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Proceedings Papers

Study of Package Technologies for Implantable Microdevices

Weihong Li, Zhenjiang Shi, Hang Guo, Shiqing Chen, Xiuhan Li, Haixia Zhang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 167-170, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70194
https://doi.org/10.1115/MicroNano2008-70194
View Paper titled, Study of Package Technologies for Implantable Microdevices
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Topics: Circuits, Packaging, Resonance, Silicones, Thin films
Proceedings Papers

High Q Circular-Section Solenoid-Type Inductor

Xiuhan Li, Guanghua Shu, Jinan Sao, Xiongwei Zhang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 745-749, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70139
https://doi.org/10.1115/MicroNano2008-70139
View Paper titled, High Q Circular-Section Solenoid-Type Inductor
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Topics: Complementary metal oxide semiconductors, Flip-chip, Flip-chip devices, Inductors, Q-factor, Solenoids
Proceedings Papers

Development of RF Power Attenuation Model With MEMS Coils

Quan Yuan, Xiuhan Li, Dan Li, Haixia Zhang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 69-72, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70145
https://doi.org/10.1115/MicroNano2008-70145
View Paper titled, Development of RF Power Attenuation Model With MEMS Coils
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Topics: Microelectromechanical systems
Proceedings Papers

Investigation on the Effects of Copper Electroplating Process

Yue Chen, Xiuhan Li, Shi Qing Chen, Haixia Zhang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 619-622, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70132
https://doi.org/10.1115/MicroNano2008-70132
View Paper titled, Investigation on the Effects of Copper Electroplating Process
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Topics: Copper, Current density, Electrical resistivity, Electroplating