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Proceedings Papers

Numerical Computation of the Heat Transfer to a Spherical-Tip Anode During an Electronic Flame Off Process

Srinivas S. Sripada, P. S. Ayyaswamy, I. M. Cohen

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 55-61, November 16–21, 1997

Paper No: IMECE1997-0831

DOI: https://doi.org/10.1115/IMECE1997-0831

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Topics: Anodes, Computation, Flames, Heat transfer, Wire, Melting, Bonding, Computer simulation, Electric arcs, Heat

Proceedings Papers

A Multigrid Simulation of the Rapid Solidification of a Pendent Molten Ball

Srinivas S. Sripada, I. M. Cohen, P. S. Ayyaswamy

Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 281-286, November 15–20, 1998

Paper No: IMECE1998-0715

DOI: https://doi.org/10.1115/IMECE1998-0715

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Topics: Simulation, Solidification, Plasmas (Ionized gases), Wire, Microelectronic packaging, Collisions (Physics), Electric discharge, Energy budget (Physics), Finite volume methods, Flames

Proceedings Papers

A Novel Attitude Control Technique for Miniature Spacecraft

Jun Li, Sung K. Koh, G. K. Ananthasuresh, P. S. Ayyaswamy, S. Ananthakrishnan

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 277-280, November 11–16, 2001

Paper No: IMECE2001/MEMS-23840

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23840

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Topics: Microelectromechanical systems, Space vehicles, Microactuators, Actuators, Torque

Proceedings Papers

Modeling of a Nanoparticle Motion in a Newtonian Fluid: A Comparison Between Fluctuating Hydrodynamics and Generalized Langevin Procedures

B. Uma, P. S. Ayyaswamy, R. Radhakrishnan, D. M. Eckmann

Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 735-743, March 3–6, 2012

Paper No: MNHMT2012-75019

DOI: https://doi.org/10.1115/MNHMT2012-75019

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Topics: Fluids, Hydrodynamics, Modeling, Nanoparticles, Particulate matter, Dynamics (Mechanics), Computation, Computer simulation, Finite element methods, Fluctuations (Physics)

Proceedings Papers

Biotransport: Fluid Mechanics, Heat and Mass Transfer

P. S. Ayyaswamy

Proc. ASME. SBC2011, ASME 2011 Summer Bioengineering Conference, Parts A and B, 129-130, June 22–25, 2011

Paper No: SBC2011-53178

DOI: https://doi.org/10.1115/SBC2011-53178

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Topics: Biotransport, Fluid mechanics, Heat, Mass transfer, Students, Undergraduate students

Journal Articles

Nanocarrier–Cell Surface Adhesive and Hydrodynamic Interactions: Ligand–Receptor Bond Sensitivity Study

B. Uma, R. Radhakrishnan, D. M. Eckmann, P. S. Ayyaswamy

J. Nanotechnol. Eng. Med. August 2012, 3(3): 031010.

Paper No: NANO-12-1074

DOI: https://doi.org/10.1115/1.4007522

Published Online: January 18, 2013

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Topics: Adhesives, Computer simulation, Dynamics (Mechanics), Fluids, Hydrodynamics, Nanoparticles, Particulate matter, Springs, Temperature, Theorems (Mathematics)

Journal Articles

A Hybrid Approach for the Simulation of the Thermal Motion of a Nearly Neutrally Buoyant Nanoparticle in an Incompressible Newtonian Fluid Medium

B. Uma, R. Radhakrishnan, D. M. Eckmann, P. S. Ayyaswamy

J. Heat Transfer. January 2013, 135(1): 011011.

Paper No: HT-12-1135

DOI: https://doi.org/10.1115/1.4007668

Published Online: December 6, 2012

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Topics: Fluids, Nanoparticles, Particulate matter, Hydrodynamics, Simulation, Computer simulation, Temperature

Journal Articles

Bubble Motion in a Blood Vessel: Shear Stress Induced Endothelial Cell Injury

K. Mukundakrishnan, P. S. Ayyaswamy, D. M. Eckmann

J Biomech Eng. July 2009, 131(7): 074516.

DOI: https://doi.org/10.1115/1.3153310

Published Online: July 7, 2009

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Topics: Blood vessels, Bubbles, Endothelial cells, Flow (Dynamics), Shear stress, Wounds, Vessels, Vortices, Shear (Mechanics)

Journal Articles

Melting of a Wire Anode Followed by Solidification: A Three-Phase Moving Interface Problem

S. S. Sripada, Ira M. Cohen, P. S. Ayyaswamy

J. Heat Transfer. August 2003, 125(4): 661–668.

DOI: https://doi.org/10.1115/1.1576811

Published Online: July 17, 2003

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Topics: Anodes, Melting, Solidification, Surface tension, Wire, Temperature

Journal Articles

TECHNICAL NOTE: Weakly Ionized Plasma Arc Heat Transfer Between Geometrically Dissimilar Electrodes

S. S. Sripada, P. S. Ayyaswamy, I. M. Cohen

J. Heat Transfer. November 1998, 120(4): 939–942.

DOI: https://doi.org/10.1115/1.2825913

Published Online: November 1, 1998

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Topics: Electric arcs, Electrodes, Heat transfer, Plasmas (Ionized gases)

Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation

K. J. Zwick, P. S. Ayyaswamy, I. M. Cohen

J. Electron. Packag. September 1995, 117(3): 220–224.

DOI: https://doi.org/10.1115/1.2792095

Published Online: September 1, 1995

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Topics: Computer simulation, Hardening (Curing), Jets, Ovens, Pressure, Vapors, Design, Contamination, Flow visualization, Heat

Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization

K. J. Zwick, I. M. Cohen, P. S. Ayyaswamy

J. Electron. Packag. September 1995, 117(3): 215–219.

DOI: https://doi.org/10.1115/1.2792094

Published Online: September 1, 1995

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Topics: Flow visualization, Hardening (Curing), Jets, Ovens, Vapors, Vortices, Condensation, Contamination, Flow (Dynamics), Bonding

Journal Articles

Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process

Wei Qin, Ira M. Cohen, P. S. Ayyaswamy

J. Electron. Packag. September 1994, 116(3): 212–219.

DOI: https://doi.org/10.1115/1.2905688

Published Online: September 1, 1994

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Topics: Flames, Wire bonding, Wire, Electrodes, Design, Computation, Computer simulation, Cycles, Deflection, Electric fields

Journal Articles

Heat Transfer in Wire Bonding Process

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy

J. Electron. Packag. March 1994, 116(1): 44–48.

DOI: https://doi.org/10.1115/1.2905492

Published Online: March 1, 1994

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Topics: Heat transfer, Wire bonding, Electrodes, Wire, Electric discharge, Electric fields, Electric potential, Engineering simulation, Flux (Metallurgy), Heat

Journal Articles

Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy

J. Electron. Packag. March 1993, 115(1): 34–38.

DOI: https://doi.org/10.1115/1.2909299

Published Online: March 1, 1993

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Topics: Packaging, Simulation, Stress, Transients (Dynamics), Temperature, Thermal stresses, Composite materials, Delamination, Electronic equipment, Elongation

Journal Articles

Effect of Polarity on Heat Transfer in the Ball Formation Process

L. J. Huang, M. A. Jog, I. M. Cohen, P. S. Ayyaswamy

J. Electron. Packag. March 1991, 113(1): 33–39.

DOI: https://doi.org/10.1115/1.2905364

Published Online: March 1, 1991

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Topics: Heat transfer, Wire, Anodes, Aluminum, Copper, Bonding, Electric discharge, Heat, Pressure, Semiconductors (Materials)

Journal Articles

Effect of Insoluble Surfactants in Condensation on a Moving Drop: Solutions for Intermediate Reynolds Numbers

L. J. Huang, P. S. Ayyaswamy

J. Heat Transfer. February 1991, 113(1): 232–236.

DOI: https://doi.org/10.1115/1.2910530

Published Online: February 1, 1991

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Topics: Condensation, Drops, Heat transfer, Reynolds number, Surfactants

Journal Articles

A Note on the Interface Condition in Phase Change Problems

L. J. Huang, P. S. Ayyaswamy, I. M. Cohen

J. Heat Transfer. February 1991, 113(1): 244–247.

DOI: https://doi.org/10.1115/1.2910534

Published Online: February 1, 1991

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Topics: Heat conduction

Journal Articles

An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process

L. J. Huang, K. Ramakrishna, P. S. Ayyaswamy, I. M. Cohen

J. Electron. Packag. September 1989, 111(3): 199–206.

DOI: https://doi.org/10.1115/1.3226534

Published Online: September 1, 1989

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Topics: Aluminum, Bonding, Porosity, Shrinkage (Materials), Alloys, Metals, Density, Solidification, Accounting, Geometry

Journal Articles

Temperature Response of a Heated Cylinder Subject to Side Cooling: Asymptotic and Numerical Solutions

K. Ramakrishna, I. M. Cohen, P. S. Ayyaswamy

J. Heat Transfer. August 1989, 111(3): 592–597.

DOI: https://doi.org/10.1115/1.3250723

Published Online: August 1, 1989

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Topics: Cooling, Cylinders, Temperature, Heat flux, Bonding, Heat, Heat conduction, Heat losses, Heat transfer, Manufacturing

Journal citation

NARROW

Numerical Computation of the Heat Transfer to a Spherical-Tip Anode During an Electronic Flame Off Process

A Multigrid Simulation of the Rapid Solidification of a Pendent Molten Ball

A Novel Attitude Control Technique for Miniature Spacecraft

Modeling of a Nanoparticle Motion in a Newtonian Fluid: A Comparison Between Fluctuating Hydrodynamics and Generalized Langevin Procedures

Biotransport: Fluid Mechanics, Heat and Mass Transfer

Nanocarrier–Cell Surface Adhesive and Hydrodynamic Interactions: Ligand–Receptor Bond Sensitivity Study

A Hybrid Approach for the Simulation of the Thermal Motion of a Nearly Neutrally Buoyant Nanoparticle in an Incompressible Newtonian Fluid Medium

Bubble Motion in a Blood Vessel: Shear Stress Induced Endothelial Cell Injury

Melting of a Wire Anode Followed by Solidification: A Three-Phase Moving Interface Problem

TECHNICAL NOTE: Weakly Ionized Plasma Arc Heat Transfer Between Geometrically Dissimilar Electrodes

Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation

Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization

Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process

Heat Transfer in Wire Bonding Process

Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging

Effect of Polarity on Heat Transfer in the Ball Formation Process

Effect of Insoluble Surfactants in Condensation on a Moving Drop: Solutions for Intermediate Reynolds Numbers

A Note on the Interface Condition in Phase Change Problems

An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process

Temperature Response of a Heated Cylinder Subject to Side Cooling: Asymptotic and Numerical Solutions

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