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Proc. ASME. HT2013, Volume 4: Heat and Mass Transfer Under Extreme Conditions; Environmental Heat Transfer; Computational Heat Transfer; Visualization of Heat Transfer; Heat Transfer Education and Future Directions in Heat Transfer; Nuclear Energy, V004T14A016, July 14–19, 2013

Paper No: HT2013-17357

DOI: https://doi.org/10.1115/HT2013-17357

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Topics: Heat, Particle dynamics, Knudsen number, Phonons, Electromagnetic scattering, Engineering simulation, Mean free path, Particulate matter, Radiation scattering, Scattering (Physics)

Proceedings Papers

Under-Expanded Gas Flow at a Straight Mini-Tube Exit

Takahiro Yoshimaru, Yutaka Asako, Toru Yamada

Proc. ASME. ICNMM2013, ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, V001T01A001, June 16–19, 2013

Paper No: ICNMM2013-73041

DOI: https://doi.org/10.1115/ICNMM2013-73041

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Topics: Gas flow, Flow (Dynamics), Pressure, Computation, Flowmeters

Proceedings Papers

Effect of the Surface Tension of Liquid-Solid Interface on Liquid Flow in Parallel-Plate Sub-Micron Channels Using Multi-Body Dissipative Particle Dynamics

Toru Yamada, Yutaka Asako, Mohammad Faghri, Bengt Sundén

Proc. ASME. ICNMM2013, ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, V001T12A003, June 16–19, 2013

Paper No: ICNMM2013-73054

DOI: https://doi.org/10.1115/ICNMM2013-73054

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Topics: Flow (Dynamics), Particle dynamics, Surface tension, Particulate matter, Boundary-value problems, Reynolds number

Proceedings Papers

Diffusive-Ballistic Heat Transport in Thin Films Using Energy Conserving Dissipative Particle Dynamics

Toru Yamada, Sina Hamian, Keunhan Park, Yutaka Asako, Mohammad Faghri

Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 2953-2960, November 9–15, 2012

Paper No: IMECE2012-89641

DOI: https://doi.org/10.1115/IMECE2012-89641

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Topics: Heat, Particle dynamics, Thin films, Phonons, Electromagnetic scattering, Engineering simulation, Mean free path, Radiation scattering, Scattering (Physics), Simulation

Proceedings Papers

Simulations of Forced Convection Heat Transfer of Nanofluids in Parallel-Plate Microchannels Using Dissipative Particle Dynamics

Toru Yamada, Yutaka Asako, Chungpyo Hong, Mohammad Faghri

Proc. ASME. ICNMM2012, ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels, 555-561, July 8–12, 2012

Paper No: ICNMM2012-73225

DOI: https://doi.org/10.1115/ICNMM2012-73225

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Topics: Engineering simulation, Forced convection, Microchannels, Nanofluids, Particle dynamics, Simulation, Boundary-value problems, Nanoparticles, Flow (Dynamics), Temperature

Proceedings Papers

Simulation of Thermal Conductivity of Nanofluids Using Dissipative Particle Dynamics

Toru Yamada, Yutaka Asako, Mohammad Faghri, Chungpyo Hong

Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 819-827, March 3–6, 2012

Paper No: MNHMT2012-75311

DOI: https://doi.org/10.1115/MNHMT2012-75311

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Topics: Nanofluids, Particle dynamics, Simulation, Thermal conductivity, Water, Brownian motion, Flow (Dynamics), Heat, Interfacial thermal resistance, Nanoparticles

Proceedings Papers

Forced Convection Heat Transfer Simulation Using Dissipative Particle Dynamics With Energy Conservation

Toru Yamada, Anurag Kumar, Yutaka Asako, Mohammad Faghri

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 843-850, November 11–17, 2011

Paper No: IMECE2011-63773

DOI: https://doi.org/10.1115/IMECE2011-63773

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Topics: Energy conservation, Forced convection, Particle dynamics, Simulation, Particulate matter, Boundary-value problems, Heat flux, Temperature, Approximation, Critical heat flux

Proceedings Papers

Experimental Investigations of Laminar, Transitional to Turbulent Gas Flow in Rib-Patterned Micro-Channels

Chungpyo Hong, Toru Yamada, Yutaka Asako, Mohammad Faghri, Ichiro Ueno

Proc. ASME. ICNMM2011, ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, Volume 1, 327-334, June 19–22, 2011

Paper No: ICNMM2011-58100

DOI: https://doi.org/10.1115/ICNMM2011-58100

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Topics: Gas flow, Microchannels, Turbulence, Friction, Flow (Dynamics), Mach number, Glass, Pressure, Reynolds number, Semiconductor wafers

Proceedings Papers

Three Dimensional Simulation of Dynamics and Deformation of Red Blood Cells in Capillary Flow

Toru Yamada, Anurag Kumar, Yutaka Asako, Mohammad Faghri

Proc. ASME. IMECE2010, Volume 10: Micro and Nano Systems, 905-910, November 12–18, 2010

Paper No: IMECE2010-39140

DOI: https://doi.org/10.1115/IMECE2010-39140

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Topics: Deformation, Dynamics (Mechanics), Erythrocytes, Flow (Dynamics), Simulation, Shapes, Equilibrium (Physics), Hydrodynamics, Membranes, Particle dynamics

Proceedings Papers

Experimental Investigations of Laminar, Transitional to Turbulent Gas Flow in a Micro-Channel

