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Proceedings Papers

Combined Pulsating and Capillary Heat Pipe Mechanism for Cooling of High Heat Flux Electronics

Z. Jon Zuo, Mark T. North, Lee Ray

Proc. ASME. IMECE99, Heat Transfer: Volume 4, 237-243, November 14–19, 1999

Paper No: IMECE1999-1124

DOI: https://doi.org/10.1115/IMECE1999-1124

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Topics: Cooling, Electronics, Heat flux, Heat pipes, Fluids, Condensers (steam plant), Copper, Design, Internal flow, Metal powders

Proceedings Papers

Piezoelectric Synthetic Jet Integrated With Heat Sink for Heat Transfer Enhancement

Qiao Li, Longzhong Huang, Min Zhang, Mark T. North, Terrence Simon, Tianhong Cui

Proc. ASME. IMECE2013, Volume 8B: Heat Transfer and Thermal Engineering, V08BT09A019, November 15–21, 2013

Paper No: IMECE2013-62782

DOI: https://doi.org/10.1115/IMECE2013-62782

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Topics: Heat sinks, Heat transfer, Jets, Shapes, Diaphragms (Mechanical devices), Diaphragms (Structural), Carbon fibers, Vibration, Actuators, Cavities

Proceedings Papers

Analysis and Characterization of Thermal Expansion-Matched Wick-Based Multi-Chip Passive Heat Spreaders in Static and Dynamic Environments

David H. Altman, Anurag Gupta, Thomas E. Dubrowski, Jr., Darin J. Sharar, Nicholas R. Jankowski, Mark T. North

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A018, July 16–18, 2013

Paper No: IPACK2013-73087

DOI: https://doi.org/10.1115/IPACK2013-73087

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Topics: Flat heat pipes

Proceedings Papers

An Active Heat Sink System With Piezoelectric Translational Agitators and Micro Pin Fin Arrays

Taiho Yeom, Terrence W. Simon, Youmin Yu, Min Zhang, Smita Agrawal, Longzhong Huang, Tao Zhang, Mark T. North, Tianhong Cui

Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1479-1488, November 9–15, 2012

Paper No: IMECE2012-88449

DOI: https://doi.org/10.1115/IMECE2012-88449

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Topics: Heat sinks, Blades, Displacement, Cooling, Flow (Dynamics), Actuators, Carbon fibers, Composite materials, Electronics, Energy dissipation

Proceedings Papers

Convective Heat Transfer Enhancement With Micro Pin-Fin Surfaces Cooled by a Piezoelectrically-Driven Translational Agitator

Taiho Yeom, Terrence W. Simon, Tao Zhang, Mark T. North, Tianhong Cui

Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 685-691, November 9–15, 2012

Paper No: IMECE2012-88428

DOI: https://doi.org/10.1115/IMECE2012-88428

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Topics: Convection, Cooling, Displacement, Heat transfer, Channel flow, Fins, Flow (Dynamics), Actuators, Copper, Electronic equipment

Proceedings Papers

Development of Synthetic Jet Arrays for Heat Transfer Enhancement in Air-Cooled Heat Sinks for Electronics Cooling

Min Zhang, Taiho Yeom, Youmin Yu, Longzhong Huang, Terrence W. Simon, Mark T. North, Tianhong Cui

Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 601-606, July 8–12, 2012

Paper No: HT2012-58092

DOI: https://doi.org/10.1115/HT2012-58092

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Topics: Computer cooling, Heat sinks, Heat transfer, Jets, Channel flow, Energy consumption, Pistons, Actuators, Cavities, Cross-flow

Proceedings Papers

Convective Heat Transfer Enhancement on a Channel Wall With a High Frequency, Oscillating Agitator

Taiho Yeom, Terrence W. Simon, Youmin Yu, Mark T. North, Tianhong Cui

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 875-884, November 11–17, 2011

Paper No: IMECE2011-64379

DOI: https://doi.org/10.1115/IMECE2011-64379

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Topics: Convection, Channel flow, Flow (Dynamics), Oscillations, Actuators, Computer simulation, Cooling, Heat transfer, Shells, Cross-flow

Proceedings Papers

A Polymeric Piezoelectric Synthetic Jet for Electronic Cooling

Min Zhang, Terrence W. Simon, Longzhong Huang, Vinnee Bharathi A. Selvi, Mark T. North, Tianhong Cui

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 235-239, November 11–17, 2011

Paper No: IMECE2011-64392

DOI: https://doi.org/10.1115/IMECE2011-64392

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Topics: Cantilevers, Cavities, Computer cooling, Cooling, Diaphragms (Mechanical devices), Diaphragms (Structural), Energy consumption, Heat sinks, Heat transfer coefficients, Jets

Proceedings Papers

Development of Micro/Nano Engineered Wick-Based Passive Heat Spreaders for Thermal Management of High Power Electronic Devices

David H. Altman, Joseph R. Wasniewski, Mark T. North, Sungwon S. Kim, Timothy S. Fisher

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 213-220, July 6–8, 2011

Paper No: IPACK2011-52122

DOI: https://doi.org/10.1115/IPACK2011-52122

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Topics: Carbon nanotubes, Flat heat pipes, Thermal management, Thermal resistance, Vapors

Proceedings Papers

Characterisation of a Variable Conductance Heat Pipe Prototype for a Photonic Application

Martin Cleary, Ronan Grimes, Marc Hodes, Mark T. North

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3, 313-320, July 8–12, 2007

Paper No: HT2007-32623

DOI: https://doi.org/10.1115/HT2007-32623

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Topics: Electrical conductance, Engineering prototypes, Heat pipes, Temperature control

