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Paul S. Ho
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Proceedings Papers
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 115-124, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0506
Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A025, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74137
Proceedings Papers
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 105-112, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40015
Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 435-441, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89388
Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 401-409, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89311
Proceedings Papers
Proc. ASME. NANO2005, Design, Synthesis, and Applications, 31-32, September 12–14, 2005
Publisher: American Society of Mechanical Engineers
Paper No: NANO2005-87086
Proceedings Papers
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 433-437, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-82644
Topics:
Nanowires