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Sreekant Narumanchi
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Journal Articles
Accepted Manuscript
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-21-1052
Published Online: November 25, 2021
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011004.
Paper No: EP-20-1093
Published Online: August 6, 2021
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 27–29, 2020
Paper No: IPACK2020-2524
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 27–29, 2020
Paper No: IPACK2020-2550
Journal Articles
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A017, October 7–9, 2019
Paper No: IPACK2019-6453
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 7–9, 2019
Paper No: IPACK2019-6457
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041001.
Paper No: EP-18-1031
Published Online: May 8, 2019
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 27–30, 2018
Paper No: IPACK2018-8276
Journal Articles
Journal Articles
Article Type: Guest Editorial
J. Electron. Packag. March 2018, 140(1): 010301.
Paper No: EP-18-1005
Published Online: March 2, 2018
Proceedings Papers

Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T11A011, July 9–12, 2017
Paper No: HT2017-4710
Journal Articles
Article Type: Review Articles
J. Electron. Packag. December 2015, 137(4): 040803.
Paper No: EP-15-1063
Published Online: October 9, 2015
Journal Articles
Article Type: Research-Article
J. Heat Transfer. October 2014, 136(10): 101502.
Paper No: HT-13-1510
Published Online: July 22, 2014
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A004, July 16–18, 2013
Paper No: IPACK2013-73143
Proceedings Papers

Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T07A014, July 14–19, 2013
Paper No: HT2013-17126
Journal Articles
Article Type: Research-Article
J. Heat Transfer. November 2013, 135(11): 111014.
Paper No: HT-12-1330
Published Online: September 23, 2013
Journal Articles
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2013, 5(3): 031004.
Paper No: TSEA-12-1033
Published Online: June 24, 2013
Proceedings Papers

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 397-404, November 11–17, 2011
Paper No: IMECE2011-65409
Proceedings Papers

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 577-587, November 11–17, 2011
Paper No: IMECE2011-64002