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Proceedings Papers

A Novel Fast Predicting Technique for the Absorptivity of Surface Coating

Emir Özkökdemir, Berkay Filiz, Yener Usul
Proc. ASME. HT2021, ASME 2021 Heat Transfer Summer Conference, V001T12A001, June 16–18, 2021
Paper No: HT2021-61956
DOI: https://doi.org/10.1115/HT2021-61956
View Paper titled, A Novel Fast Predicting Technique for the Absorptivity of Surface Coating
Click here to open pdf in another window PDF for A Novel Fast Predicting Technique for the Absorptivity of Surface Coating
Topics: Coating processes, Coatings, Solar radiation, Aluminum plate, Simulation, Electronics, Errors, Finite element analysis, Finite element model, Heat capacity
Proceedings Papers

Determination of the Thermal Properties of a PCB by Coupled Numerical and Experimental Approach

Yener Usul, Mustafa Özçatalbaş
Proc. ASME. IMECE2020, Volume 11: Heat Transfer and Thermal Engineering, V011T11A007, November 16–19, 2020
Paper No: IMECE2020-24049
DOI: https://doi.org/10.1115/IMECE2020-24049
View Paper titled, Determination of the Thermal Properties of a PCB by Coupled Numerical and Experimental Approach
Click here to open pdf in another window PDF for Determination of the Thermal Properties of a PCB by Coupled Numerical and Experimental Approach
Topics: Electronics, Finite element methods, Specific heat, Thermal conductivity, Thermal properties, Numerical analysis, Boundary-value problems, Composite materials, Electronic systems, Geometry
Proceedings Papers

Investigation on Thermal Performance of a Simple Electronic Board Using Different Phase Change Material Packaging Types

Emir Özkökdemir, Yener Usul
Proc. ASME. IMECE2020, Volume 11: Heat Transfer and Thermal Engineering, V011T11A005, November 16–19, 2020
Paper No: IMECE2020-23729
DOI: https://doi.org/10.1115/IMECE2020-23729
View Paper titled, Investigation on Thermal Performance of a Simple Electronic Board Using Different Phase Change Material Packaging Types
Click here to open pdf in another window PDF for Investigation on Thermal Performance of a Simple Electronic Board Using Different Phase Change Material Packaging Types
Topics: Cooling, Finite element methods, Packaging, Phase change materials, Electronics, Energy storage, Heating, Aluminum, Computation, Computational methods