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Proceedings Papers

Validation Study for VOF Simulations of Boiling in a Microchannel

Catherine Gorlé, Hyoungsoon Lee, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Pritish R. Parida
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A022, July 6–9, 2015
Paper No: IPACK2015-48129
DOI: https://doi.org/10.1115/IPACK2015-48129
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Topics: Boiling, Microchannels, Simulation, Boundary-value problems, Temperature, Two-phase flow, Flow (Dynamics), Fluids, Heat flux, Heat transfer
Proceedings Papers

Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling

Pritish R. Parida, Hsin-Hua Tsuei, Timothy J. Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A027, July 6–9, 2015
Paper No: IPACK2015-48489
DOI: https://doi.org/10.1115/IPACK2015-48489
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Topics: Boiling, Cavities, Coolants, Cooling, Density, Evaporative cooling, Flow (Dynamics), Fluids, Heat transfer, Integrated circuits
Proceedings Papers

Reduced Order Modeling for Chip-Embedded Micro-Channel Flow Boiling

Pritish R. Parida
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A085, July 6–9, 2015
Paper No: IPACK2015-48370
DOI: https://doi.org/10.1115/IPACK2015-48370
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Topics: Boiling, Microchannel flow, Modeling, Cooling, Cavities, Convection, Engineering simulation, Evaporative cooling, Fluids, Heat
Proceedings Papers

Dynamically Controlled Long Duration Operation of a Highly Energy Efficient Chiller-Less Data Center Test Facility

Milnes P. David, Pritish R. Parida, Mark D. Schultz, Robert E. Simons, Michael Gaynes, Roger Schmidt, Timothy J. Chainer
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A014, July 16–18, 2013
Paper No: IPACK2013-73183
DOI: https://doi.org/10.1115/IPACK2013-73183
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Topics: Data centers, Test facilities, Cooling, Energy consumption, Water, Energy efficiency, Computers, Water temperature
Proceedings Papers

Cooling Energy Reduction During Dynamically Controlled Data Center Operation

Pritish R. Parida, Timothy J. Chainer, Mark D. Schultz, Milnes P. David
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A017, July 16–18, 2013
Paper No: IPACK2013-73208
DOI: https://doi.org/10.1115/IPACK2013-73208
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Topics: Cooling, Data centers, Energy consumption, Temperature, Algorithms, Heat, Air conditioning, Cloud computing, Density, Dynamic systems
Proceedings Papers

System-Level Design for Liquid Cooled Chiller-Less Data Center

Pritish R. Parida, Timothy Chainer, Madhusudan Iyengar, Milnes David, Mark Schultz, Michael Gaynes, Vinod Kamath, Bejoy Kochuparambil, Robert Simons, Roger Schmidt
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1127-1139, November 9–15, 2012
Paper No: IMECE2012-88957
DOI: https://doi.org/10.1115/IMECE2012-88957
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Topics: Data centers, Design, Cooling, Energy consumption, Air conditioning, Computer simulation, Computers, Electronics, Refrigeration, Test facilities
Journal Articles

Multi-Layer Mini-Channel and Ribbed Mini-Channel Based High Performance Cooling Configurations for Automotive Inverters—Part A: Design and Evaluation

Pritish R. Parida, Srinath V. Ekkad, Khai Ngo
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2013, 5(3): 031010.
Paper No: TSEA-12-1097
DOI: https://doi.org/10.1115/1.4023604
Published Online: June 25, 2013
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Topics: Coolants, Cooling, Design, Flow (Dynamics), Heat exchangers, Heat transfer, Heat transfer coefficients, Optimization, Pressure drop, Simulation
Proceedings Papers

Novel PCM and Jet Impingement Based Cooling Scheme for High Density Transient Heat Loads

Pritish R. Parida, Srinath V. Ekkad, Khai Ngo
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 7, 443-450, August 8–13, 2010
Paper No: IHTC14-22841
DOI: https://doi.org/10.1115/IHTC14-22841
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Topics: Cooling, Density, Heat, Stress, Transients (Dynamics), Phase change materials, Cooling systems, Impingement cooling, Simulation, Computational fluid dynamics
Proceedings Papers

Numerical Prediction of Flow and Heat Transfer Rates in Metal Based Microchannels Using Lattice Boltzmann Method

Pritish R. Parida, Srinath V. Ekkad
Proc. ASME. HT2008, Heat Transfer: Volume 1, 233-241, August 10–14, 2008
Paper No: HT2008-56061
DOI: https://doi.org/10.1115/HT2008-56061
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Topics: Flow (Dynamics), Heat transfer, Lattice Boltzmann methods, Metals, Microchannels, Energy dissipation, Fluids, Heat, Heat exchangers, Pressure