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Journal Articles

Special Section on InterPACK 2015

Satish Chaparala, Ashish Gupta, Mehdi Asheghi, Jeffrey Suhling, Toru Ikeda, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. March 2016, 138(1): 010201.
Paper No: EP-16-1019
https://doi.org/10.1115/1.4032748
Published Online: March 10, 2016
View Article titled, Special Section on InterPACK 2015
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Topics: Packaging, Thermal analysis, Electronic packaging, Electronics, Microchannels, Fluids, Printed circuit boards
Proceedings Papers

Warpage Hysteresis Estimation of an Electronic Package During a Thermal Cycle

Toru Ikeda, Akiko Ozaki, Takuya Hatao, Noriyuki Miyazaki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48168
https://doi.org/10.1115/IPACK2015-48168
View Paper titled, Warpage Hysteresis Estimation of an Electronic Package During a Thermal Cycle
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Topics: Cycles, Electronic packages, Warping, Heating, Package on package, Reliability, Resins, Elastic moduli, Hardening (Curing), Relaxation (Physics)
Proceedings Papers

Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM

Toru Ikeda, Masatoshi Oka, Noriyuki Miyazaki
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73126
https://doi.org/10.1115/IPACK2013-73126
View Paper titled, Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM
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Topics: Finite element methods, Reliability, Temperature, Finite element analysis, Resins, Electronic packages, Hardening (Curing), Heat, Integrated circuits, Materials properties
Proceedings Papers

Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density

Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73248
https://doi.org/10.1115/IPACK2013-73248
View Paper titled, Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density
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Topics: Density, Simulation, Stress, Diffusion (Physics), Computer simulation, Electron mobility, Electrons, Heat conduction, Momentum, MOSFET transistors
Journal Articles

Hygromechanical Analysis of Liquid Crystal Display Panels

Toru Ikeda, Tomonori Mizutani, Kiyoshi Miyake, Noriyuki Miyazaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041005.
Paper No: EP-10-1084
https://doi.org/10.1115/1.4025527
Published Online: November 5, 2013
View Article titled, Hygromechanical Analysis of Liquid Crystal Display Panels
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Topics: Diffusion (Physics), Liquid crystals, Polarizers (Light), Temperature, Thermomechanics, Warping, Gas laws (Thermodynamics), Materials properties
Proceedings Papers

Stress Intensity Factor Analysis of an Interfacial Corner Between Piezoelectric Bimaterials in a Two Dimensional Structure Using the H -Integral Method

Toru Ikeda, Hiroshi Hirai, Mitsutoshi Abe, Masatsugu Chiba, Noriyuki Miyazaki
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 463-471, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52073
https://doi.org/10.1115/IPACK2011-52073
View Paper titled, Stress Intensity Factor Analysis of an Interfacial Corner Between Piezoelectric Bimaterials in a Two Dimensional Structure Using the H -Integral Method
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Topics: Corners (Structural elements), Stress, Anisotropy, Piezoelectric materials, Eigenvalues, Electronic packages, Finite element methods, Microelectromechanical systems, Eigenfunctions, Failure
Proceedings Papers

Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors

Masaaki Koganemaru, Keisuke Yoshida, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 479-486, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52150
https://doi.org/10.1115/IPACK2011-52150
View Paper titled, Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors
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Topics: Metal oxide semiconductors, Stress, Transistors, Simulation, Electron mobility, Computer simulation, Diffusion (Physics), Electrons, Flow (Dynamics), Gates (Closures)
Proceedings Papers

Device Simulation of Mechanical Stress Effects on Electrical Characteristics of nMOSFETs: Impact of Local Stress in nMOSFETs

Masaaki Koganemaru, Keisuke Yoshida, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 119-124, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89112
https://doi.org/10.1115/InterPACK2009-89112
View Paper titled, Device Simulation of Mechanical Stress Effects on Electrical Characteristics of nMOSFETs: Impact of Local Stress in nMOSFETs
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Topics: Simulation, Stress, Stress concentration, Physics, Diffusion (Physics), Semiconductor devices, Simulation models, Computer simulation, Electron mobility, Gates (Closures)
Proceedings Papers

Hygro-Mechanical Analysis of LCD Panels

Toru Ikeda, Tomonori Mizutani, Noriyuki Miyazaki
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 815-824, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89267
https://doi.org/10.1115/InterPACK2009-89267
View Paper titled, Hygro-Mechanical Analysis of LCD Panels
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Topics: Adhesives, Boundary layers, Deformation, Diffusion (Physics), Finite element methods, Gas laws (Thermodynamics), Glass, Liquid crystals, Manufacturing, Plates (structures)
Journal Articles

Evaluation of Stress Effects on Electrical Characteristics of N-Type MOSFETs: Variations of DC Characteristics During the Resin-Molding Process

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011003.
https://doi.org/10.1115/1.4000718
Published Online: March 4, 2010
View Article titled, Evaluation of Stress Effects on Electrical Characteristics of N-Type MOSFETs: Variations of DC Characteristics During the Resin-Molding Process
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Topics: Electron mobility, Molding, Resins, Stress, Silicon
Proceedings Papers

Stress-Induced Effects in Electronic Characteristics of n-Type MOSFETs in Resin-Molded Packages

