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Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 7–9, 2019

Paper No: IPACK2019-6325

DOI: https://doi.org/10.1115/IPACK2019-6325

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Topics: Cooling, Experimental design

Journal Articles

Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies

Yang Peng, Renli Liang, Yun Mou, Jiangnan Dai, Mingxiang Chen, Xiaobing Luo

J. Electron. Packag. December 2019, 141(4): 040804.

Paper No: EP-18-1089

DOI: https://doi.org/10.1115/1.4044624

Published Online: September 19, 2019

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Topics: Light-emitting diodes, Packaging, Ultraviolet radiation

Journal Articles

Packaging for Laser-Based White Lighting: Status and Perspectives

Yupu Ma, Xiaobing Luo

J. Electron. Packag. March 2020, 142(1): 010801.

Paper No: EP-18-1105

DOI: https://doi.org/10.1115/1.4044359

Published Online: September 19, 2019

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Topics: Lasers, Packaging, Phosphors, Quenching (Metalworking), Temperature, Laser beams, Brightness (Photometry)

Journal Articles

Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure

Bin Xie, Haochen Liu, Xiao Wei Sun, Xingjian Yu, Ruikang Wu, Kai Wang, Xiaobing Luo

J. Electron. Packag. September 2019, 141(3): 031001.

Paper No: EP-18-1080

DOI: https://doi.org/10.1115/1.4042981

Published Online: April 10, 2019

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Topics: Heat, Light-emitting diodes, Nanoparticles, Phosphors, Quantum dots, Silicones, Temperature, Shells, Simulation

Journal Articles

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo

J. Electron. Packag. September 2019, 141(3): 031005.

Paper No: EP-18-1076

DOI: https://doi.org/10.1115/1.4042982

Published Online: April 10, 2019

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Topics: Light-emitting diodes, Particulate matter, Phosphors, Silicones, Packaging, Wetting, Surface energy

Proceedings Papers

Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs@Silica-on-Chip Structure

Bin Xie, Haochen Liu, Xiao Wei Sun, Xingjian Yu, Kai Wang, Xiaobing Luo

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 27–30, 2018

Paper No: IPACK2018-8301

DOI: https://doi.org/10.1115/IPACK2018-8301

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Topics: Temperature, Phosphors, Silicones, Light sources, Light-emitting diodes, Nanoparticles, Quantum dots, Rendering, Shells, Stability

Proceedings Papers

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 27–30, 2018

Paper No: IPACK2018-8211

DOI: https://doi.org/10.1115/IPACK2018-8211

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Topics: Light-emitting diodes, Packaging, Silicones, Wetting, Coating processes, Coatings, Phosphors, Domes (Structural elements), Geometry, Particulate matter

Proceedings Papers

Molecular Dynamics Simulation of AlN Deposition: Effect of N:Al Flux Ratio

Libin Zhang, Guo Zhu, Kuan Sun, Zhiyin Gan, Xiaobing Luo

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A011, August 27–30, 2018

Paper No: IPACK2018-8315

DOI: https://doi.org/10.1115/IPACK2018-8315

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Topics: Atoms, Crystals, Molecular dynamics simulation, Surface roughness, Temperature

Proceedings Papers

Numerical Study of the Flow Condition of the Hydrodynamic Levitated Mechanical Micropump

Ruikang Wu, Wei Lan, Xingjian Yu, Weicheng Shu, Meng Wang, Xiaobing Luo

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 27–30, 2018

Paper No: IPACK2018-8210

DOI: https://doi.org/10.1115/IPACK2018-8210

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Topics: Flow (Dynamics), Micropumps, Fluid dynamics, Pressure, Journal bearings, Pumps, Rotors, Bearings, Cooling, Cooling systems

Proceedings Papers

All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes

Yang Peng, Yun Mou, Xujia Xu, Hao Cheng, Hong Li, Mingxiang Chen, Xiaobing Luo

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 27–30, 2018

Paper No: IPACK2018-8225

DOI: https://doi.org/10.1115/IPACK2018-8225

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Topics: Glass, Light-emitting diodes, Phosphors, Emissions, Ions, Low temperature, Melting, Printing, Rendering, Sintering

Proceedings Papers

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing Luo

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A027, August 29–September 1, 2017

