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Proceedings Papers

Electron-Phonon Interactions for Nanoscale Energy Transport Simulations in Semiconductor Devices

Michael P. Medlar, Edward C. Hensel
Publisher: American Society of Mechanical Engineers
Proc. ASME. HT2023, ASME 2023 Heat Transfer Summer Conference, V001T03A002, July 10–12, 2023
Paper No: HT2023-106873
https://doi.org/10.1115/HT2023-106873
View Paper titled, Electron-Phonon Interactions for Nanoscale Energy Transport Simulations in Semiconductor Devices
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Topics: Electron-phonon interactions, Nanoscale phenomena, Semiconductor devices, Simulation
Proceedings Papers

Nano Fabricated Electrostatic Cleaning Technique for Dust Control for Solar Power Efficiency on Lunar Surface

Voss Harrigan, Korey Carter, Marcus Gilmore, Jiajun Xu
Publisher: American Society of Mechanical Engineers
Proc. ASME. POWER2023, ASME Power Applied R&D 2023, V001T05A010, August 6–8, 2023
Paper No: POWER2023-108823
https://doi.org/10.1115/POWER2023-108823
View Paper titled, Nano Fabricated Electrostatic Cleaning Technique for Dust Control for Solar Power Efficiency on Lunar Surface
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Topics: Dust control, Photovoltaic panels, Solar power, Dust, Solar energy, Carbon nanotubes, Particulate matter, Climate, Outer space, Robots
Journal Articles

The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch

Accepted Manuscript
Justin Chow, Suresh Sitaraman
Journal: Journal of Electronic Packaging
Article Type: Research-Article
Publisher: ASME
J. Electron. Packag.
Paper No: EP-23-1035
https://doi.org/10.1115/1.4063485
Published Online: September 23, 2023
View Article titled, The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch
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Topics: Inks, Modeling, Resistors, Silver, Failure, Rupture, Contact resistance, Electrons, Experimental methods, Fillers (Materials)
Journal Articles

Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska

Accepted Manuscript
Jewoo Park, Nhi Quach, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Chenxi Yin, Alex K. Lee, Yoonjin Won
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
Publisher: ASME
J. Electron. Packag.
Paper No: EP-23-1039
https://doi.org/10.1115/1.4063486
Published Online: September 23, 2023
View Article titled, Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska
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Topics: Autonomous vehicles, Machine learning, Sensors, Algorithms, Artificial intelligence, Computer software, Drops, Hardware, Safety, Temperature
Journal Articles

Converging Jet Impingement for Enhanced Liquid Cooling

Accepted Manuscript
Reece Whitt, Rafael Estrella, David Huitink
Journal: Journal of Electronic Packaging
Article Type: Research-Article
Publisher: ASME
J. Electron. Packag.
Paper No: EP-23-1032
https://doi.org/10.1115/1.4063484
Published Online: September 23, 2023
View Article titled, Converging Jet Impingement for Enhanced Liquid Cooling
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Topics: Cooling, Heat transfer, Nozzles, Jets, Turbulence, Additive manufacturing, Electronics, Engineering simulation, Fluids, Heat flux
Proceedings Papers

Simulations of Complex Offshore Problems Using GPU-Accelerated Near-Far Field Coupled Model

Xin Lu, My Ha Dao, Quang Tuyen Le
Publisher: American Society of Mechanical Engineers
Proc. ASME. OMAE2023, Volume 7: CFD & FSI, V007T08A001, June 11–16, 2023
Paper No: OMAE2023-101331
https://doi.org/10.1115/OMAE2023-101331
View Paper titled, Simulations of Complex Offshore Problems Using GPU-Accelerated Near-Far Field Coupled Model
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Topics: Engineering simulation, Graphics processing units, Ocean engineering, Simulation, Waves, Computer simulation, Floating structures, Floating wind turbines, Hull, Mooring
Proceedings Papers

