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Takashi Kawakami
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Proceedings Papers

Stress-Based Design Standard for 3216 Type of Multilayer Ceramic Capacitor

Takahiro Kinoshita, Takashi Kawakami, Tadaharu Adachi, Masahiro Funaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74099
https://doi.org/10.1115/IPACK2017-74099
View Paper titled, Stress-Based Design Standard for 3216 Type of Multilayer Ceramic Capacitor
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Topics: Capacitors, Ceramics, Design, Stress, Finite element methods, Computer simulation, Pressure
Proceedings Papers

A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life

Takashi Kawakami, Takahiro Kinoshita, Hirokazu Oriyama
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48136
https://doi.org/10.1115/IPACK2015-48136
View Paper titled, A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life
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Topics: Lead-free solders, Low cycle fatigue, Stress, Simulation, Design engineering, Fatigue cracks, Fatigue life, Fatigue testing, Shapes, Solder joints
Proceedings Papers

A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material

Hirokazu Oriyama, Takashi Kawakami, Takahiro Kinoshita
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48138
https://doi.org/10.1115/IPACK2015-48138
View Paper titled, A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material
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Topics: Creep, Damage, Fatigue, Lead-free solders, Tin, Solder joints, Electronics, Design engineering, Fatigue damage, Stress
Proceedings Papers

Thermal Stress Simulation for 3D SiP With TSV Structure Under Unsteady Thermal Loads

Takahiro Kinoshita, Takashi Kawakami, Tomoya Sugiura, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A020, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48142
https://doi.org/10.1115/IPACK2015-48142
View Paper titled, Thermal Stress Simulation for 3D SiP With TSV Structure Under Unsteady Thermal Loads
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Topics: Simulation, Stress, Thermal stresses, Finite element methods, Heat, Temperature, Cooling, Damage, Packaging, Reliability
Proceedings Papers

Feasibility Study on Honeycomb Ceramics for Catalytic Combustor

Takashi Kawakami, Tomiaki Furuya, Yukio Sasaki, Toshiyuki Yoshine, Yutaka Furuse, Mitsunobu Hoshino
Proc. ASME. GT1989, Volume 2: Aircraft Engine; Marine; Microturbines and Small Turbomachinery, V002T04A001, June 4–8, 1989
Publisher: American Society of Mechanical Engineers
Paper No: 89-GT-41
https://doi.org/10.1115/89-GT-41
View Paper titled, Feasibility Study on Honeycomb Ceramics for Catalytic Combustor
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Topics: Ceramics, Combustion chambers, Honeycomb structures, Catalysts, Combustion, Gas turbines, High temperature, Stress, Exhaust systems, Finite element methods
Proceedings Papers

Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP

Takahiro Kinoshita, Takashi Kawakami, Takeshi Wakamatsu, Shunpei Shima, Keiji Matsumoto, Sayuri Kohara, Fumiaki Yamada, Yasumitsu Orii
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A009, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73151
https://doi.org/10.1115/IPACK2013-73151
View Paper titled, Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP
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Topics: Silicon chips, Simulation, Thermal stresses, Stress, Bending strength, Copper, Finite element methods, Yield stress, Brittleness, Elevations (Drawings)
Proceedings Papers

A Study on Impact Stresses in Ceramic Capacitors

Takashi Kawakami, Noriyo Horikawa, Takahiro Kinoshita, Tomohiro Inagaki
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73191
https://doi.org/10.1115/IPACK2013-73191
View Paper titled, A Study on Impact Stresses in Ceramic Capacitors
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Topics: Capacitors, Ceramics, Stress, Design engineering, Fracture (Materials), Impact testing, Machinery, Manufacturing, Printed circuit boards
Journal Articles

Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package

Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020903.
https://doi.org/10.1115/1.4006515
Published Online: June 11, 2012
View Article titled, Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package
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Topics: Finite element methods, Silicon, Silicon chips, Simulation, Stress, System-in-package, Thermal stresses, Temperature, Stress concentration
Proceedings Papers

