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Tanaphan Sataphan
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Proceedings Papers
Randeep Singh, Aliakbar Akbarzadeh, Mastaka Mochizuki, Yuji Saito, Thang Nguyen, Bob Kao, Tanaphan Sataphan, Eiji Takenaka, Vijit Wuttijumnong
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 409-414, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73278