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Nicholas R. Jankowski
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Proceedings Papers

Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading

David Gonzalez-Nino, Lauren M. Boteler, Nicholas R. Jankowski, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 29–September 1, 2017
Paper No: IPACK2017-74118
DOI: https://doi.org/10.1115/IPACK2017-74118
View Paper titled, Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading
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Topics: Phase change materials, Heat, Silicon nitride ceramics, Temperature, Cooling, Cooling systems, Cycles, Inspection, Optical quality control, Temperature profiles
Proceedings Papers

Numerical Evaluation of Multiple Phase Change Materials for Pulsed Electronics Applications

David Gonzalez-Nino, Lauren M. Boteler, Dimeji Ibitayo, Nicholas R. Jankowski, Pedro O. Quintero
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T11A004, July 10–14, 2016
Paper No: HT2016-7223
DOI: https://doi.org/10.1115/HT2016-7223
View Paper titled, Numerical Evaluation of Multiple Phase Change Materials for Pulsed Electronics Applications
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Topics: Electronics, Phase change materials, Heat, Tin, Transients (Dynamics), Stress, Thermal conductivity, Absorption, Finite difference methods, Gallium
Proceedings Papers

Thermal Model of a Thin Film Pulsed Pyroelectric Generator

Nicholas R. Jankowski, Andrew N. Smith, Brendan M. Hanrahan
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T01A010, July 10–14, 2016
Paper No: HT2016-7437
DOI: https://doi.org/10.1115/HT2016-7437
View Paper titled, Thermal Model of a Thin Film Pulsed Pyroelectric Generator
Click here to open pdf in another window PDF for Thermal Model of a Thin Film Pulsed Pyroelectric Generator
Topics: Generators, Thin films, Cycles, Temperature, Energy conversion, Energy generation, Heating, Thermodynamic cycles, Transients (Dynamics), Brayton cycle
Journal Articles

Measurement of High-Performance Thermal Interfaces Using a Reduced Scale Steady-State Tester and Infrared Microscopy

Andrew N. Smith, Nicholas R. Jankowski, Lauren M. Boteler
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. April 2016, 138(4): 041301.
Paper No: HT-15-1199
DOI: https://doi.org/10.1115/1.4032172
Published Online: January 20, 2016
View Article titled, Measurement of High-Performance Thermal Interfaces Using a Reduced Scale Steady-State Tester and Infrared Microscopy
Click here to open pdf in another window PDF for Measurement of High-Performance Thermal Interfaces Using a Reduced Scale Steady-State Tester and Infrared Microscopy
Topics: Heat, Interfacial thermal resistance, Steady state, Temperature, Uncertainty, Microscopy, Thermal resistance, Temperature gradient, Heat flux
Proceedings Papers

Non-Intrusive Optical Validation of Two-Phase Flow Regimes in a Small Diameter Tube

Darin J. Sharar, Arthur E. Bergles, Nicholas R. Jankowski, Avram Bar-Cohen
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T03A016, August 3–7, 2014
Paper No: ICNMM2014-22029
DOI: https://doi.org/10.1115/ICNMM2014-22029
View Paper titled, Non-Intrusive Optical Validation of Two-Phase Flow Regimes in a Small Diameter Tube
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Topics: Two-phase flow, Flow (Dynamics), Film thickness
Proceedings Papers

Analysis and Characterization of Thermal Expansion-Matched Wick-Based Multi-Chip Passive Heat Spreaders in Static and Dynamic Environments

David H. Altman, Anurag Gupta, Thomas E. Dubrowski, Jr., Darin J. Sharar, Nicholas R. Jankowski, Mark T. North
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A018, July 16–18, 2013
Paper No: IPACK2013-73087
DOI: https://doi.org/10.1115/IPACK2013-73087
View Paper titled, Analysis and Characterization of Thermal Expansion-Matched Wick-Based Multi-Chip Passive Heat Spreaders in Static and Dynamic Environments
Click here to open pdf in another window PDF for Analysis and Characterization of Thermal Expansion-Matched Wick-Based Multi-Chip Passive Heat Spreaders in Static and Dynamic Environments
Topics: Flat heat pipes
Proceedings Papers

