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Takehiro Abo
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Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 487-491, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52169
Proceedings Papers
Numerical Simulation of Threshold Current Density of Electromigration Damage in Cu Interconnect Tree
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 119-124, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89229