Search Results | ASME Digital Collection

1-20 of 77

2 3 4

Sort by

Sort Order Select

Proceedings Papers

Detachable Fine Bump Connection Using Multi-Walled Carbon-Nanotube Bundles for 3D Semiconductor Modules

Masasuke Kobayashi, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T13A005, November 1–5, 2021

Paper No: IMECE2021-70172

DOI: https://doi.org/10.1115/IMECE2021-70172

View Paper

Topics: Carbon nanotubes, Ohmic contacts, Semiconductors (Materials), Multi-walled carbon nanotubes, Deformation, Silicon, Chemical vapor deposition, Compression, Contact resistance, Electrical properties

Proceedings Papers

Acceleration Mechanism of Intergranular Cracking of SUS316L Under Creep-Fatigue Loading at Elevated Temperatures

Yukako Takahashi, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A005, November 1–5, 2021

Paper No: IMECE2021-70108

DOI: https://doi.org/10.1115/IMECE2021-70108

View Paper

Topics: Creep, Electron backscatter diffraction, Fatigue, Fracture (Process), Temperature

Proceedings Papers

Molecular Dynamics Analysis of the Acceleration of the Degradation of the Strength of a Grain Boundary Under Creep-Fatigue Loads

Shujiroh Suzuki, Shogo Tezuka, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A053, November 1–5, 2021

Paper No: IMECE2021-70628

DOI: https://doi.org/10.1115/IMECE2021-70628

View Paper

Topics: Creep, Damage, Fatigue, Grain boundaries, Molecular dynamics, Stress, Superalloys

Proceedings Papers

Effect of Tensile Strain on Electron Transport Properties of Dumbbell-Shape Graphene Nanoribbons With Metallic-Semiconducting Interfaces

Ken Suzuki, Qinqiang Zhang, Xiangyu Qiao

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T13A003, November 1–5, 2021

Paper No: IMECE2021-70930

DOI: https://doi.org/10.1115/IMECE2021-70930

View Paper

Topics: Electron transport, Graphene, Shapes, Strain sensors

Proceedings Papers

Improvement in Photosensitivity of Dumbbell-Shaped Graphene Nanoribbon Structures by Using Asymmetric Metallization Technique

Jowesh Avisheik Goundar, Qiao Xiangyu, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T13A008, November 1–5, 2021

Paper No: IMECE2021-69917

DOI: https://doi.org/10.1115/IMECE2021-69917

View Paper

Topics: Graphene, Shapes

Proceedings Papers

Creep-Fatigue Damage of Heat-Resistant Alloys Caused by the Local Lattice Mismatch-Induced Acceleration of the Generation and Accumulation of Dislocations and Vacancies

Yifan Luo, Shogo Tezuka, Koki Nakayama, Ayumi Nakayama, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A051, November 1–5, 2021

Paper No: IMECE2021-68489

DOI: https://doi.org/10.1115/IMECE2021-68489

View Paper

Topics: Alloys, Creep, Damage, Dislocations, Electron backscatter diffraction, Fatigue, Grain boundaries, Heat, Stress, Diffusion (Physics)

Proceedings Papers

Non-Destructive Evaluation of the Degradation of Ni-Base Superalloy in the Air by Reflectance Spectrum Analysis

Shin Kasama, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A014, November 16–19, 2020

Paper No: IMECE2020-23354

DOI: https://doi.org/10.1115/IMECE2020-23354

View Paper

Topics: Creep, Damage, Emission spectroscopy, Fatigue, Nondestructive evaluation, Reflectance, Spectroscopy, Superalloys

Proceedings Papers

Molecular Dynamics Analysis of the Acceleration of Intergranular Cracking of Ni-Base Superalloy Caused by Accumulation of Vacancies and Dislocations Around Grain Boundaries

Ryo Kikuchi, Shujiro Suzuki, Ken Suzuki

Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A059, November 16–19, 2020

Paper No: IMECE2020-23352

DOI: https://doi.org/10.1115/IMECE2020-23352

View Paper

Topics: Creep, Dislocations, Fatigue, Fracture (Process), Grain boundaries, Molecular dynamics, Superalloys

Proceedings Papers

Theoretical Study of Heterojunction-Like Electronic Properties Between a Semiconductive Graphene Nanoribbon and a Metallic Graphene for Highly Sensitive Strain Sensors

