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Richard W. Bonner, III
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Proceedings Papers

Prototype Results for a Salt Hydrate PCM Thermal Energy Storage System

Sean H. Hoenig, Richard W. Bonner, III, Joshua M. Charles, Chien-Hua Chen, Fangyu Cao
Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T09A004, July 14–17, 2019
Paper No: HT2019-3403
DOI: https://doi.org/10.1115/HT2019-3403
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Topics: Engineering prototypes, Thermal energy storage, Condensers (steam plant), Cycles, Temperature, Cooling towers, Energy generation, Heat, Heat exchangers, Latent heat
Journal Articles

Dropwise Condensation on Superhydrophobic Microporous Wick Structures

Sean H. Hoenig, Richard W. Bonner, III
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. July 2018, 140(7): 071501.
Paper No: HT-17-1238
DOI: https://doi.org/10.1115/1.4038854
Published Online: April 6, 2018
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Topics: Condensation, Copper, Copper powders, Drops, Heat transfer, Heat transfer coefficients, Heat flux
Proceedings Papers

Dropwise Condensation Life Testing of Self Assembled Monolayers

Richard W. Bonner, III
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 2, 221-226, August 8–13, 2010
Paper No: IHTC14-22936
DOI: https://doi.org/10.1115/IHTC14-22936
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Topics: Condensation, Life testing, Self-assembly, Coatings, Electronics, Heat pipes, Computer cooling, Copper, Electronic packages, Flux (Metallurgy)
Proceedings Papers

Dropwise Condensation on Surfaces With Graded Hydrophobicity

Richard W. Bonner, III
Proc. ASME. HT2009, Volume 3: Combustion, Fire and Reacting Flow; Heat Transfer in Multiphase Systems; Heat Transfer in Transport Phenomena in Manufacturing and Materials Processing; Heat and Mass Transfer in Biotechnology; Low Temperature Heat Transfer; Environmental Heat Transfer; Heat Transfer Education; Visualization of Heat Transfer, 491-495, July 19–23, 2009
Paper No: HT2009-88516
DOI: https://doi.org/10.1115/HT2009-88516
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Topics: Condensation, Hydrophobicity, Drops, Gravity (Force), Aerospace industry, Film condensation, Floods, Heat transfer coefficients, Self-assembly, Surface energy
Proceedings Papers

Loop Thermosyphon Design for Cooling of Large Area, High Heat Flux Sources

John R. Hartenstine, Richard W. Bonner, III, Jared R. Montgomery, Tadej Semenic
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 715-722, July 8–12, 2007
Paper No: IPACK2007-33993
DOI: https://doi.org/10.1115/IPACK2007-33993
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Topics: Composite materials, Cooling, Copper, Design, Flow (Dynamics), Fluids, Flux (Metallurgy), Heat, Heat flux, Slabs