Paper No: IPACK2017-74196

DOI: https://doi.org/10.1115/IPACK2017-74196

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Topics: Composite materials, Optimization, Phase change materials, Thermal management, Thermal conductivity, Latent heat, Temperature, Heat flux, Cooling, Graphite

Proceedings Papers

Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer

Xingjian Yu, Weicheng Shu, Bofeng Shang, Bin Xie, Yanhua Cheng, Xiaobing Luo

Paper No: IPACK2017-74195

DOI: https://doi.org/10.1115/IPACK2017-74195

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Topics: Light-emitting diodes, Phosphors, Shapes, Geometry, Coating processes, Coatings, Computer simulation, Fluids, Temperature

Journal Articles

Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging

Bofeng Shang, Xingjian Yu, Huai Zheng, Bin Xie, Qi Chen, Xiaobing Luo

J. Electron. Packag. June 2016, 138(2): 021003.

Paper No: EP-15-1057

DOI: https://doi.org/10.1115/1.4033165

Published Online: April 19, 2016

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Topics: Coating processes, Computer simulation, Light-emitting diodes, Phosphors, Coatings, Packaging, Fluids

Journal Articles

Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and Perspectives

Bin Xie, Run Hu, Xiaobing Luo

J. Electron. Packag. June 2016, 138(2): 020803.

Paper No: EP-16-1020

DOI: https://doi.org/10.1115/1.4033143

Published Online: April 19, 2016

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Topics: Light-emitting diodes, Packaging, Polymers

Journal Articles

Special Section on InterPACK 2015

Satish Chaparala, Ashish Gupta, Mehdi Asheghi, Jeffrey Suhling, Toru Ikeda, Xiaobing Luo

J. Electron. Packag. March 2016, 138(1): 010201.

Paper No: EP-16-1019

DOI: https://doi.org/10.1115/1.4032748

Published Online: March 10, 2016

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Topics: Packaging, Thermal analysis, Electronic packaging, Electronics, Microchannels, Fluids, Printed circuit boards

Proceedings Papers

Intrinsic Thermal Conductivity of Wurtzite Al x Ga 1- x N, In x Ga 1- x N and In x Al 1- x N From First-Principles Calculation

Jinlong Ma, Baoling Huang, Wu Li, Xiaobing Luo

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A001, July 6–9, 2015

Paper No: IPACK2015-48032

DOI: https://doi.org/10.1115/IPACK2015-48032

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Topics: Thermal conductivity, Alloys, Crystals, Gallium nitride, Mean free path, Size effect, Temperature

Proceedings Papers

A Method to Eliminate the Effect of Phosphor Sedimentation on LED’s Angular Color Uniformity

Qi Chen, Run Hu, Yiman Wang, Huai Zheng, Xiaobing Luo

Paper No: IPACK2015-48023

DOI: https://doi.org/10.1115/IPACK2015-48023

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Topics: Phosphors, Sedimentation, Engineering simulation, Ray tracing, Simulation, Temperature

Proceedings Papers

Design, Fabrication and Characterization of a Mechanical Micropump

Bin Duan, Tinghui Guo, Minqing Luo, Xiaobing Luo

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A048, July 6–9, 2015

Paper No: IPACK2015-48017

DOI: https://doi.org/10.1115/IPACK2015-48017

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Topics: Design, Manufacturing, Micropumps, Flow (Dynamics), Blades, Computational fluid dynamics, Emissions, Impellers, Pressure, Pumps

Journal citation

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Supplemental Material

A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling

A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort

A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort

Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies

Packaging for Laser-Based White Lighting: Status and Perspectives

Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs@Silica-on-Chip Structure

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging

Molecular Dynamics Simulation of AlN Deposition: Effect of N:Al Flux Ratio

Numerical Study of the Flow Condition of the Hydrodynamic Levitated Mechanical Micropump

All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer

Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging

Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and Perspectives

Special Section on InterPACK 2015

Intrinsic Thermal Conductivity of Wurtzite Al x Ga 1- x N, In x Ga 1- x N and In x Al 1- x N From First-Principles Calculation

A Method to Eliminate the Effect of Phosphor Sedimentation on LED’s Angular Color Uniformity

Design, Fabrication and Characterization of a Mechanical Micropump

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