Qinqiang Zhang, Xiangyu Qiao, Masasuke Kobayashi, Ken Suzuki

Proc. ASME. IMECE2020, Volume 13: Micro- and Nano-Systems Engineering and Packaging, V013T13A005, November 16–19, 2020

Paper No: IMECE2020-23782

DOI: https://doi.org/10.1115/IMECE2020-23782

View Paper

Topics: Electron transport, Graphene, Shapes, Strain sensors

Proceedings Papers

Crystallinity Dependence of Grain and Grain Boundary Strength of a Bicrystal Structure of Copper

Ken Suzuki, Yiqing Fan, Yifan Luo

Proc. ASME. IMECE2020, Volume 13: Micro- and Nano-Systems Engineering and Packaging, V013T13A004, November 16–19, 2020

Paper No: IMECE2020-23757

DOI: https://doi.org/10.1115/IMECE2020-23757

View Paper

Topics: Copper, Grain boundaries, Molecular dynamics

Proceedings Papers

Development of a Strain-Controlled Graphene-Based Highly Sensitive Gas Sensor

Xiangyu Qiao, Qinqiang Zhang, Ken Suzuki

Proc. ASME. IMECE2020, Volume 3: Advanced Materials: Design, Processing, Characterization, and Applications, V003T03A039, November 16–19, 2020

Paper No: IMECE2020-23581

DOI: https://doi.org/10.1115/IMECE2020-23581

View Paper

Topics: Desorption, Graphene, Sensors

Proceedings Papers

Grain Boundary Cracking of Nickel-Based Alloy 625 Under Creep Loadings at Elevated Temperatures

Yan Liang, Yifan Luo, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2019, Volume 9: Mechanics of Solids, Structures, and Fluids, V009T11A056, November 11–14, 2019

Paper No: IMECE2019-11186

DOI: https://doi.org/10.1115/IMECE2019-11186

View Paper

Topics: Alloys, Cracking (Materials), Creep, Damage, Electron backscatter diffraction, Fracture (Materials), Fracture (Process), Grain boundaries, Nickel, Temperature

Proceedings Papers

Change of the Effective Strength of Grain Boundaries in Alloy 617 Under Creep-Fatigue Loadings at 800°C

Wataru Suzuki, Kenta Ishihara, Ryo Kikuchi, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2019, Volume 9: Mechanics of Solids, Structures, and Fluids, V009T11A057, November 11–14, 2019

Paper No: IMECE2019-11210

DOI: https://doi.org/10.1115/IMECE2019-11210

View Paper

Topics: Creep, Electron backscatter diffraction, Fatigue, Grain boundaries, Indium alloys

Proceedings Papers

Strain and Photovoltaic Sensitivities of Dumbbell-Shape GNR-Base Sensors

Jowesh Avisheik Goundar, Takuya Kudo, Qinqiang Zhang, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A016, November 11–14, 2019

Paper No: IMECE2019-11076

DOI: https://doi.org/10.1115/IMECE2019-11076

View Paper

Topics: Graphene, Sensors, Shapes

Proceedings Papers

First Principle Analysis of the Effect of Strain on Electronic Transport Properties of Dumbbell-Shape Graphene Nanoribbons

Takuya Kudo, Qinqiang Zhang, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A010, November 11–14, 2019

Paper No: IMECE2019-11107

DOI: https://doi.org/10.1115/IMECE2019-11107

View Paper

Topics: Graphene, Shapes

Proceedings Papers

Measurement of the Residual Stress Distribution in the 3D-Stacked Electronic Modules by Embedded Strain Sensors

Ryota Mizuno, Genta Nakauchi, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A013, November 11–14, 2019

Paper No: IMECE2019-11106

DOI: https://doi.org/10.1115/IMECE2019-11106

View Paper

Topics: Copper, Silicon, Strain sensors, Stress, Stress concentration, Thin films

Proceedings Papers

Area-Arrayed Graphene Nano-Ribbon-Base Strain Sensor

Ryohei Nakagawa, Zhi Wang, Ken Suzuki

Proc. ASME. IMECE2018, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A008, November 9–15, 2018

Paper No: IMECE2018-87277

DOI: https://doi.org/10.1115/IMECE2018-87277

View Paper

Topics: Graphene, Strain sensors, Chemical vapor deposition, Sensors, Plasma desorption mass spectrometry, Stress concentration, Copper foil, Design, Electrodes, Manufacturing