Modified Model for Improved Flow Regime Prediction in Internally-Grooved Tubes

Darin J. Sharar, Nicholas R. Jankowski, Avram Bar-Cohen
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A042, July 16–18, 2013
Paper No: IPACK2013-73199
DOI: https://doi.org/10.1115/IPACK2013-73199
View Paper titled, Modified Model for Improved Flow Regime Prediction in Internally-Grooved Tubes
Click here to open pdf in another window PDF for Modified Model for Improved Flow Regime Prediction in Internally-Grooved Tubes
Topics: Flow (Dynamics), Heat transfer
Proceedings Papers

The Impact of GaN/Substrate Thermal Boundary Resistance on a HEMT Device

Horacio C. Nochetto, Nicholas R. Jankowski, Avram Bar-Cohen
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 241-249, November 11–17, 2011
Paper No: IMECE2011-65562
DOI: https://doi.org/10.1115/IMECE2011-65562
View Paper titled, The Impact of GaN/Substrate Thermal Boundary Resistance on a HEMT Device
Click here to open pdf in another window PDF for The Impact of GaN/Substrate Thermal Boundary Resistance on a HEMT Device
Topics: Gallium nitride, Interfacial thermal resistance, Temperature, Heat, Junctions, Design, Electron mobility, Engineering simulation, Finite element analysis, Simulation
Proceedings Papers

Numerical Study on the Thermal Performance of a Substrate Integrated Thermal Buffer Heat Sink

Nicholas R. Jankowski, F. Patrick McCluskey
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 687-696, November 11–17, 2011
Paper No: IMECE2011-65590
DOI: https://doi.org/10.1115/IMECE2011-65590
View Paper titled, Numerical Study on the Thermal Performance of a Substrate Integrated Thermal Buffer Heat Sink
Click here to open pdf in another window PDF for Numerical Study on the Thermal Performance of a Substrate Integrated Thermal Buffer Heat Sink
Topics: Heat sinks, Polishing equipment, Transients (Dynamics), Temperature, Design, Stress, Convection, Finite element model, Geometry, Heat
Proceedings Papers

Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics

Darin J. Sharar, Brian Morgan, Nicholas R. Jankowski, Avram Bar-Cohen
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 133-142, July 6–8, 2011
Paper No: IPACK2011-52079
DOI: https://doi.org/10.1115/IPACK2011-52079
View Paper titled, Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics
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Topics: Army, Electronics, Vehicles, Temperature, Energy dissipation, Heat, Coolants, Cooling, Design, Electrical resistivity
Proceedings Papers

Electrical Supercooling Mitigation in Erythritol

Nicholas R. Jankowski, F. Patrick McCluskey
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 7, 409-416, August 8–13, 2010
Paper No: IHTC14-22306
DOI: https://doi.org/10.1115/IHTC14-22306
View Paper titled, Electrical Supercooling Mitigation in Erythritol
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Topics: Supercooling, Electric current, Nucleation (Physics), Temperature, Electrodes, Crystallization, Cycles, Heat of fusion, Melting, Recrystallization
Proceedings Papers

Design and Fabrication of a Substrate Integrated Phase Change Thermal Buffer Heat Sink

Nicholas R. Jankowski, Brian C. Morgan, F. Patrick McCluskey
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 75-84, November 13–19, 2009
Paper No: IMECE2009-12713
DOI: https://doi.org/10.1115/IMECE2009-12713
View Paper titled, Design and Fabrication of a Substrate Integrated Phase Change Thermal Buffer Heat Sink
Click here to open pdf in another window PDF for Design and Fabrication of a Substrate Integrated Phase Change Thermal Buffer Heat Sink
Topics: Design, Heat sinks, Manufacturing, Polishing equipment, Cooling, Temperature, Transients (Dynamics), Absorption, Army, Bonding