Royston

ASME J of Medical Diagnostics. May 2023, 6(2): 021003.

Paper No: JESMDT-22-1030

DOI: https://doi.org/10.1115/1.4056411

Published Online: December 23, 2022

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Topics: Elastography, Excitation, Shear modulus, Waveguides, Waves, Cylinders, Stress, Shear (Mechanics), Phantoms, Shear waves

Journal Articles

Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging

Pradeep Lall, Hyesoo Jang

J. Electron. Packag. March 2023, 145(1): 011108.

Paper No: EP-22-1030

DOI: https://doi.org/10.1115/1.4056412

Published Online: December 23, 2022

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Topics: Batteries, Cycles, Lithium-ion batteries, Machine learning, Regression models, Reliability, Stress

Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler

J. Electron. Packag. March 2023, 145(1): 011107.

Paper No: EP-22-1020

DOI: https://doi.org/10.1115/1.4056445

Published Online: December 23, 2022

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Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles

Journal Articles

Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks

Inderjot Kaur, Shiraz Mujahid, YubRaj Paudel, Hongjoo Rhee, Prashant Singh

J. Electron. Packag. September 2023, 145(3): 031002.

Paper No: EP-22-1051

DOI: https://doi.org/10.1115/1.4056305

Published Online: December 21, 2022

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Topics: Flow (Dynamics), Fluids, Heat transfer, Heat transfer coefficients, Topology, Temperature

Journal Articles

Assessment of Dynamic Photovoltaic Shading Systems on Energy Performance of Commercial Buildings

Dana Alwelayti, Ammar H. A. Dehwah, Moncef Krarti

J. Eng. Sustain. Bldgs. Cities. November 2022, 3(4): 041003.

Paper No: JESBC-22-1018

DOI: https://doi.org/10.1115/1.4056394

Published Online: December 20, 2022

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Topics: Climate, Daylighting, HVAC equipment, Shades and shadows, Stress, Structures, Photovoltaic panels, Energy consumption, Heating, Roofs

Journal Articles

Methods of Joining Aluminum-Alloy Products

E. C. Hartmann, G. O. Hoglund, M. A. Miller

J. Fluids Eng. January 1945, 67(1): 1–21.

DOI: https://doi.org/10.1115/1.4018156

Published Online: December 14, 2022

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Topics: Aluminum alloys, Joining, Alloys, Metals, Bonding, Brazing, Resins, Riveting, Soldering, Structural metals

Journal Articles

The Reversal Characteristics of GABAergic Neurons: A Neurovascular Model

Tim David, Robin Morillo, Clare Howarth, Jason Berwick, Llywelyn Lee

J Biomech Eng. March 2023, 145(3): 031007.

Paper No: BIO-22-1190

DOI: https://doi.org/10.1115/1.4056336

Published Online: December 14, 2022

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Topics: Computer simulation, Drugs, Electrical conductance, Enzymes, Particle filtering (numerical methods), Sheet molding compound (Plastics), Sliding mode control, Surface mount components, Potassium, Signals

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Journal citation

NARROW

Supplemental Material

Manuscript

Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics

Reviewer's Recognition

Improving the Power Output of a Partially Shaded Photovoltaic Array Through a Hybrid Magic Square Configuration With Differential Evolution-Based Adaptive P&O MPPT Method

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the BoR and PoEF Tests

Origami With Rotational Symmetry: A Review on Their Mechanics and Design

Machine Learning Non-Reciprocity of a Linear Waveguide With a Local Nonlinear, Asymmetric Gate: Case of Strong Coupling

Flaw Detection in Multi-Laser Powder Bed Fusion Using In Situ Coaxial Multi-Spectral Sensing and Deep Learning

Encapsulating and Inkjet-Printing Electronics on Flexible Substrates for Harsh Environment

Mandrel Bend Test of Screen-Printed Silver Conductors

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Special Section on InterPACK2021

Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications

Decoupling Uniaxial Tensile Prestress and Waveguide Effects From Estimates of the Complex Shear Modulus in a Cylindrical Structure Using Transverse-Polarized Dynamic Elastography

Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks

Assessment of Dynamic Photovoltaic Shading Systems on Energy Performance of Commercial Buildings

Methods of Joining Aluminum-Alloy Products

The Reversal Characteristics of GABAergic Neurons: A Neurovascular Model

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