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Electronic & Photonic Packaging
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Proceedings Papers
Publisher: American Society of Mechanical Engineers
Proc. ASME. HT2023, ASME 2023 Heat Transfer Summer Conference, V001T03A002, July 10–12, 2023
Paper No: HT2023-106873
Proceedings Papers
Publisher: American Society of Mechanical Engineers
Proc. ASME. POWER2023, ASME Power Applied R&D 2023, V001T05A010, August 6–8, 2023
Paper No: POWER2023-108823
Journal Articles
Accepted Manuscript
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
Publisher: ASME
J. Electron. Packag.
Paper No: EP-23-1035
Published Online: September 23, 2023
Journal Articles
Accepted Manuscript
Jewoo Park, Nhi Quach, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Chenxi Yin, Alex K. Lee, Yoonjin Won
Journal:
Journal of Electronic Packaging
Article Type: Technical Briefs
Publisher: ASME
J. Electron. Packag.
Paper No: EP-23-1039
Published Online: September 23, 2023
Journal Articles
Accepted Manuscript
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
Publisher: ASME
J. Electron. Packag.
Paper No: EP-23-1032
Published Online: September 23, 2023
Proceedings Papers
Publisher: American Society of Mechanical Engineers
Proc. ASME. OMAE2023, Volume 7: CFD & FSI, V007T08A001, June 11–16, 2023
Paper No: OMAE2023-101331
Proceedings Papers
Publisher: American Society of Mechanical Engineers
Proc. ASME. OMAE2023, Volume 8: Ocean Renewable Energy, V008T09A017, June 11–16, 2023
Paper No: OMAE2023-108232
Journal Articles
Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
Publisher: ASME
J. Electron. Packag. June 2024, 146(2): 021003.
Paper No: EP-22-1092
Published Online: September 20, 2023
Journal Articles
Journal:
Journal of Biomechanical Engineering
Article Type: Research-Article
J Biomech Eng. December 2023, 145(12): 121004.
Paper No: BIO-23-1175
Published Online: September 4, 2023
Journal Articles
Accepted Manuscript
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-23-1038
Published Online: September 2, 2023
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Errata
J. Electron. Packag. March 2024, 146(1): 017001.
Paper No: EP-23-1056
Published Online: August 25, 2023
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021002.
Paper No: EP-23-1033
Published Online: August 17, 2023
Journal Articles
Article Type: Research Papers
J. Comput. Inf. Sci. Eng. February 2024, 24(2): 021006.
Paper No: JCISE-23-1187
Published Online: August 14, 2023
Journal Articles
John H. Lau, Gary Chang-Fu Chen, Channing Cheng-Lin Yang, Vincent Teng, Andy Yan-Jia Peng, Jones Yu-Cheng Huang, Hsing-Ning Liu, Y. H. Chen, Tzyy-Jang Tseng, Ming Li
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021001.
Paper No: EP-23-1025
Published Online: August 11, 2023
Journal Articles
Accepted Manuscript
Journal:
Journal of Mechanical Design
Article Type: Research Papers
J. Mech. Des.
Paper No: MD-23-1142
Published Online: August 10, 2023
Journal Articles
Article Type: Research-Article
J. Eng. Gas Turbines Power. September 2023, 145(9): 091008.
Paper No: GTP-23-1113
Published Online: July 27, 2023
Proceedings Papers
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 155-167, November 17–22, 1996
Paper No: IMECE1996-0730
Proceedings Papers
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 169-173, November 17–22, 1996
Paper No: IMECE1996-0731
Proceedings Papers
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 205-211, November 17–22, 1996
Paper No: IMECE1996-0735
Proceedings Papers
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 37-44, November 17–22, 1996
Paper No: IMECE1996-0721
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