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Proceedings Papers

Control of Internal Stress for High Quality Nickel Large Area Mold Inserts

D. S. Park, V. Singh, B. H. You, N. Kim, P.-C. Chen, S. A. Soper, D. E. Nikitopoulos, J. Goettert, M. C. Murphy
Proc. ASME. IMECE2009, Volume 12: Micro and Nano Systems, Parts A and B, 263-269, November 13–19, 2009
Paper No: IMECE2009-11639
DOI: https://doi.org/10.1115/IMECE2009-11639
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Topics: Nickel, Stress, Electroplating, Contamination, Electrodeposition, Microfluidics, Molding, Nanoscale phenomena, Polymers, Semiconductor wafers
Proceedings Papers

A High Throughput Microfluidic Thermal Reactor

P.-C. Chen, D. S. Park, B. H. You, N. Kim, T. Park, D. E. Nikitopoulos, S. A. Soper, M. C. Murphy
Proc. ASME. IMECE2009, Volume 2: Biomedical and Biotechnology Engineering, 273-275, November 13–19, 2009
Paper No: IMECE2009-13130
DOI: https://doi.org/10.1115/IMECE2009-13130
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Topics: Microfluidics, Thermal reactors, DNA, Flow (Dynamics), Temperature, Cycles, Chain, Control systems, Temperature distribution
Proceedings Papers

Assembly Tolerance Analysis for Injection Molded Modular, Polymer Microfluidic Devices

Byoung Hee You, Daniel S. Park, P.-C. Chen, Sudheer D. Rani, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy
Proc. ASME. IMECE2008, Volume 13: Nano-Manufacturing Technology; and Micro and Nano Systems, Parts A and B, 803-809, October 31–November 6, 2008
Paper No: IMECE2008-68143
DOI: https://doi.org/10.1115/IMECE2008-68143
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Topics: Manufacturing, Microfluidics, Polymers, Tolerance analysis, Simulation, Brass (Metal), Dimensions, Instrumentation, Mass production, Monte Carlo methods
Proceedings Papers

A Thermal System for a High Throughput Continuous Flow Polymerase Chain Reaction Device (CFPCR)

P.-C. Chen, D. S. Park, B. H. You, N. Kim, T. Park, Y. Desta, S. Park, D. E. Nikitopoulos, S. A. Soper, M. C. Murphy
Proc. ASME. IMECE2008, Volume 13: Nano-Manufacturing Technology; and Micro and Nano Systems, Parts A and B, 313-317, October 31–November 6, 2008
Paper No: IMECE2008-68975
DOI: https://doi.org/10.1115/IMECE2008-68975
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Topics: Chain, Flow (Dynamics), Thermal systems, Copper, Strips, Temperature, Temperature distribution, Computer simulation, Feedback, Heat transfer
Proceedings Papers

Optimization of Geometry for Continuous Flow PCR Devices in a Titer Plate-Based PCR Multi-Reactor Platform

D. S. Park, P.-C. Chen, B. H. You, N. Kim, T. Park, P. Datta, Y. Desta, S. A. Soper, D. E. Nikitopoulos, M. C. Murphy
Proc. ASME. IMECE2007, Volume 11: Micro and Nano Systems, Parts A and B, 113-118, November 11–15, 2007
Paper No: IMECE2007-42135
DOI: https://doi.org/10.1115/IMECE2007-42135
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Topics: Flow (Dynamics), Geometry, Optimization, Bonding, Chain, Design, DNA, Electroplating, Embossing, Engineering prototypes
Journal Articles

Time-Dependent Ductility of Electro-Deposited Copper

Yoshiki Oshida, P. C. Chen, J. D. Reid, T. Nishihara
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 448–454.
DOI: https://doi.org/10.1115/1.2905479
Published Online: December 1, 1992
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Topics: Copper, Ductility, Temperature, Annealing, Current density, Dislocation density, Electrodes, Electrons, Film thickness, Grain size
Journal Articles

High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure

Yoshiki Oshida, P. C. Chen
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 1991, 113(1): 58–62.
DOI: https://doi.org/10.1115/1.2905367
Published Online: March 1, 1991
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Topics: Cycles, Damage, Dislocation density, Dislocations, Fatigue, Fatigue failure, Fatigue life, Fracture (Materials), Low cycle fatigue, Metallic thin films