CFD-Based Simulation for the Stability of Floating Solar Arrays

Prince Arora, Badri Prasad Patel, Suhail Ahmad, Arvind Kumar Jain, C. S. Joe Joe, Pratham Aggarwal
Publisher: American Society of Mechanical Engineers
Proc. ASME. OMAE2023, Volume 8: Ocean Renewable Energy, V008T09A017, June 11–16, 2023
Paper No: OMAE2023-108232
https://doi.org/10.1115/OMAE2023-108232
View Paper titled, CFD-Based Simulation for the Stability of Floating Solar Arrays
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Topics: Computational fluid dynamics, Simulation, Solar cell arrays, Solar energy, Stability, Stress, Wind
Journal Articles

Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform

Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Article Type: Research-Article
Publisher: ASME
J. Electron. Packag. June 2024, 146(2): 021003.
Paper No: EP-22-1092
https://doi.org/10.1115/1.4062924
Published Online: September 20, 2023
View Article titled, Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform
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Topics: Bonding, Copper, Microchannels, Polishing, Manifolds, Solders
Journal Articles

Novel Payloads to Mitigate Maladaptive Inward Arterial Remodeling in Drug-Coated Balloon Therapy

Tarek Shazly, Mark Uline, Clinton Webb, Breanna Pederson, John F. Eberth, Vijaya B. Kolachalama
Journal: Journal of Biomechanical Engineering
Article Type: Research-Article
J Biomech Eng. December 2023, 145(12): 121004.
Paper No: BIO-23-1175
https://doi.org/10.1115/1.4063122
Published Online: September 4, 2023
View Article titled, Novel Payloads to Mitigate Maladaptive Inward Arterial Remodeling in Drug-Coated Balloon Therapy
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Topics: Drugs, Pressure, Surface mount components, Particle filtering (numerical methods), Sheet molding compound (Plastics), Sliding mode control, Performance
Journal Articles

Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single-Crystals

Accepted Manuscript
Abhishek Deshpande, Aniket Bharamgonda, Qian Jiang, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-23-1038
https://doi.org/10.1115/1.4063325
Published Online: September 2, 2023
View Article titled, Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single-Crystals
Open the PDF for Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single-Crystals in another window
Topics: Anisotropy, Crystals, Solder joints, Stress, Modeling, Failure, Plasticity, Shapes, Solders, Cooling
Journal Articles

Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948 ]

Wing K. Yeung, Tung T. Lam
Journal: Journal of Electronic Packaging
Article Type: Errata
J. Electron. Packag. March 2024, 146(1): 017001.
Paper No: EP-23-1056
https://doi.org/10.1115/1.4063174
Published Online: August 25, 2023
View Article titled, Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948 ]
Open the PDF for Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948 ] in another window
Topics: Electrons, Current density
Journal Articles

Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life

Jonghwan Ha, Yangyang Lai, Junbo Yang, Pengcheng Yin, Seungbae Park
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021002.
Paper No: EP-23-1033
https://doi.org/10.1115/1.4063058
Published Online: August 17, 2023
View Article titled, Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life
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Topics: Fatigue life, Resistors, Shapes, Solder joints, Solders, Thermal shock, Manufacturing
Journal Articles

An Online Quality Detection Method With Ensemble Learning on Imbalance Data for Wave Soldering

Hanpeng Gao, Yu Guo, Shaohua Huang, Jian Xie, Daoyuan Liu, Tao Wu, Xu Tian
Journal: Journal of Computing and Information Science in Engineering
Article Type: Research Papers
J. Comput. Inf. Sci. Eng. February 2024, 24(2): 021006.
Paper No: JCISE-23-1187
https://doi.org/10.1115/1.4063068
Published Online: August 14, 2023
View Article titled, An Online Quality Detection Method With Ensemble Learning on Imbalance Data for Wave Soldering
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Topics: Wave soldering, Flaw detection, Experimental analysis
Journal Articles

