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Journal Articles

Combined Effects of Nanofluid and Geometrical Structures of a Parallel Plate Channel With Semicircle Corrugations on Flow Characteristics and Thermal-Hydraulic Performance

Raheem K. Ajeel, Wan Saiful-Islam Wan Salim
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. August 2020, 12(4): 041025.
Paper No: TSEA-19-1260
https://doi.org/10.1115/1.4046823
Published Online: May 19, 2020
View Article titled, Combined Effects of Nanofluid and Geometrical Structures of a Parallel Plate Channel With Semicircle Corrugations on Flow Characteristics and Thermal-Hydraulic Performance
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Topics: Flow (Dynamics), Heat transfer, Nanofluids, Nanoparticles, Shear stress, Water, Fluids
Proceedings Papers

Analysis of Tube Expansion Using 3D Digital Image Correlation and Numerical Modeling

Fethi Abbassi, Furqan Ahmad, Ali Karrech, Md. Saiful Islam
Proc. ASME. IMECE2019, Volume 9: Mechanics of Solids, Structures, and Fluids, V009T11A052, November 11–14, 2019
Paper No: IMECE2019-10035
https://doi.org/10.1115/IMECE2019-10035
View Paper titled, Analysis of Tube Expansion Using 3D Digital Image Correlation and Numerical Modeling
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Topics: Computer simulation, Displacement, Finite element methods, Buckling, Friction, Geometry, Metalworking, Oil well completion, Petroleum industry, Stainless steel
Proceedings Papers

Wind Induced Nonlinear Response of Coupled Spar Platform

Mohammed Jameel, Suhail Ahmad, A. B. M. Saiful Islam, Mohd Zamin Jumaat
Proc. ASME. OMAE2014, Volume 8A: Ocean Engineering, V08AT06A061, June 8–13, 2014
Paper No: OMAE2014-23779
https://doi.org/10.1115/OMAE2014-23779
View Paper titled, Wind Induced Nonlinear Response of Coupled Spar Platform
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Topics: Spar platforms, Wind, Mooring, Pipeline risers, Risers (Casting), Wing spars, Hull, Water, Tension, Fluctuations (Physics)
Proceedings Papers

Assessment of Cycle Averaged Turbocharger Maps Through One Dimensional and Mean-Line Coupled Codes

Meng Soon Chiong, Srithar Rajoo, Aaron W. Costall, Wan Saiful-Islam Bin Wan Salim, Alessandro Romagnoli, Ricardo F. Martinez-Botas
Proc. ASME. GT2013, Volume 6C: Turbomachinery, V06CT40A026, June 3–7, 2013
Paper No: GT2013-95906
https://doi.org/10.1115/GT2013-95906
View Paper titled, Assessment of Cycle Averaged Turbocharger Maps Through One Dimensional and Mean-Line Coupled Codes
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Topics: Cycles, Turbochargers, Engines, Turbines, Emissions, Flow (Dynamics), Internal combustion engines, Modeling, Turbocharged engines, Carbon dioxide
Proceedings Papers

Nonlinear Response of Coupled Integrated Spar Platform Under Severe Sea States

A. B. M. Saiful Islam, Mohammed Jameel, Suhail Ahmad, Mohd Zamin Jumaat
Proc. ASME. OMAE2012, Volume 2: Structures, Safety and Reliability, 559-567, July 1–6, 2012
Paper No: OMAE2012-83862
https://doi.org/10.1115/OMAE2012-83862
View Paper titled, Nonlinear Response of Coupled Integrated Spar Platform Under Severe Sea States
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Topics: Seas, Spar platforms, Water
eBook Chapter

Energy Resources at Malaysian Sedimentary Basins and Spar Platform as Deep Sea Structure

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2011
ISBN: 9780791859810
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Topics: Energy resources, Seas, Spar platforms
Proceedings Papers

Measurement of Electronic Packaging Material Behavior and Flip Chip Die Stresses at Extreme Low Temperatures

M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, M. Saiful Islam, Hongtao Ma, Chang Lin, Pradeep Lall, Roy Knight, Mark Strickland, Jim Blanche
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1253-1262, July 17–22, 2005
Paper No: IPACK2005-73349
https://doi.org/10.1115/IPACK2005-73349
View Paper titled, Measurement of Electronic Packaging Material Behavior and Flip Chip Die Stresses at Extreme Low Temperatures
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Topics: Electronic packaging, Flip-chip, Flip-chip devices, Low temperature, Stress, Temperature, Finite element model, Flip-chip assemblies, Modeling, Packaging
Proceedings Papers

Measurement of the Constitutive Behavior of Underfill Encapsulants

M. Saiful Islam, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 923-931, July 6–11, 2003
Paper No: IPACK2003-35321
https://doi.org/10.1115/IPACK2003-35321
View Paper titled, Measurement of the Constitutive Behavior of Underfill Encapsulants
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Topics: Creep, Design engineering, Dimensions, Electronic packages, Flip-chip assemblies, Flow (Dynamics), Machinery, Materials properties, Mechanical testing, Microscale devices
Proceedings Papers

Impact of Environmental Preconditioning and Composition Parameters on Constitutive Behavior of Underfills

Saiful Islam, Pradeep Lall, Jeffrey C. Suhling, R. Wayne Johnson
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 27-40, November 15–21, 2003
Paper No: IMECE2003-42083
https://doi.org/10.1115/IMECE2003-42083
View Paper titled, Impact of Environmental Preconditioning and Composition Parameters on Constitutive Behavior of Underfills
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Topics: Creep, Damage, Fatigue, Fatigue life, Flip-chip, Flip-chip devices, Hardening (Curing), Laminates, Machinery, Mechanical testing
Proceedings Papers

Safety and Field Testing of a New Generation AC Module

Saiful Islam, Achim Woyte, Ronnie Belmans
Proc. ASME. IMECE2003, Energy Conversion and Resources: Fuels and Combustion Technology, Energy, Nuclear Engineering, and Solar Engineering, 223-232, November 15–21, 2003
Paper No: IMECE2003-55406
https://doi.org/10.1115/IMECE2003-55406
View Paper titled, Safety and Field Testing of a New Generation AC Module
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Topics: Safety, Testing, Engineering prototypes