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Proceedings Papers

Interface Toughness Evaluation With Specimens Fabricated by Focused Ion Beam for Micro Scale Devices and Packages

Nobuyuki Shishido, Satoru Matsumoto, Chuantong Chen, Hisashi Sato, Masaki Omiya, Shoji Kamiya, Masahiro Nishida, Takeshi Nokuo, Tadahiro Nagasawa, Takashi Suzuki, Tomoji Nakamura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 425-428, July 6–8, 2011
Paper No: IPACK2011-52270
https://doi.org/10.1115/IPACK2011-52270
View Paper titled, Interface Toughness Evaluation With Specimens Fabricated by Focused Ion Beam for Micro Scale Devices and Packages
Open the PDF for Interface Toughness Evaluation With Specimens Fabricated by Focused Ion Beam for Micro Scale Devices and Packages in another window
Topics: Electromagnetic scattering, Focused ion beams, Fracture toughness, Microscale devices, Resolution (Optics), Uncertainty, Vapors