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Proceedings Papers

Strain-Induced Change of Adsorption Behaviour of Gas Molecules on Graphene Analyzed by Density Functional Method

Meng Yin, Xiangyu Qiao, Qinqiang Zhang, Ken Suzuki, Lei Wang
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T13A005, October 30–November 3, 2022
Paper No: IMECE2022-94892
https://doi.org/10.1115/IMECE2022-94892
View Paper titled, Strain-Induced Change of Adsorption Behaviour of Gas Molecules on Graphene Analyzed by Density Functional Method
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Topics: Density functional theory, Graphene
Proceedings Papers

Improvement of the Sensitivity and Selectivity of Gas Molecules of Graphene-Base Gas Sensor With Carbon Nanotubes Under the Application of Strain

Yuto Hirose, Xiangyu Qiao, Wangyang Fu, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T13A013, October 30–November 3, 2022
Paper No: IMECE2022-95307
https://doi.org/10.1115/IMECE2022-95307
View Paper titled, Improvement of the Sensitivity and Selectivity of Gas Molecules of Graphene-Base Gas Sensor With Carbon Nanotubes Under the Application of Strain
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Topics: Carbon nanotubes, Graphene, Sensors
Proceedings Papers

Molecular Dynamics Analysis on the Degradation Mechanism of the Crystallinity and Strength of Grain Boundaries in Heat-Resistant Alloys Under Creep-Fatigue Loading at Elevated Temperature

Shogo Tezuka, Ken Suzuki
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A036, October 30–November 3, 2022
Paper No: IMECE2022-94286
https://doi.org/10.1115/IMECE2022-94286
View Paper titled, Molecular Dynamics Analysis on the Degradation Mechanism of the Crystallinity and Strength of Grain Boundaries in Heat-Resistant Alloys Under Creep-Fatigue Loading at Elevated Temperature
Open the PDF for Molecular Dynamics Analysis on the Degradation Mechanism of the Crystallinity and Strength of Grain Boundaries in Heat-Resistant Alloys Under Creep-Fatigue Loading at Elevated Temperature in another window
Topics: Alloys, Creep, Diffusion (Physics), Fatigue, Grain boundaries, Heat, Molecular dynamics, Stress, Temperature
Proceedings Papers

Prediction of the Generation of Intergranular Cracking in Stainless Steels Under Creep Loading at Elevated Temperatures

Ken Suzuki, Koki Nakayama, Ayumi Nakayama, Shogo Tezuka, Hideo Miura
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A038, October 30–November 3, 2022
Paper No: IMECE2022-94891
https://doi.org/10.1115/IMECE2022-94891
View Paper titled, Prediction of the Generation of Intergranular Cracking in Stainless Steels Under Creep Loading at Elevated Temperatures
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Topics: Cracking (Materials), Creep, Electron backscatter diffraction, Fracture (Process), Grain boundaries, Stainless steel, Stress, Temperature, Damage, Dislocations
Proceedings Papers

Creep-Fatigue Reliability Analysis Integrated With Surrogate Modelling: Application on Industrial Case Studies

Run-Zi Wang, Ken Suzuki, Hideo Miura, Xian-Cheng Zhang, Shan-Tung Tu
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T14A020, October 30–November 3, 2022
Paper No: IMECE2022-94273
https://doi.org/10.1115/IMECE2022-94273
View Paper titled, Creep-Fatigue Reliability Analysis Integrated With Surrogate Modelling: Application on Industrial Case Studies
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Topics: Creep, Event history analysis, Fatigue, Metamodeling
Proceedings Papers

Detachable Fine Bump Connection Using Multi-Walled Carbon-Nanotube Bundles for 3D Semiconductor Modules

Masasuke Kobayashi, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T13A005, November 1–5, 2021
Paper No: IMECE2021-70172
https://doi.org/10.1115/IMECE2021-70172
View Paper titled, Detachable Fine Bump Connection Using Multi-Walled Carbon-Nanotube Bundles for 3D Semiconductor Modules
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Topics: Carbon nanotubes, Ohmic contacts, Semiconductors (Materials), Multi-walled carbon nanotubes, Deformation, Silicon, Chemical vapor deposition, Compression, Contact resistance, Electrical properties
Proceedings Papers

Acceleration Mechanism of Intergranular Cracking of SUS316L Under Creep-Fatigue Loading at Elevated Temperatures