Chungpyo Hong, Toru Yamada, Yutaka Asako, Mohammad Faghri, Koichi Suzuki, Ichiro Ueno

Proc. ASME. IMECE2010, Volume 7: Fluid Flow, Heat Transfer and Thermal Systems, Parts A and B, 1337-1343, November 12–18, 2010

Paper No: IMECE2010-40254

DOI: https://doi.org/10.1115/IMECE2010-40254

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Topics: Gas flow, Microchannels, Turbulence, Flow (Dynamics), Mach number, Compressibility, Friction, Glass, Pressure, Semiconductor wafers

Proceedings Papers

Fluid Flow Characteristics in Microchannels With Rib-Patterned Surface

Toru Yamada, Chungpyo Hong, Otto J. Gregory, Mohammad Faghri

Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10132, March 13–17, 2011

Paper No: AJTEC2011-44631

DOI: https://doi.org/10.1115/AJTEC2011-44631

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Topics: Fluid dynamics, Microchannels, Friction, Reynolds number, Cavities, Chemical etching, Crystals, Flow (Dynamics), Fluids, Geometry

Proceedings Papers

Non-Orthogonal Transformation of Irregular Geometry for Particle Based Simulation

Anurag Kumar, Eiyad Abu-Nada, Toru Yamada, Yutako Asako, Mohammad Faghri

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 857-869, August 8–13, 2010

Paper No: IHTC14-22476

DOI: https://doi.org/10.1115/IHTC14-22476

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Topics: Geometry, Nozzles, Particle dynamics, Particulate matter, Simulation

Proceedings Papers

Multi-Scale Particle Simulation of Red Blood Cell in Microcirculation

Anurag Kumar, Toru Yamada, Mohammad Faghri

Proc. ASME. ICNMM2010, ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels: Parts A and B, 65-72, August 1–5, 2010

Paper No: FEDSM-ICNMM2010-31080

DOI: https://doi.org/10.1115/FEDSM-ICNMM2010-31080

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Topics: Erythrocytes, Particle dynamics, Particulate matter, Simulation

Proceedings Papers

Measurement of Burst Pressure of Capillary Burst Valve

Hong Chen, Toru Yamada, Mohammad Faghri

Proc. ASME. ICNMM2010, ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels: Parts A and B, 1167-1172, August 1–5, 2010

Paper No: FEDSM-ICNMM2010-30954

DOI: https://doi.org/10.1115/FEDSM-ICNMM2010-30954

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Topics: Pressure, Valves, Fluids, Surface tension, Microchannels, Capillarity, Diaphragms (Mechanical devices), Diaphragms (Structural)

Proceedings Papers

High Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures Considering Line Patterns of Multilayered Circuit Boards

Yutaka Kumano, Tetsuyoshi Ogura, Toru Yamada

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 631-636, July 8–12, 2007

Paper No: IPACK2007-33372

DOI: https://doi.org/10.1115/IPACK2007-33372

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Topics: Junctions, Printed circuit boards, Semiconductors (Materials), Temperature, Thermal analysis, Thermofluids, Anisotropy, Computer-aided design, Lumber, Modeling

Journal Articles

High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules

Yutaka Kumano, Tetsuyoshi Ogura, Toru Yamada

J. Electron. Packag. June 2009, 131(2): 021007.

DOI: https://doi.org/10.1115/1.3103947

Published Online: April 2, 2009

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Topics: Computational fluid dynamics, Junctions, Semiconductors (Materials), Temperature, Thermal conductivity, Modeling, Thermal analysis, Anisotropy

Journal citation

NARROW

Modeling of a Non-Periodic Boundary Condition With Entrance and Exit in Dissipative Particle Dynamics

Liquid Characteristics Under Melting/Solidification Conditions Using Energy Conserving Dissipative Particle Dynamics

Under-Expanded Gaseous Flow at a Straight Micro-Tube Exit

Numerical Study on the Diffusive-Ballistic Heat Transport in a Two-Dimensional Square Plate

Diffusive-Ballistic Heat Transport in a Two-Dimensional Square Plate Using Energy Conserving Dissipative Particle Dynamics

Under-Expanded Gas Flow at a Straight Mini-Tube Exit

Effect of the Surface Tension of Liquid-Solid Interface on Liquid Flow in Parallel-Plate Sub-Micron Channels Using Multi-Body Dissipative Particle Dynamics

Diffusive-Ballistic Heat Transport in Thin Films Using Energy Conserving Dissipative Particle Dynamics

Simulations of Forced Convection Heat Transfer of Nanofluids in Parallel-Plate Microchannels Using Dissipative Particle Dynamics

Simulation of Thermal Conductivity of Nanofluids Using Dissipative Particle Dynamics

Forced Convection Heat Transfer Simulation Using Dissipative Particle Dynamics With Energy Conservation

Experimental Investigations of Laminar, Transitional to Turbulent Gas Flow in Rib-Patterned Micro-Channels

Three Dimensional Simulation of Dynamics and Deformation of Red Blood Cells in Capillary Flow

Experimental Investigations of Laminar, Transitional to Turbulent Gas Flow in a Micro-Channel

Fluid Flow Characteristics in Microchannels With Rib-Patterned Surface

Non-Orthogonal Transformation of Irregular Geometry for Particle Based Simulation

Multi-Scale Particle Simulation of Red Blood Cell in Microcirculation

Measurement of Burst Pressure of Capillary Burst Valve

High Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures Considering Line Patterns of Multilayered Circuit Boards

High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules

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