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1-8 of 8
Richard L. Williams
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Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 729-736, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89098
Journal Articles
Journal:
Journal of ASTM International
Publisher: ASTM International
Article Type: Research-Article
J. ASTM Int.. May 2010, 7(5): 1–15.
Published Online: May 1, 2010
Proceedings Papers
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 171-176, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-68891
Proceedings Papers
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 145-152, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-68099
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1493-1497, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73277
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1583-1586, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73046
Proceedings Papers
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 37-44, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80086
Proceedings Papers
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 45-50, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80093