1-16 of 16
M. Tan
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Numerical Results of an Integral Formulation of Transient Radiative Transfer

Z.-M. Tan, P.-F. Hsu
Proc. ASME. IMECE99, Advances in Heat and Mass Transfer in Biotechnology, 153-161, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0597
https://doi.org/10.1115/IMECE1999-0597
View Paper titled, Numerical Results of an Integral Formulation of Transient Radiative Transfer
Open the PDF for Numerical Results of an Integral Formulation of Transient Radiative Transfer in another window
Topics: Radiative heat transfer, Transients (Dynamics), Boundary-value problems, Radiation (Physics), Steady state, Waves, Computation, Electromagnetic scattering, Geometry, Integral equations
Journal Articles

A Case Study on the Influence of Selected Parameters on Microexplosion Behavior of Water in Biodiesel Emulsion Droplets

Mohammed Yahaya Khan, Z. A. Abdul Karim, A. Rashid A. Aziz, Isa M. Tan
Journal: Journal of Energy Resources Technology
Publisher: ASME
Article Type: Research-Article
J. Energy Resour. Technol. March 2017, 139(2): 022203.
Paper No: JERT-15-1452
https://doi.org/10.1115/1.4034230
Published Online: August 17, 2016
View Article titled, A Case Study on the Influence of Selected Parameters on Microexplosion Behavior of Water in Biodiesel Emulsion Droplets
Open the PDF for A Case Study on the Influence of Selected Parameters on Microexplosion Behavior of Water in Biodiesel Emulsion Droplets in another window
Topics: Drops, Emulsions, Surfactants, Temperature, Water, Biodiesel, Particulate matter, Stability
Proceedings Papers

Engineering Design of Tough Ceramic Matrix Composites for Turbine Components

T. M. Tan, Christopher M. Pastore, Frank K. Ko
Proc. ASME. GT1989, Volume 5: Manufacturing Materials and Metallurgy; Ceramics; Structures and Dynamics; Controls, Diagnostics and Instrumentation; Education; General, V005T12A010, June 4–8, 1989
Publisher: American Society of Mechanical Engineers
Paper No: 89-GT-294
https://doi.org/10.1115/89-GT-294
View Paper titled, Engineering Design of Tough Ceramic Matrix Composites for Turbine Components
Open the PDF for Engineering Design of Tough Ceramic Matrix Composites for Turbine Components in another window
Topics: Ceramic matrix composites, Engineering design, Fracture toughness, Turbine components, Design methodology, Fibers, Structural analysis, Textiles, Composite materials, Design
Proceedings Papers

Development of a Prototype Test Rig for a Cryogenic, Marine, Heavy Lift, Buoyancy System

R. F. Nicholls-Lee, S. R. Turnock, M. Tan, P. C. McDonald, R. A. Shenoi
Proc. ASME. OMAE2011, Volume 1: Offshore Technology; Polar and Arctic Sciences and Technology, 617-625, June 19–24, 2011
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2011-49944
https://doi.org/10.1115/OMAE2011-49944
View Paper titled, Development of a Prototype Test Rig for a Cryogenic, Marine, Heavy Lift, Buoyancy System
Open the PDF for Development of a Prototype Test Rig for a Cryogenic, Marine, Heavy Lift, Buoyancy System in another window
Topics: Buoyancy, Composite materials, Engineering prototypes, Marine salvage, Nuclear decommissioning, Design, Testing, Seas, Water, High pressure (Physics)
Proceedings Papers

Indentation Size Effect on the Hardness of a Sn-Ag-Cu Solder

Y. D. Han, H. Y. Jing, S. M. L. Nai, C. M. Tan, L. Y. Xu, J. Wei
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 137-141, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-10551
https://doi.org/10.1115/IMECE2009-10551
View Paper titled, Indentation Size Effect on the Hardness of a Sn-Ag-Cu Solder
Open the PDF for Indentation Size Effect on the Hardness of a Sn-Ag-Cu Solder in another window
Topics: Lead-free solders, Nanoindentation, Size effect, Solders, Stress, Tin
Proceedings Papers

Gold to Gold Thermosonic Flip Chip Bonding on Ceramic Substrate

J. Wei, Z. P. Wang, Y. M. Tan
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 431-436, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39685
https://doi.org/10.1115/IMECE2002-39685
View Paper titled, Gold to Gold Thermosonic Flip Chip Bonding on Ceramic Substrate
Open the PDF for Gold to Gold Thermosonic Flip Chip Bonding on Ceramic Substrate in another window
Topics: Bonding, Ceramics, Flip-chip, Flip-chip devices, Shear (Mechanics)
Proceedings Papers

Low Temperature Wafer Bonding in Medium Vacuum

W. B. Yu, J. Wei, C. M. Tan, S. S. Deng
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 303-307, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-60454
https://doi.org/10.1115/IMECE2004-60454
View Paper titled, Low Temperature Wafer Bonding in Medium Vacuum
Open the PDF for Low Temperature Wafer Bonding in Medium Vacuum in another window
Topics: Bonding, Low temperature, Semiconductor wafers, Vacuum, Plasmas (Ionized gases), Temperature, Annealing, Bubbles, Contamination, Damage
Proceedings Papers