Yukako Takahashi, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A005, November 1–5, 2021
Paper No: IMECE2021-70108
https://doi.org/10.1115/IMECE2021-70108
View Paper titled, Acceleration Mechanism of Intergranular Cracking of SUS316L Under Creep-Fatigue Loading at Elevated Temperatures
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Topics: Creep, Electron backscatter diffraction, Fatigue, Fracture (Process), Temperature
Proceedings Papers

Molecular Dynamics Analysis of the Acceleration of the Degradation of the Strength of a Grain Boundary Under Creep-Fatigue Loads

Shujiroh Suzuki, Shogo Tezuka, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A053, November 1–5, 2021
Paper No: IMECE2021-70628
https://doi.org/10.1115/IMECE2021-70628
View Paper titled, Molecular Dynamics Analysis of the Acceleration of the Degradation of the Strength of a Grain Boundary Under Creep-Fatigue Loads
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Topics: Creep, Damage, Fatigue, Grain boundaries, Molecular dynamics, Stress, Superalloys
Proceedings Papers

Effect of Tensile Strain on Electron Transport Properties of Dumbbell-Shape Graphene Nanoribbons With Metallic-Semiconducting Interfaces

Ken Suzuki, Qinqiang Zhang, Xiangyu Qiao
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T13A003, November 1–5, 2021
Paper No: IMECE2021-70930
https://doi.org/10.1115/IMECE2021-70930
View Paper titled, Effect of Tensile Strain on Electron Transport Properties of Dumbbell-Shape Graphene Nanoribbons With Metallic-Semiconducting Interfaces
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Topics: Electron transport, Graphene, Shapes, Strain sensors
Proceedings Papers

Improvement in Photosensitivity of Dumbbell-Shaped Graphene Nanoribbon Structures by Using Asymmetric Metallization Technique

Jowesh Avisheik Goundar, Qiao Xiangyu, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T13A008, November 1–5, 2021
Paper No: IMECE2021-69917
https://doi.org/10.1115/IMECE2021-69917
View Paper titled, Improvement in Photosensitivity of Dumbbell-Shaped Graphene Nanoribbon Structures by Using Asymmetric Metallization Technique
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Topics: Graphene, Shapes
Proceedings Papers

Creep-Fatigue Damage of Heat-Resistant Alloys Caused by the Local Lattice Mismatch-Induced Acceleration of the Generation and Accumulation of Dislocations and Vacancies

Yifan Luo, Shogo Tezuka, Koki Nakayama, Ayumi Nakayama, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A051, November 1–5, 2021
Paper No: IMECE2021-68489
https://doi.org/10.1115/IMECE2021-68489
View Paper titled, Creep-Fatigue Damage of Heat-Resistant Alloys Caused by the Local Lattice Mismatch-Induced Acceleration of the Generation and Accumulation of Dislocations and Vacancies
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Topics: Alloys, Creep, Damage, Dislocations, Electron backscatter diffraction, Fatigue, Grain boundaries, Heat, Stress, Diffusion (Physics)
Proceedings Papers

Development of a Strain-Controlled Graphene-Based Highly Sensitive Gas Sensor

Xiangyu Qiao, Qinqiang Zhang, Ken Suzuki
Proc. ASME. IMECE2020, Volume 3: Advanced Materials: Design, Processing, Characterization, and Applications, V003T03A039, November 16–19, 2020
Paper No: IMECE2020-23581
https://doi.org/10.1115/IMECE2020-23581
View Paper titled, Development of a Strain-Controlled Graphene-Based Highly Sensitive Gas Sensor
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Topics: Desorption, Graphene, Sensors
Proceedings Papers

Theoretical Study of Heterojunction-Like Electronic Properties Between a Semiconductive Graphene Nanoribbon and a Metallic Graphene for Highly Sensitive Strain Sensors

Qinqiang Zhang, Xiangyu Qiao, Masasuke Kobayashi, Ken Suzuki
Proc. ASME. IMECE2020, Volume 13: Micro- and Nano-Systems Engineering and Packaging, V013T13A005, November 16–19, 2020
Paper No: IMECE2020-23782
https://doi.org/10.1115/IMECE2020-23782
View Paper titled, Theoretical Study of Heterojunction-Like Electronic Properties Between a Semiconductive Graphene Nanoribbon and a Metallic Graphene for Highly Sensitive Strain Sensors
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Topics: Electron transport, Graphene, Shapes, Strain sensors
Proceedings Papers

