1-20 of 73
Mehdi Asheghi
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 575-582, November 14–19, 1999
Paper No: IMECE1999-0323
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 26–28, 2021
Paper No: IPACK2021-73334
Topics: Copper
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 26–28, 2021
Paper No: IPACK2021-73309
Journal Articles
Article Type: Review Articles
Appl. Mech. Rev. January 2021, 73(1): 010802.
Paper No: AMR-20-1085
Published Online: February 18, 2021
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 27–29, 2020
Paper No: IPACK2020-2533
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 27–29, 2020
Paper No: IPACK2020-2640
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 27–29, 2020
Paper No: IPACK2020-2603
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031117.
Paper No: EP-20-1030
Published Online: August 17, 2020
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031119.
Paper No: EP-20-1022
Published Online: August 17, 2020
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031118.
Paper No: EP-20-1032
Published Online: August 17, 2020
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 7–9, 2019
Paper No: IPACK2019-6539
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A021, October 7–9, 2019
Paper No: IPACK2019-6472
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 7–9, 2019
Paper No: IPACK2019-6400
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020906.
Paper No: EP-18-1003
Published Online: May 9, 2018
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021001.
Paper No: EP-17-1126
Published Online: May 9, 2018
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 29–September 1, 2017
Paper No: IPACK2017-74163
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 29–September 1, 2017
Paper No: IPACK2017-74090
Journal Articles
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010907.
Paper No: EP-15-1104
Published Online: March 10, 2016
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A010, July 6–9, 2015
Paper No: IPACK2015-48734