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 277-284, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33533
https://doi.org/10.1115/IPACK2007-33533
View Paper titled, Stress-Induced Effects in Electronic Characteristics of n-Type MOSFETs in Resin-Molded Packages
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Topics: Resins, Stress, Electron mobility, Molding, Diffusion (Physics), Experimental analysis, Silicon chips, Simulation
Proceedings Papers

Thermo-Mechanical and Hygro-Mechanical Stress Analyses of an Organic Multilayer Sheet

Toru Ikeda, Tomonori Mizutani, Noriyuki Miyazaki
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 465-472, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33212
https://doi.org/10.1115/IPACK2007-33212
View Paper titled, Thermo-Mechanical and Hygro-Mechanical Stress Analyses of an Organic Multilayer Sheet
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Topics: Stress analysis (Engineering), Thermomechanics, Finite element methods, Polarizers (Light), Liquid crystals, Warping, Diffusion (Physics), Leakage, Stress, Thermal stresses
Proceedings Papers

Experimental and Numerical Evaluation of Residual Stress in IC Chips

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1129-1134, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73110
https://doi.org/10.1115/IPACK2005-73110
View Paper titled, Experimental and Numerical Evaluation of Residual Stress in IC Chips
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Topics: Stress, Electronic packages, Finite element methods, Resins, Semiconductors (Materials), Temperature, Elastic analysis, Failure, Gages, Numerical analysis
Proceedings Papers

Predicting Technique of Delamination at Adhesively Bonding Joints in a Flip Chip Package During Solder Reflow Process

Toru Ikeda, Won-Keun Kim, Noriyuki Miyazaki
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1167-1175, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73153
https://doi.org/10.1115/IPACK2005-73153
View Paper titled, Predicting Technique of Delamination at Adhesively Bonding Joints in a Flip Chip Package During Solder Reflow Process
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Topics: Bonding, Delamination, Flip-chip packages, Reflow soldering, Flip-chip, Flip-chip devices, Reliability, Fracture (Materials), Solder joints, Stress
Proceedings Papers

Stress Intensity Factor Analyses of Interface Cracks Between Anisotropic Media in Electronic Packages

Toru Ikeda, Koh Yamanaga, Noriyuki Miyazaki
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 791-798, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35146
https://doi.org/10.1115/IPACK2003-35146
View Paper titled, Stress Intensity Factor Analyses of Interface Cracks Between Anisotropic Media in Electronic Packages
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Topics: Anisotropy, Electronic packages, Fracture (Materials), Stress, Delamination, Finite element methods, Numerical analysis, Plane strain, Composite materials, Crystals
Proceedings Papers

Reliability Evaluation of Flip Chip Using Stress Intensity Factors of an Interface Crack

Won-Keun Kim, Toru Ikeda, Noriyuki Miyazaki
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 741-747, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35093
https://doi.org/10.1115/IPACK2003-35093
View Paper titled, Reliability Evaluation of Flip Chip Using Stress Intensity Factors of an Interface Crack
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Topics: Flip-chip, Flip-chip devices, Fracture (Materials), Reliability, Stress, Electronic packages, Packaging, Adhesives, Anisotropy, Delamination
Journal Articles

Effect of Bond Thickness on the Fracture Toughness of Adhesive Joints

Deok-Bo Lee, Toru Ikeda, Noriyuki Miyazaki, Nak-Sam Choi
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2004, 126(1): 14–18.
https://doi.org/10.1115/1.1631433
Published Online: January 22, 2004
View Article titled, Effect of Bond Thickness on the Fracture Toughness of Adhesive Joints
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Topics: Adhesive joints, Adhesives, Fracture (Materials), Fracture toughness, Rubber, Damage, Epoxy resins, Stress, Particulate matter
Journal Articles

Estimation of Steady-State Creep Behavior of Al 2 O 3 / YAG Eutectic Composite by Image-Based Finite Element Analysis

Noriyuki Miyazaki, Toru Ikeda, Toshihiro Komura
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. July 2003, 125(3): 277–282.
https://doi.org/10.1115/1.1555657
Published Online: July 10, 2003
View Article titled, Estimation of Steady-State Creep Behavior of Al 2 O 3 / YAG Eutectic Composite by Image-Based Finite Element Analysis
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Topics: Composite materials, Creep, Crystals, Finite element analysis, Steady state, Constitutive equations
Journal Articles

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

Toru Ikeda, Isao Arase, Yuya Ueno, Noriyuki Miyazaki, Nobutaka Ito, Mami Nagatake, Mitsuru Sato
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 31–38.
https://doi.org/10.1115/1.1525244
Published Online: March 14, 2003
View Article titled, Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch
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Topics: Absorption, Corners (Structural elements), Fracture (Materials), Molding resins, Reflow soldering, Stress, Vapor pressure, Diffusion (Physics), Finite element methods
Journal Articles

Damage Zone Around Tip of an Interface Crack Between Rubber-Modified Epoxy Resin and Aluminum

Deok-Bo Lee, Toru Ikeda, Noriyuki Miyazaki, Nak-Sam Choi
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. April 2002, 124(2): 206–214.
https://doi.org/10.1115/1.1417980
Published Online: March 26, 2002
View Article titled, Damage Zone Around Tip of an Interface Crack Between Rubber-Modified Epoxy Resin and Aluminum
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Topics: Aluminum, Epoxy resins, Fracture (Materials), Rubber, Stress, Damage, Particulate matter