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Journal Articles

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031001.
Paper No: EP-11-1060
DOI: https://doi.org/10.1115/1.4029931
Published Online: September 1, 2015
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Topics: Annealing, Copper, Grain boundaries, Thin films, Electrical properties, Electron backscatter diffraction
Proceedings Papers

Micro Texture Dependence of Both the Mechanical and Electrical Properties of Electroplated Copper Thin Films Used for Interconnection

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 455-461, November 12–18, 2010
Paper No: IMECE2010-37279
DOI: https://doi.org/10.1115/IMECE2010-37279
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Topics: Copper, Electrical properties, Texture (Materials), Thin films, Fracture (Materials), Annealing, Grain boundaries, Electrodiffusion, Brittle fracture, Electroplating
Proceedings Papers

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 677-684, July 6–8, 2011
Paper No: IPACK2011-52048
DOI: https://doi.org/10.1115/IPACK2011-52048
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Topics: Copper, Electrical properties, Grain boundaries, Thin films, Fracture (Materials), Annealing, Reliability, Brittle fracture, Electron backscatter diffraction, Stress
Proceedings Papers

Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration

Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 685-690, July 6–8, 2011
Paper No: IPACK2011-52058
DOI: https://doi.org/10.1115/IPACK2011-52058
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Topics: Copper, Electrodiffusion, Stress, Thin films, Atoms, Sulfur, Current density, Electroplating, Fracture (Materials), Fracture (Process)
Proceedings Papers

Development of a Rehabilitation Instrument for Prevent Contracture of Ankle

Rika Sato, Norihiko Saga, Naoki Saito, Seiji Chonan
Proc. ASME. BIOMED2007, ASME 2007 2nd Frontiers in Biomedical Devices, 61-62, June 7–8, 2007
Paper No: BioMed2007-38061
DOI: https://doi.org/10.1115/BioMed2007-38061
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Topics: Instrumentation, Knee, Motors
Proceedings Papers

Development of an Arm Support System Using an Artificial Muscle Actuator and Gas Spring

Norihiko Saga, Naoki Saito, Seiji Chonan
Proc. ASME. BIOMED2007, ASME 2007 2nd Frontiers in Biomedical Devices, 121-122, June 7–8, 2007
Paper No: BioMed2007-38063
DOI: https://doi.org/10.1115/BioMed2007-38063
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Topics: Actuators, Muscle, Springs, Biomedicine
Proceedings Papers

Design Method for the Balloon-Type Pneumatic Actuator Regarding a Stroke

Taewoo Bae, Naoki Saito, Norihiko Saga, Seiji Chonan
Proc. ASME. BIOMED2007, ASME 2007 2nd Frontiers in Biomedical Devices, 73-74, June 7–8, 2007
Paper No: BioMed2007-38110
DOI: https://doi.org/10.1115/BioMed2007-38110
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Topics: Design methodology, Pneumatic actuators, Actuators