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Proceedings Papers

Thermal Behavior Study of Power Plastic Package by High Temperature Moire Interferometry and FEA Modeling

Jiansen Zhu, Daqing Zou, Sheng Liu, Jim Benson
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 141-148, November 17–22, 1996
Paper No: IMECE1996-0728
https://doi.org/10.1115/IMECE1996-0728
View Paper titled, Thermal Behavior Study of Power Plastic Package by High Temperature Moire Interferometry and FEA Modeling
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Topics: Finite element analysis, High temperature, Interferometry, Modeling, Cooling, Finite element model, Cross section (Physics), Delamination, Diffraction gratings, Temperature
Proceedings Papers

A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials

Minfu Lu, Sheng Liu
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 87-92, November 17–22, 1996
Paper No: IMECE1996-0894
https://doi.org/10.1115/IMECE1996-0894
View Paper titled, A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials
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Topics: Electronic packaging, Fatigue, Thermomechanics, Alloys, Calibration, Copper, Lead-free solders, Machinery, Testing, Wire
Proceedings Papers

Study on Reverse Heat Transfer Phenomenon of Steam Generator in Station Blackout Accident

Yu-sheng Liu, Shao-xin Zhuang, Chao Xu, Jian-ping Jing, Si-chao Tan
Proc. ASME. ICONE29, Volume 7A: Thermal-Hydraulics and Safety Analysis, V07AT07A078, August 8–12, 2022
Paper No: ICONE29-92316
https://doi.org/10.1115/ICONE29-92316
View Paper titled, Study on Reverse Heat Transfer Phenomenon of Steam Generator in Station Blackout Accident
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Topics: Accidents, Boilers, Cooling, Heat transfer
Proceedings Papers

Modeling and Analysis of Uncertain Static Contact Characteristics for Revolute Clearance Joints

Sheng Liu, Haidong Yu, Bin Gu, Yong Zhao
Proc. ASME. IDETC-CIE2022, Volume 9: 18th International Conference on Multibody Systems, Nonlinear Dynamics, and Control (MSNDC), V009T09A002, August 14–17, 2022
Paper No: DETC2022-88965
https://doi.org/10.1115/DETC2022-88965
View Paper titled, Modeling and Analysis of Uncertain Static Contact Characteristics for Revolute Clearance Joints
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Topics: Clearances (Engineering), Modeling, Uncertainty
Proceedings Papers

Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip

Toshinori Mimura, Sheng Liu, Haruhiko Asada
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 219-225, November 16–21, 1997
Paper No: IMECE1997-0821
https://doi.org/10.1115/IMECE1997-0821
View Paper titled, Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip
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Topics: Printing, Solders, Flow (Dynamics), Printed circuit boards, Temperature, Visualization
Proceedings Papers

Sequential Processing Mechanics Modeling for a Model IC Package

Jianjun Wang, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 401-410, November 16–21, 1997
Paper No: IMECE1997-1117
https://doi.org/10.1115/IMECE1997-1117
View Paper titled, Sequential Processing Mechanics Modeling for a Model IC Package
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Topics: Modeling, Stress, Manufacturing, Solders, Temperature, Finite element analysis, Finite element methods, Finite element model, Silicon chips, Bonding
Proceedings Papers

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Jianjun Wang, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 411-421, November 16–21, 1997
Paper No: IMECE1997-1118
https://doi.org/10.1115/IMECE1997-1118
View Paper titled, Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions
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Topics: Fracture toughness, Fracture (Materials), Temperature, Stress, Displacement, Finite element analysis, Interferometry, Molding, Silicon, Density
Proceedings Papers

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

Zhengfang Qian, Minfu Lu, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 377-382, November 16–21, 1997
Paper No: IMECE1997-1113
https://doi.org/10.1115/IMECE1997-1113
View Paper titled, Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity
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Topics: Modeling, Polymer films, Viscoelasticity, Viscoplasticity, Deformation, Stress, Chain, Constitutive equations, Drag (Fluid dynamics), Temperature effects
Proceedings Papers

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Jiansen Zhu, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 361-368, November 16–21, 1997
Paper No: IMECE1997-1111
https://doi.org/10.1115/IMECE1997-1111
View Paper titled, Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package
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Topics: Simulation, Thermal deformation, Temperature, Finite element analysis, Interferometry, Diffraction patterns, Electronic packaging, Packaging, Reliability, Diffraction gratings
Proceedings Papers

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Xiaoyuan He, Daqing Zou, Sheng Liu, Yifan Guo
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 97-103, November 16–21, 1997
Paper No: IMECE1997-1233
https://doi.org/10.1115/IMECE1997-1233
View Paper titled, A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry
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Topics: Interferometry, Displacement, Computer software, Phase diagrams, Computer programming, Deformation, Diffraction gratings, Electronic packages, Flip-chip
Proceedings Papers

Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester

Zhengfang Qian, Minfu Lu, Jianjun Wang, Sheng Liu
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 105-112, November 16–21, 1997
Paper No: IMECE1997-1234
https://doi.org/10.1115/IMECE1997-1234
View Paper titled, Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester
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Topics: Modeling, Polymer films, Testing, Thermomechanics, Nylon film
Proceedings Papers

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Daqing Zou, Xiaoyuan He, Sheng Liu, Yifan Guo, Fulong Dai
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 69-76, November 16–21, 1997
Paper No: IMECE1997-1229
https://doi.org/10.1115/IMECE1997-1229
View Paper titled, Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry
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Topics: Corners (Structural elements), Deformation, Interferometry, Computer software, Electronic packaging, Failure, Flip-chip, Flip-chip packages, Image processing, Nanoscale phenomena
Proceedings Papers

Thermal Mechanical Properties of Two Solder Alloys

Wei Ren, Zhengfang Qian, Minfu Lu, Sheng Liu, Dongkai Shangguan
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 125-130, November 16–21, 1997
Paper No: IMECE1997-1237
https://doi.org/10.1115/IMECE1997-1237
View Paper titled, Thermal Mechanical Properties of Two Solder Alloys
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Topics: Alloys, Mechanical properties, Solders, Fatigue, Lead-free solders, Computers, Creep, Electronic packaging, Strips, Testing
Proceedings Papers

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Daqing Zou, Jianjun Wang, Minfu Lu, Sheng Liu
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 51-57, November 16–21, 1997
Paper No: IMECE1997-1227
https://doi.org/10.1115/IMECE1997-1227
View Paper titled, Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling
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Topics: Creep, Finite element methods, Finite element model, Interferometry, Modeling, Epoxy adhesives, Epoxy resins, Molding, Constitutive equations, Deformation
Proceedings Papers

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

Jianjun Wang, Minfu Lu, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 103-113, November 16–21, 1997
Paper No: IMECE1997-0505
https://doi.org/10.1115/IMECE1997-0505
View Paper titled, Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load
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Topics: Flip-chip packages, Fracture (Materials), Stress, Crack propagation, Fracture toughness, Silicon chips, Deflection, Displacement, Interferometry, Density
Proceedings Papers

A Singular Perturbation Approach for Modeling Differential-Algebraic Systems

Brandon W. Gordon, Sheng Liu, Haruhiko Asada
Proc. ASME. IMECE98, Dynamic Systems and Control, 31-35, November 15–20, 1998
Paper No: IMECE1998-0230
https://doi.org/10.1115/IMECE1998-0230
View Paper titled, A Singular Perturbation Approach for Modeling Differential-Algebraic Systems
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Topics: Algebra, Modeling, Approximation, Control systems, Dynamic systems, Dynamics (Mechanics), Heat exchangers, Simulation, Two-phase flow
Proceedings Papers

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 59-64, November 15–20, 1998
Paper No: IMECE1998-0429
https://doi.org/10.1115/IMECE1998-0429
View Paper titled, Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages
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Topics: Circuits, Control equipment, Corners (Structural elements), Deformation, Density, Displacement, Electronic packages, Flip-chip, Flip-chip packages, Interferometers
Proceedings Papers

On the Life Prediction and Accelerated Testing of Solder Joints

Zhengfang Qian, Sheng Liu
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 1-11, November 15–20, 1998
Paper No: IMECE1998-0422
https://doi.org/10.1115/IMECE1998-0422
View Paper titled, On the Life Prediction and Accelerated Testing of Solder Joints
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Topics: Solder joints, Testing, Fatigue life, Flip-chip packages, Constitutive equations, Finite element analysis, Finite element model, Modeling, Solders, Temperature
Proceedings Papers

Automatic Warpage Measurement of Advanced Packages by Optical Method

Xiaoyuan He, Jiabin Dai, Sheng Liu
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 65-70, November 15–20, 1998
Paper No: IMECE1998-0430
https://doi.org/10.1115/IMECE1998-0430
View Paper titled, Automatic Warpage Measurement of Advanced Packages by Optical Method
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Topics: Warping, Deformation, Ball-Grid-Array packaging, Shapes, Computer software, Diffraction gratings, Imaging, Manufacturing, Modeling, Packaging
Proceedings Papers

Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages

Jianjun Wang, Daqing Zou, Zhengfang Qian, Wei Ren, Sheng Liu
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 35-42, November 15–20, 1998
Paper No: IMECE1998-0426
https://doi.org/10.1115/IMECE1998-0426
View Paper titled, Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages
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Topics: Flip-chip packages, Manufacturing, Reliability, Solders, Simulation results, Finite element analysis, Finite element model, Interferometry, Warping, Contamination