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Proceedings Papers

Drop Reliability of Corner Bonded CSP in Portable Products

Guoyun Tian, Yueli Liu, Pradeep Lall, R. Wayne Johnson, Sanan Abderrahman, Mike Palmer, Nokib Islam, Jeffrey Suhling, Larry Crane
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 897-905, July 6–11, 2003
Paper No: IPACK2003-35318
https://doi.org/10.1115/IPACK2003-35318
View Paper titled, Drop Reliability of Corner Bonded CSP in Portable Products
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Topics: Corners (Structural elements), Reliability, Bonding, Flow (Dynamics), Manufacturing, Cycles, Electronic products, Finite element analysis, Modeling, Shock (Mechanics)
Proceedings Papers

Drop-Impact Reliability of Chip-Scale Packages in Handheld Products

Guoyun Tian, Yueli Liu, Pradeep Lall, R. Wayne Johnson, Sanan Abderrahman, Mike Palmer, Nokib Islam, Dhananjay Panchgade, Jeffrey Suhling, Larry Crane
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 135-143, November 15–21, 2003
Paper No: IMECE2003-42075
https://doi.org/10.1115/IMECE2003-42075
View Paper titled, Drop-Impact Reliability of Chip-Scale Packages in Handheld Products
Open the PDF for Drop-Impact Reliability of Chip-Scale Packages in Handheld Products in another window
Topics: Reliability, Corners (Structural elements), Bonding, Flow (Dynamics), Manufacturing, Cycles, Electronic products, Finite element analysis, Modeling, Shock (Mechanics)