Crystallinity Dependence of Grain and Grain Boundary Strength of a Bicrystal Structure of Copper

Ken Suzuki, Yiqing Fan, Yifan Luo
Proc. ASME. IMECE2020, Volume 13: Micro- and Nano-Systems Engineering and Packaging, V013T13A004, November 16–19, 2020
Paper No: IMECE2020-23757
https://doi.org/10.1115/IMECE2020-23757
View Paper titled, Crystallinity Dependence of Grain and Grain Boundary Strength of a Bicrystal Structure of Copper
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Topics: Copper, Grain boundaries, Molecular dynamics
Proceedings Papers

Non-Destructive Evaluation of the Degradation of Ni-Base Superalloy in the Air by Reflectance Spectrum Analysis

Shin Kasama, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A014, November 16–19, 2020
Paper No: IMECE2020-23354
https://doi.org/10.1115/IMECE2020-23354
View Paper titled, Non-Destructive Evaluation of the Degradation of Ni-Base Superalloy in the Air by Reflectance Spectrum Analysis
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Topics: Creep, Damage, Emission spectroscopy, Fatigue, Nondestructive evaluation, Reflectance, Spectroscopy, Superalloys
Proceedings Papers

Molecular Dynamics Analysis of the Acceleration of Intergranular Cracking of Ni-Base Superalloy Caused by Accumulation of Vacancies and Dislocations Around Grain Boundaries

Ryo Kikuchi, Shujiro Suzuki, Ken Suzuki
Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A059, November 16–19, 2020
Paper No: IMECE2020-23352
https://doi.org/10.1115/IMECE2020-23352
View Paper titled, Molecular Dynamics Analysis of the Acceleration of Intergranular Cracking of Ni-Base Superalloy Caused by Accumulation of Vacancies and Dislocations Around Grain Boundaries
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Topics: Creep, Dislocations, Fatigue, Fracture (Process), Grain boundaries, Molecular dynamics, Superalloys
Proceedings Papers

Grain Boundary Cracking of Nickel-Based Alloy 625 Under Creep Loadings at Elevated Temperatures

Yan Liang, Yifan Luo, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2019, Volume 9: Mechanics of Solids, Structures, and Fluids, V009T11A056, November 11–14, 2019
Paper No: IMECE2019-11186
https://doi.org/10.1115/IMECE2019-11186
View Paper titled, Grain Boundary Cracking of Nickel-Based Alloy 625 Under Creep Loadings at Elevated Temperatures
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Topics: Alloys, Cracking (Materials), Creep, Damage, Electron backscatter diffraction, Fracture (Materials), Fracture (Process), Grain boundaries, Nickel, Temperature
Proceedings Papers

Change of the Effective Strength of Grain Boundaries in Alloy 617 Under Creep-Fatigue Loadings at 800°C

Wataru Suzuki, Kenta Ishihara, Ryo Kikuchi, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2019, Volume 9: Mechanics of Solids, Structures, and Fluids, V009T11A057, November 11–14, 2019
Paper No: IMECE2019-11210
https://doi.org/10.1115/IMECE2019-11210
View Paper titled, Change of the Effective Strength of Grain Boundaries in Alloy 617 Under Creep-Fatigue Loadings at 800°C
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Topics: Creep, Electron backscatter diffraction, Fatigue, Grain boundaries, Indium alloys
Proceedings Papers

Strain and Photovoltaic Sensitivities of Dumbbell-Shape GNR-Base Sensors

Jowesh Avisheik Goundar, Takuya Kudo, Qinqiang Zhang, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A016, November 11–14, 2019
Paper No: IMECE2019-11076
https://doi.org/10.1115/IMECE2019-11076
View Paper titled, Strain and Photovoltaic Sensitivities of Dumbbell-Shape GNR-Base Sensors
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Topics: Graphene, Sensors, Shapes
Proceedings Papers

First Principle Analysis of the Effect of Strain on Electronic Transport Properties of Dumbbell-Shape Graphene Nanoribbons

Takuya Kudo, Qinqiang Zhang, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A010, November 11–14, 2019
Paper No: IMECE2019-11107
https://doi.org/10.1115/IMECE2019-11107
View Paper titled, First Principle Analysis of the Effect of Strain on Electronic Transport Properties of Dumbbell-Shape Graphene Nanoribbons
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Topics: Graphene, Shapes