Topics: Electronic packaging, Testing, Cycles, Design, Electronic packages, Electronics, Engineering disciplines, Event history analysis, Experimental methods, Packaging

Topics: Accelerated life testing, Membranes, Sensors, Reliability, Testing, Failure, High temperature, Stress, Cycles, Deformation

Topics: Design, Manufacturing, Simulation, Density, Equipment performance, Finite element analysis, Flip-chip, Shrinkage (Materials), Thermal stresses

Topics: Damage, Solders, Stress, Temperature, Cycles, Fatigue, Fatigue life, Finite element methods, Alloys, Eutectic alloys

Topics: Fracture (Materials), Reliability, Stress, Testing, Failure analysis, Finite element analysis, Manufacturing, Silicon

Topics: Semiconductor wafers, Stress, Testing, Membranes, Sensors, Pressure sensors, Deformation, Residual stresses, Signals

Topics: Corners (Structural elements), Finite element analysis, Manufacturing, Packaging density (Electronics), Reliability, Solders, Thermomechanics, Warping

Topics: Thin films, National Institute of Standards and Technology, Materials properties, Materials science, Metallic films, Metals, Optimization, Reliability, Silicon

Topics: Adhesives, Computer cooling, Computer simulation, Computers, Concurrent engineering, Design, Drilling, Electronic packages, Electronics, Engineering design processes

Topics: Microelectromechanical systems, Reliability, Resonance, Sensors

Topics: Nanoparticles, Polymers, Resins, Reliability, Materials properties, Packaging, Particulate matter, Simulation, Composite materials, Diluents

Topics: Absorption, Anisotropy, Delamination, Failure mechanisms, Finite element analysis, Flip-chip, Simulation