Thermal Stress of Through Silicon Vias and Si Chips in 3D SiP

Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 325-328, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52241
https://doi.org/10.1115/IPACK2011-52241
View Paper titled, Thermal Stress of Through Silicon Vias and Si Chips in 3D SiP
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Topics: Silicon, Silicon chips, Thermal stresses, Stress, Copper, Crystals, Damage, Reliability, Yield stress, Cycles
Proceedings Papers

Large-Scale Stress Analyses for Fatigue Reliability at Die-Mount Solder of Plastic IC Packages

Tetsuya Kugimiya, Kenji Hirohata, Minoru Mukai, Eitaro Miyake, Hiroshi Akiba, Nobutada Ohno, Takashi Kawakami
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 185-190, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89384
https://doi.org/10.1115/InterPACK2009-89384
View Paper titled, Large-Scale Stress Analyses for Fatigue Reliability at Die-Mount Solder of Plastic IC Packages
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Topics: Fatigue, Reliability, Solders, Stress analysis (Engineering), Finite element analysis, Deformation, Metals, Molding materials, Absorption, Constitutive equations
Proceedings Papers

Damage Path Simulation of Solder Joints in QFP

Minoru Mukai, Kenji Hirohata, Hiroyuki Takahashi, Takashi Kawakami, Kuniaki Takahashi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1215-1221, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73297
https://doi.org/10.1115/IPACK2005-73297
View Paper titled, Damage Path Simulation of Solder Joints in QFP
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Topics: Damage, Simulation, Solder joints, Crack propagation, Electronic packages, Solders, Design, Fatigue cracks, Fracture (Materials), Cycles
eBook Chapter

Smart Control for Collective Agents by Adaptive Strategic Mechanism

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2008
ISBN-10: 0791802823
ISBN: 9780791802823
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Topics: Multi-agent systems, Robotics, Robots
Proceedings Papers

Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design

Kenji Hirohata, Katsumi Hisano, Takashi Kawakami, Hideo Aoki, Chiaki Takubo, Kuniaki Takahashi, Michael G. Pecht
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 289-303, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13800
https://doi.org/10.1115/IMECE2006-13800
View Paper titled, Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design
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Topics: Ball-Grid-Array packaging, Design, Packaging, Reliability, Thermal stresses, Thermal resistance, Cooling, Deformation, Flat heat pipes, Electronic packaging
Journal Articles

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Noriyasu Kawamura, Takashi Kawakami, Kikuo Kishimoto, Masaki Omiya, Toshikazu Shibuya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 323–327.
https://doi.org/10.1115/1.1501304
Published Online: December 12, 2002
View Article titled, Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin
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Topics: Fracture (Materials), Fracture (Process), Fracture toughness, Resins, Semiconductors (Materials), Stress, Temperature, Stress concentration, Finite element analysis, Delamination
Journal Articles

Field Study on Pump Vibration and ISO’s New Criteria

Toshiyuki Osada, Takashi Kawakami, Tadashi Yokoi, Yoshinobu Tsujimoto
Journal: Journal of Fluids Engineering
Publisher: ASME
Article Type: Research Papers
J. Fluids Eng. December 1999, 121(4): 798–803.
https://doi.org/10.1115/1.2823539
Published Online: December 1, 1999
View Article titled, Field Study on Pump Vibration and ISO’s New Criteria
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Topics: Pumps, Vibration, Bearings, International Organization for Standardization, Machinery
Journal Articles

Unbalanced Hydraulic Forces Caused by Geometrical Manufacturing Deviations of Centrifugal Impellers

Yoshiki Yoshida, Yoshinobu Tsujimoto, Takashi Kawakami, Toru Sakatani
Journal: Journal of Fluids Engineering
Publisher: ASME
Article Type: Research Papers
J. Fluids Eng. September 1998, 120(3): 531–537.
https://doi.org/10.1115/1.2820695
Published Online: September 1, 1998
View Article titled, Unbalanced Hydraulic Forces Caused by Geometrical Manufacturing Deviations of Centrifugal Impellers
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Topics: Impellers, Manufacturing, Flow (Dynamics), Vibration, Pumps, Inviscid flow, Pump impellers, Rotor vibration, Rotors