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Proceedings Papers

Data Center Cooling Efficiency Improvement Through Localized and Optimized Cooling Resources Delivery

Rongliang Zhou, Cullen Bash, Zhikui Wang, Alan McReynolds, Thomas Christian, Tahir Cader
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1789-1796, November 9–15, 2012
Paper No: IMECE2012-88817
DOI: https://doi.org/10.1115/IMECE2012-88817
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Topics: Cooling, Data centers, Air flow, Tiles, Vents, Optimization, Computers, Heat, Steady state, Air conditioning
Proceedings Papers

Failure Resistant Data Center Cooling Control Through Model-Based Thermal Zone Mapping

Rongliang Zhou, Zhikui Wang, Cullen E. Bash, Tahir Cader, Alan McReynolds
Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 751-757, July 8–12, 2012
Paper No: HT2012-58403
DOI: https://doi.org/10.1115/HT2012-58403
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Topics: Cooling, Data centers, Failure, Control equipment, Cooling systems, Redundancy (Engineering), Design, Maintenance, Air conditioning, Computers
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041009.
DOI: https://doi.org/10.1115/1.4007744
Published Online: November 26, 2012
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Topics: Cooling, Data centers, Heat sinks, Leakage, Temperature, Energy consumption, Heat
Proceedings Papers

On the Need for Energy Efficiency Metrics That Span Integrated IT-Facility Infrastructures

Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader, Thomas J. Breen, Ed J. Walsh, Jeff Punch
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 541-551, July 6–8, 2011
Paper No: IPACK2011-52140
DOI: https://doi.org/10.1115/IPACK2011-52140
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Topics: Energy efficiency, Data centers, Energy consumption, Traction
Proceedings Papers

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and its Impact on Cooling Infrastructure Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 433-442, July 6–8, 2011
Paper No: IPACK2011-52030
DOI: https://doi.org/10.1115/IPACK2011-52030
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Topics: Cooling, Cooling towers, Data centers, Energy efficiency, Leakage, Modeling, Operating temperature, Energy consumption, Heat, Accounting
Proceedings Papers

Operational Benefits of Real-Time Monitoring and Visualization in Data Centers

Tahir Cader, Ratnesh Sharma, Cullen Bash, Les Fox, Vaibhav Bhatia, Mohandas Mekanapurath
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1033-1046, July 19–23, 2009
Paper No: InterPACK2009-89379
DOI: https://doi.org/10.1115/InterPACK2009-89379
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Topics: Data centers, Visualization, Computers, Energy consumption, Environmental Protection Agency, Sensors, Air flow, Cloud computing, Computer software, Cooling systems
Proceedings Papers

Technologies for the Energy-Efficient Data Center

Tahir Cader, Levi Westra, Andres Marquez
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 791-802, July 8–12, 2007
Paper No: IPACK2007-33463
DOI: https://doi.org/10.1115/IPACK2007-33463
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Topics: Data centers, Computational fluid dynamics, Cooling, Boundary-value problems, Energy consumption, Optimization, Pacific Ocean, Semiconductors (Materials)
Proceedings Papers

SprayCool™ Thermal Management for Dense Stacked Memory

Tahir Cader, Ben Tollman, Cai Kabrell, Sridhar Krishnan
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 541-548, November 5–11, 2005
Paper No: IMECE2005-81692
DOI: https://doi.org/10.1115/IMECE2005-81692
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Topics: Computational fluid dynamics, Density, Design, Engineering simulation, Evaporative cooling, Failure, Fluids, Heat transfer coefficients, Junctions, Plasma spraying