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Xiaobing Luo
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031010.
Paper No: EP-21-1079
Published Online: September 15, 2021
Includes: Supplementary data
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041106.
Paper No: EP-19-1106
Published Online: June 26, 2020
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 7–9, 2019
Paper No: IPACK2019-6325
Journal Articles
Article Type: Review Articles
J. Electron. Packag. March 2020, 142(1): 010801.
Paper No: EP-18-1105
Published Online: September 19, 2019
Journal Articles
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040804.
Paper No: EP-18-1089
Published Online: September 19, 2019
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031001.
Paper No: EP-18-1080
Published Online: April 10, 2019
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031005.
Paper No: EP-18-1076
Published Online: April 10, 2019
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 27–30, 2018
Paper No: IPACK2018-8301
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 27–30, 2018
Paper No: IPACK2018-8211
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A011, August 27–30, 2018
Paper No: IPACK2018-8315
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 27–30, 2018
Paper No: IPACK2018-8210
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 27–30, 2018
Paper No: IPACK2018-8225
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A027, August 29–September 1, 2017
Paper No: IPACK2017-74196
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A021, August 29–September 1, 2017
Paper No: IPACK2017-74195
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021003.
Paper No: EP-15-1057
Published Online: April 19, 2016
Journal Articles
Article Type: Review Articles
J. Electron. Packag. June 2016, 138(2): 020803.
Paper No: EP-16-1020
Published Online: April 19, 2016
Journal Articles
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A001, July 6–9, 2015
Paper No: IPACK2015-48032
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A044, July 6–9, 2015
Paper No: IPACK2015-48023
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A048, July 6–9, 2015
Paper No: IPACK2015-48017