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Robert Polastre
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Journal Articles
Mark Schultz, Fanghao Yang, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, Pritish Parida, John Knickerbocker, Timothy Chainer
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021005.
Paper No: EP-15-1084
Published Online: April 25, 2016
Proceedings Papers
Fanghao Yang, Mark Schultz, Pritish Parida, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, John Knickerbocker, Timothy Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48341
Proceedings Papers
Mark Schultz, Fanghao Yang, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, Pritish Parida, John Knickerbocker, Timothy Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48348