Hybrid Substrates for Heterogeneous Integration

John H. Lau, Gary Chang-Fu Chen, Channing Cheng-Lin Yang, Vincent Teng, Andy Yan-Jia Peng, Jones Yu-Cheng Huang, Hsing-Ning Liu, Y. H. Chen, Tzyy-Jang Tseng, Ming Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021001.
Paper No: EP-23-1025
https://doi.org/10.1115/1.4062993
Published Online: August 11, 2023
View Article titled, Hybrid Substrates for Heterogeneous Integration
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Topics: Bonding, Metals, Solder joints, Reliability, Dielectric materials
Journal Articles

A GPU-Based Parallel Region Classification Method for Continuous Constraint Satisfaction Problems

Accepted Manuscript
Guanglu Zhang, Wangchuan Feng, Jonathan Cagan
Journal: Journal of Mechanical Design
Article Type: Research Papers
J. Mech. Des.
Paper No: MD-23-1142
https://doi.org/10.1115/1.4063158
Published Online: August 10, 2023
View Article titled, A GPU-Based Parallel Region Classification Method for Continuous Constraint Satisfaction Problems
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Topics: Design, Graphics processing units, Visualization, Optimization, Approximation, Design automation, Pareto optimization, Tradeoffs
Journal Articles

Accelerating Chemical Kinetics Calculations With Physics Informed Neural Networks

Ahmed Almeldein, Noah Van Dam
Journal: Journal of Engineering for Gas Turbines and Power
Article Type: Research-Article
J. Eng. Gas Turbines Power. September 2023, 145(9): 091008.
Paper No: GTP-23-1113
https://doi.org/10.1115/1.4062654
Published Online: July 27, 2023
View Article titled, Accelerating Chemical Kinetics Calculations With Physics Informed Neural Networks
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Topics: Artificial neural networks, Chemical kinetics, Combustion, Errors, Physics, Simulation, Temperature, Methane, Graphics processing units
Proceedings Papers

Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints

S. M. Heinrich, S. Shakya, P. S. Lee
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 155-167, November 17–22, 1996
Paper No: IMECE1996-0730
https://doi.org/10.1115/IMECE1996-0730
View Paper titled, Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints
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Topics: Displacement, Solder joints, Manufacturing, Materials properties, Shear (Mechanics), Boundary-value problems, Die cutting, Dimensions, Disks, Finite element analysis
Proceedings Papers

Separation of a Molten Axisymmetric Solder Joint

Lewis S. Goldmann
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 169-173, November 17–22, 1996
Paper No: IMECE1996-0731
https://doi.org/10.1115/IMECE1996-0731
View Paper titled, Separation of a Molten Axisymmetric Solder Joint
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Topics: Separation (Technology), Solder joints, Ball-Grid-Array packaging, Displacement, Flip-chip, Flip-chip devices, Joining, Reliability
Proceedings Papers

Physics of Failure Based CAD Software for Reliability Assessment of Hybrid Optoelectronic Packages

Patricia F. Mead, Patrick McCluskey, Qing Yan Chen, Don Haislett
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 205-211, November 17–22, 1996
Paper No: IMECE1996-0735
https://doi.org/10.1115/IMECE1996-0735
View Paper titled, Physics of Failure Based CAD Software for Reliability Assessment of Hybrid Optoelectronic Packages
Open the PDF for Physics of Failure Based CAD Software for Reliability Assessment of Hybrid Optoelectronic Packages in another window
Topics: Computer software, Computer-aided design, Failure, Physics, Reliability, Lasers, Light-emitting diodes, Optoelectronic devices, Printed circuit board assemblies, Computer-aided engineering
Proceedings Papers

Characterization and Modeling of the Creep Behavior of Xydar G930 Liquid Crystalline Polymer

Vincent DiFilippo, Anil Saigal, Michael A. Zimmerman
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 37-44, November 17–22, 1996
Paper No: IMECE1996-0721
https://doi.org/10.1115/IMECE1996-0721
View Paper titled, Characterization and Modeling of the Creep Behavior of Xydar G930 Liquid Crystalline Polymer
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Topics: Creep, Liquid crystalline polymers, Modeling, Stress, Temperature, Tensile strength, Deformation, Electronic packaging, Failure, Fillers (Materials)