Proceedings Papers

PIV Measurements in the Condenser Region of a Gas-Loaded Thermosyphon

Martin Cleary, Ronan Grimes, Marc Hodes, Mark T. North

Proc. ASME. HT2008, Heat Transfer: Volume 3, 651-658, August 10–14, 2008

Paper No: HT2008-56402

DOI: https://doi.org/10.1115/HT2008-56402

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Topics: Condensers (steam plant), Flow (Dynamics), Vapors, Heat, Temperature, Heat pipes, Particulate matter, Stress, Coolants, Cycles

Proceedings Papers

High Heat Flux Liquid-Cooled Porous Metal Heat Sink

Mark T. North, Wei-Lin Cho

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 681-686, July 6–11, 2003

Paper No: IPACK2003-35320

DOI: https://doi.org/10.1115/IPACK2003-35320

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Topics: Cooling, Heat flux, Heat sinks, Metals

Proceedings Papers

The Effect of an Embedded Heat Pipe in a Cutting Tool on Temperature and Wear

Richard Y. Chiou, Jim S. J. Chen, Lin Lu, Mark T. North

Proc. ASME. IMECE2003, Heat Transfer, Volume 3, 369-376, November 15–21, 2003

Paper No: IMECE2003-55464

DOI: https://doi.org/10.1115/IMECE2003-55464

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Topics: Cutting tools, Heat pipes, Temperature, Wear, Machining, Cutting, Contamination, Engineering simulation, Fluids, Heat

Proceedings Papers

Optimization of Heat Pipe Thermal Transport Using Axially Graded Capillary Wick Structures

Mark T. North

Proc. ASME. IMECE2005, Heat Transfer, Part A, 855-862, November 5–11, 2005

Paper No: IMECE2005-82950

DOI: https://doi.org/10.1115/IMECE2005-82950

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Topics: Heat pipes, Optimization, Heat, Condensers (steam plant), Gravity (Force), Pressure drop, Vapor pressure

Proceedings Papers

Analytical Study of the Effect of Heat Pipe Cooling in Machining

Richard Y. Chiou, Vitaliy Aynbinder, L. G. Stepanskiy, Lin Lu, Shreepud Rauniar, Jim S. J. Chen, Mark T. North

Proc. ASME. IMECE2005, Manufacturing Engineering and Materials Handling, Parts A and B, 13-21, November 5–11, 2005

Paper No: IMECE2005-79344

DOI: https://doi.org/10.1115/IMECE2005-79344

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Topics: Cooling, Heat pipes, Machining, Cutting, Temperature, Wear, Fluids, Boundary-value problems, Heat transfer, Machine shops

Proceedings Papers

An Investigation on Cutting Tool Temperatures in Composite Machining Assisted With Heat-Pipe Cooling

Jie Liu, Y. Kevin Chou, Mark T. North, Kirk A. Bennett

Proc. ASME. IMECE2005, Manufacturing Engineering and Materials Handling, Parts A and B, 471-478, November 5–11, 2005

Paper No: IMECE2005-80323

DOI: https://doi.org/10.1115/IMECE2005-80323

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Topics: Composite materials, Cooling, Cutting tools, Heat pipes, Machining, Temperature, Heat, Coating processes, Coatings, Heat flux

Proceedings Papers

Design of a Variable Conductance Heat Pipe for a Photonic Component

Martin Cleary, Ronan Grimes, Marc Hodes, Mark T. North

Proc. ASME. IMECE2006, Heat Transfer, Volume 2, 143-152, November 5–10, 2006

Paper No: IMECE2006-13603

DOI: https://doi.org/10.1115/IMECE2006-13603

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Topics: Design, Electrical conductance, Heat pipes, Photonic components

Journal citation

NARROW

Combined Pulsating and Capillary Heat Pipe Mechanism for Cooling of High Heat Flux Electronics

Piezoelectric Synthetic Jet Integrated With Heat Sink for Heat Transfer Enhancement

Analysis and Characterization of Thermal Expansion-Matched Wick-Based Multi-Chip Passive Heat Spreaders in Static and Dynamic Environments

An Active Heat Sink System With Piezoelectric Translational Agitators and Micro Pin Fin Arrays

Convective Heat Transfer Enhancement With Micro Pin-Fin Surfaces Cooled by a Piezoelectrically-Driven Translational Agitator

Development of Synthetic Jet Arrays for Heat Transfer Enhancement in Air-Cooled Heat Sinks for Electronics Cooling

Convective Heat Transfer Enhancement on a Channel Wall With a High Frequency, Oscillating Agitator

A Polymeric Piezoelectric Synthetic Jet for Electronic Cooling

Development of Micro/Nano Engineered Wick-Based Passive Heat Spreaders for Thermal Management of High Power Electronic Devices

Characterisation of a Variable Conductance Heat Pipe Prototype for a Photonic Application

PIV Measurements in the Condenser Region of a Gas-Loaded Thermosyphon

High Heat Flux Liquid-Cooled Porous Metal Heat Sink

The Effect of an Embedded Heat Pipe in a Cutting Tool on Temperature and Wear

Optimization of Heat Pipe Thermal Transport Using Axially Graded Capillary Wick Structures

Analytical Study of the Effect of Heat Pipe Cooling in Machining

An Investigation on Cutting Tool Temperatures in Composite Machining Assisted With Heat-Pipe Cooling

Design of a Variable Conductance Heat Pipe for a Photonic Component

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