Proceedings Papers

Theoretical Study of Electronic Band Structure of Dumbbell-Shape Graphene Nanoribbons for Highly-Sensitive Strain Sensors

Qinqiang Zhang, Takuya Kudo, Ken Suzuki

Proc. ASME. IMECE2018, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A010, November 9–15, 2018

Paper No: IMECE2018-88431

DOI: https://doi.org/10.1115/IMECE2018-88431

View Paper

Topics: Graphene, Shapes, Strain sensors, Energy gap, Molecular orbitals, Composite materials, Computational methods, Electrodes

Proceedings Papers

Photosensitivity of Monolayer Graphene-Base Field Effect Transistor

Jowesh Avisheik Goundar, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2018, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A013, November 9–15, 2018

Paper No: IMECE2018-87245

DOI: https://doi.org/10.1115/IMECE2018-87245

View Paper

Topics: Graphene, Transistors, Temperature, Chemical vapor deposition, Silicon, Brightness (Photometry), Cathode ray oscilloscopes, Copper foil, Electrodes, Electron beams

Proceedings Papers

Development of a Flexible Tactile Sensor Using Area-Arrayed Bundle Structures of Multi-Walled Carbon Nanotubes

Ryusaku Osada, Ken Suzuki

Proc. ASME. IMECE2018, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A002, November 9–15, 2018

Paper No: IMECE2018-87275

DOI: https://doi.org/10.1115/IMECE2018-87275

View Paper

Topics: Multi-walled carbon nanotubes, Tactile sensors, Robots, Chemical vapor deposition, Deformation, Plasma desorption mass spectrometry, Pressure, Resolution (Optics), Sensors, Surgery

2 3 4

Journal citation

NARROW

Detachable Fine Bump Connection Using Multi-Walled Carbon-Nanotube Bundles for 3D Semiconductor Modules

Acceleration Mechanism of Intergranular Cracking of SUS316L Under Creep-Fatigue Loading at Elevated Temperatures

Molecular Dynamics Analysis of the Acceleration of the Degradation of the Strength of a Grain Boundary Under Creep-Fatigue Loads

Effect of Tensile Strain on Electron Transport Properties of Dumbbell-Shape Graphene Nanoribbons With Metallic-Semiconducting Interfaces

Improvement in Photosensitivity of Dumbbell-Shaped Graphene Nanoribbon Structures by Using Asymmetric Metallization Technique

Creep-Fatigue Damage of Heat-Resistant Alloys Caused by the Local Lattice Mismatch-Induced Acceleration of the Generation and Accumulation of Dislocations and Vacancies

Non-Destructive Evaluation of the Degradation of Ni-Base Superalloy in the Air by Reflectance Spectrum Analysis

Molecular Dynamics Analysis of the Acceleration of Intergranular Cracking of Ni-Base Superalloy Caused by Accumulation of Vacancies and Dislocations Around Grain Boundaries

Theoretical Study of Heterojunction-Like Electronic Properties Between a Semiconductive Graphene Nanoribbon and a Metallic Graphene for Highly Sensitive Strain Sensors

Crystallinity Dependence of Grain and Grain Boundary Strength of a Bicrystal Structure of Copper

Development of a Strain-Controlled Graphene-Based Highly Sensitive Gas Sensor

Grain Boundary Cracking of Nickel-Based Alloy 625 Under Creep Loadings at Elevated Temperatures

Change of the Effective Strength of Grain Boundaries in Alloy 617 Under Creep-Fatigue Loadings at 800°C

Strain and Photovoltaic Sensitivities of Dumbbell-Shape GNR-Base Sensors

First Principle Analysis of the Effect of Strain on Electronic Transport Properties of Dumbbell-Shape Graphene Nanoribbons

Measurement of the Residual Stress Distribution in the 3D-Stacked Electronic Modules by Embedded Strain Sensors

Area-Arrayed Graphene Nano-Ribbon-Base Strain Sensor

Theoretical Study of Electronic Band Structure of Dumbbell-Shape Graphene Nanoribbons for Highly-Sensitive Strain Sensors

Photosensitivity of Monolayer Graphene-Base Field Effect Transistor

Development of a Flexible Tactile Sensor Using Area-Arrayed Bundle Structures of Multi-Walled Carbon Nanotubes

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only