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Zhuomin Zhang
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031120.
Paper No: EP-19-1127
Published Online: May 4, 2020
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019
Paper No: IPACK2019-6391
Journal Articles
Journal:
Journal of Heat Transfer
Article Type: Guest Editorial
J. Heat Transfer. January 2018, 140(1): 010301.
Paper No: HT-17-1314
Published Online: August 16, 2017
Journal Articles
Journal:
Journal of Heat Transfer
Article Type: Guest Editorial
J. Heat Transfer. May 2017, 139(5): 050301.
Paper No: HT-17-1058
Published Online: March 7, 2017
Journal Articles
Andrew J. McNamara, Yogendra Joshi, Zhuomin Zhang, Kyoung-sik Moon, Ziyin Lin, Yagang Yao, Ching-Ping Wong, Wei Lin
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031014.
Paper No: EP-14-1043
Published Online: September 1, 2015
Proceedings Papers
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T30026, March 13–17, 2011
Paper No: AJTEC2011-44421