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Journal Articles

Loop Heat Pipes for Thermal Management of Electric Vehicles

Randeep Singh, Tien Nguyen
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2022, 14(6): 061010.
Paper No: TSEA-21-1236
DOI: https://doi.org/10.1115/1.4052348
Published Online: October 13, 2021
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Topics: Cooling, Heat, Heat pipes, Design, Thermal management, Heat transfer, Electric vehicles, Stress
Journal Articles

Cooling Performance Evaluation of Synthetic Jet Based Thermal Solution Module

Ahmad Jalilvand, Masataka Mochizuki, Yuji Saito, Yoji Kawahara, Randeep Singh, Vijit Wuttijumnong
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2015, 7(3): 031010.
Paper No: TSEA-13-1143
DOI: https://doi.org/10.1115/1.4028342
Published Online: September 1, 2015
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Topics: Cooling, Flow (Dynamics), Heat, Heat pipes, Heat sinks, Temperature, Thermal resistance, Performance evaluation, Air jets, Air flow
Journal Articles

Air Impingement Cooling by Synthetic Jet

Ahmad Jalilvand, Masataka Mochizuki, Randeep Singh, Yuji Saito, Yoji Kawahara, Vijit Wuttijumnong
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2014, 6(3): 031008.
Paper No: TSEA-13-1057
DOI: https://doi.org/10.1115/1.4026219
Published Online: March 17, 2014
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Topics: Cooling, Heat, Impingement cooling, Heat sinks, Fluidic devices
Proceedings Papers

Contribution of Heat Pipe to the Energy Conservation of Data Center and Cloud Computers

Masataka Mochizuki, Thang Nguyen, Koichi Mashiko, Yuji Saito, Xiao Ping Wu, Tien Nguyen, Vijit Wuttijumnong, Randeep Singh
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 653-661, July 6–8, 2011
Paper No: IPACK2011-52265
DOI: https://doi.org/10.1115/IPACK2011-52265
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Topics: Computers, Data centers, Energy conservation, Heat pipes, Energy storage, Design, Storage, Water storage, Climate change, Control systems
Proceedings Papers

Data Center Energy Conservation by Heat Pipe Cold Energy Storage System

Xiao Ping Wu, Masataka Mochizuki, Koichi Mashiko, Thang Nguyen, Tien Nguyen, Vijit Wuttijumnong, Gerald Cabusao, Randeep Singh, Aliakbar Akbarzadeh
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 701-709, August 8–13, 2010
Paper No: IHTC14-23128
DOI: https://doi.org/10.1115/IHTC14-23128
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Topics: Data centers, Energy conservation, Energy storage, Heat pipes
Proceedings Papers

Development of Miniature Loop Heat Pipes for the Thermal Control of Laptops

Masataka Mochizuki, Yuji Saito, Thang Nguyen, Tien Nguyen, Vijit Wuttijumnong, Yasuhiro Horiuchi, Roj Tacomkang, Randeep Singh, Aliakbar Akbarzadeh
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 969-974, June 6–9, 2008
Paper No: MNHT2008-52088
DOI: https://doi.org/10.1115/MNHT2008-52088
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Topics: Cooling, Heat pipes, Laptop computers
Journal Articles

Effect of Wick Characteristics on the Thermal Performance of the Miniature Loop Heat Pipe

Randeep Singh, Aliakbar Akbarzadeh, Masataka Mochizuki
Journal: Journal of Heat Transfer
Article Type: Research Papers
J. Heat Transfer. August 2009, 131(8): 082601.
DOI: https://doi.org/10.1115/1.3109994
Published Online: June 4, 2009
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Topics: Copper, Evaporation, Flow (Dynamics), Heat, Heat pipes, Permeability, Porosity, Pressure, Stress, Temperature
Proceedings Papers

Flat Miniature Heat Pipe With Composite Fibre Wick Structure for Cooling of Mobile Handheld Devices

Randeep Singh, Aliakbar Akbarzadeh, Mastaka Mochizuki, Yuji Saito, Thang Nguyen, Bob Kao, Tanaphan Sataphan, Eiji Takenaka, Vijit Wuttijumnong
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 409-414, July 17–22, 2005
Paper No: IPACK2005-73278
DOI: https://doi.org/10.1115/IPACK2005-73278
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Topics: Composite materials, Cooling, Fibers, Heat pipes
Proceedings Papers

Experimental Investigation of the Miniature Loop Heat Pipe With Flat Evaporator

Randeep Singh, Aliakbar Akbarzadeh, Masataka Mochizuki, Thang Nguyen, Vijit Wuttijumnong
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 697-702, July 17–22, 2005
Paper No: IPACK2005-73498
DOI: https://doi.org/10.1115/IPACK2005-73498
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Topics: Computer cooling, Heat pipes
Journal Articles

Novel Design of a Miniature Loop Heat Pipe Evaporator for Electronic Cooling

Randeep Singh, Aliakbar Akbarzadeh, Chris Dixon, Masataka Mochizuki
Journal: Journal of Heat Transfer
Article Type: Technical Papers
J. Heat Transfer. October 2007, 129(10): 1445–1452.
DOI: https://doi.org/10.1115/1.2754945
Published Online: February 9, 2007
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Topics: Computer cooling, Condensers (steam plant), Cooling, Design, Fluids, Heat, Heat pipes, Stress, Temperature, Thermal resistance