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Michael C. Hamilton
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Journal Articles

Durability of Low Melt Alloys as Thermal Interface Materials

Chandan K. Roy, Sushil Bhavnani, Michael C. Hamilton, R. Wayne Johnson, Roy W. Knight, Daniel K. Harris
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010913.
Paper No: EP-15-1108
https://doi.org/10.1115/1.4032462
Published Online: March 10, 2016
View Article titled, Durability of Low Melt Alloys as Thermal Interface Materials
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Topics: Alloys, Thermal resistance, Disks, Copper, Wetting, Reliability, Cycles
Proceedings Papers

Durability of Low Melt Alloys as Thermal Interface Materials

Chandan K. Roy, Daniel K. Harris, Sushil Bhavnani, Michael C. Hamilton, Wayne Johnson, Roy W. Knight
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A071, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48083
https://doi.org/10.1115/IPACK2015-48083
View Paper titled, Durability of Low Melt Alloys as Thermal Interface Materials
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Topics: Alloys, Durability, Testing, ASTM International, Copper, Cycles, Gallium, Performance evaluation, Surface finishing, Tin
Proceedings Papers

The Influence of Uniaxial Normal Stress on the Performance of Vertical Bipolar Transistors

Safina Hussain, Parameshwaran Gnanachchelvi, Jeffrey C. Suhling, Richard C. Jaeger, Michael C. Hamilton, Bogdan M. Wilamowski
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A010, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73233
https://doi.org/10.1115/IPACK2013-73233
View Paper titled, The Influence of Uniaxial Normal Stress on the Performance of Vertical Bipolar Transistors
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Topics: Stress, Transistors