Low Temperature Wafer Bonding Process Using Sol-Gel Intermediate Layer

S. S. Deng, J. Wei, C. M. Tan, W. B. Yu, S. M. L. Nai, C. K. Wong
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 309-314, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-60455
https://doi.org/10.1115/IMECE2004-60455
View Paper titled, Low Temperature Wafer Bonding Process Using Sol-Gel Intermediate Layer
Open the PDF for Low Temperature Wafer Bonding Process Using Sol-Gel Intermediate Layer in another window
Topics: Bonding, Composite materials, Design, Hydrophilicity, Low temperature, Semiconductor wafers, Sol-gel processing
Proceedings Papers

Sol-Gel Coating Facilitating Si-to-Si Wafer Bonding at Low Temperature

J. Wei, S. S. Deng, C. M. Tan
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 225-229, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-79263
https://doi.org/10.1115/IMECE2005-79263
View Paper titled, Sol-Gel Coating Facilitating Si-to-Si Wafer Bonding at Low Temperature
Open the PDF for Sol-Gel Coating Facilitating Si-to-Si Wafer Bonding at Low Temperature in another window
Topics: Bonding, Coating processes, Coatings, Low temperature, Semiconductor wafers, Sol-gel processing, Bond strength, Silicon, Temperature, Bubbles
Journal Articles

Allele Frequencies of Eight Short Tandem Repeat Loci in Three Visayas Regional Populations of the Philippines

KA Tabbada, B.Sc., MMF Magno, B.Sc., FC Delfin, B.Sc., GC Calacal, B.Sc., M Tan, M.Sc., J C-Ferreon, Ph.D., SC Halos, Ph.D., MCA De Ungria, Ph.D.
Journal: Journal of Forensic Sciences
Publisher: ASTM International
Article Type: Research-Article
J. Forensic Sci.. November 2002, 47(6): 1397–1398.
https://doi.org/10.1520/JFS15582J
Published Online: November 1, 2002
View Article titled, Allele Frequencies of Eight Short Tandem Repeat Loci in Three Visayas Regional Populations of the Philippines
Open the PDF for Allele Frequencies of Eight Short Tandem Repeat Loci in Three Visayas Regional Populations of the Philippines in another window
Journal Articles

An Integral Formulation of Transient Radiative Transfer

Z.-M. Tan, P.-F. Hsu
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. June 2001, 123(3): 466–475.
https://doi.org/10.1115/1.1371230
Published Online: June 11, 2000
View Article titled, An Integral Formulation of Transient Radiative Transfer
Open the PDF for An Integral Formulation of Transient Radiative Transfer in another window
Topics: Electromagnetic scattering, Radiation (Physics), Radiation scattering, Radiative heat transfer, Scattering (Physics), Steady state, Transients (Dynamics), Waves, Boundary-value problems, Computation
eBook Chapter

Evolution of Notch-Tip Damage in Metal-Matrix Composites During Static Loading

Series: ASTM Select Technical Papers
Publisher: ASTM International
Published: 1993
ISBN-10: 0-8031-1867-8
ISBN: 978-0-8031-1867-6
Open the PDF for Evolution of Notch-Tip Damage in Metal-Matrix Composites During Static Loading in another window
Journal Articles

Engineering Design of Tough Ceramic Matrix Composites for Turbine Components

T. M. Tan, C. M. Pastore, F. K. Ko
Journal: Journal of Engineering for Gas Turbines and Power
Publisher: ASME
Article Type: Research Papers
J. Eng. Gas Turbines Power. April 1991, 113(2): 312–317.
https://doi.org/10.1115/1.2906564
Published Online: April 1, 1991
View Article titled, Engineering Design of Tough Ceramic Matrix Composites for Turbine Components
Open the PDF for Engineering Design of Tough Ceramic Matrix Composites for Turbine Components in another window
Topics: Ceramic matrix composites, Engineering design, Fracture toughness, Turbine components, Design methodology, Fibers, Structural analysis, Textiles, Composite materials, Design
Journal Articles

Effects of Prestrain With Strain Gradient Present on Sheet Metal Formability

H. M. Shang, G. S. Tan, W. C. M. Tan
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. October 1985, 107(4): 298–306.
https://doi.org/10.1115/1.3225823
Published Online: October 1, 1985
View Article titled, Effects of Prestrain With Strain Gradient Present on Sheet Metal Formability
Open the PDF for Effects of Prestrain With Strain Gradient Present on Sheet Metal Formability in another window
Topics: Sheet metal, Strain gradient, Deformation, Forming limit diagrams, Shapes, Shells
Journal Articles

Use of Statical Indentation Laws in the Impact Analysis of Laminated Composite Plates

T. M. Tan, C. T. Sun
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. March 1985, 52(1): 6–12.
https://doi.org/10.1115/1.3169029
Published Online: March 1, 1985
View Article titled, Use of Statical Indentation Laws in the Impact Analysis of Laminated Composite Plates
Open the PDF for Use of Statical Indentation Laws in the Impact Analysis of Laminated Composite Plates in another window
Topics: Composite materials, Epoxy adhesives, Epoxy resins, Finite element analysis, Graphite, Laminates, Plates (structures), Strain gages
Journal Articles

Evaluation of 165 deg F Reverse Osmosis Modules for Washwater Purification

S. Hossain, R. L. Goldsmith, M. Tan, T. Wydeven, M. I. Leban
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. November 1973, 95(4): 1023–1029.
https://doi.org/10.1115/1.3438247
Published Online: November 1, 1973
View Article titled, Evaluation of 165 deg F Reverse Osmosis Modules for Washwater Purification
Open the PDF for Evaluation of 165 deg F Reverse Osmosis Modules for Washwater Purification in another window
Topics: Fibers, Life testing, Membranes, Reverse osmosis, Water