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Vijay Sarihan
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Proceedings Papers

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 243-248, November 16–21, 1997
Paper No: IMECE1997-0823
Proceedings Papers

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 125-131, November 16–21, 1997
Paper No: IMECE1997-0507
Proceedings Papers

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 135-140, November 15–20, 1998
Paper No: IMECE1998-0438
Proceedings Papers

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 69-72, November 11–16, 2001
Paper No: IMECE2001/EPP-24708
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 501-505, July 19–23, 2009
Paper No: InterPACK2009-89330
Journal Articles