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Proceedings Papers

Fast and Accurate Simulation of Heat Transfer in Microarchitectures Using Frequency Domain Techniques

Keivan Etessam-Yazdani, Hendrik F. Hamann, Mehdi Asheghi

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 445-449, July 8–12, 2007

Paper No: IPACK2007-33796

DOI: https://doi.org/10.1115/IPACK2007-33796

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Topics: Heat transfer, Simulation, Computation, Finite element methods, Frequency-domain analysis, Numerical analysis, Temperature profiles

Proceedings Papers

Spatial Frequency Domain Analysis of Heat Transfer in Microelectronic Chips With Applications to Temperature Aware Computing

Keivan Etessam-Yazdani, Hendrik F. Hamann, Mehdi Asheghi

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 1033-1040, July 8–12, 2007

Paper No: IPACK2007-33793

DOI: https://doi.org/10.1115/IPACK2007-33793

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Topics: Cooling, Frequency-domain analysis, Heat, Heat transfer, Packaging, Temperature, Thermal diffusion, Thermal energy, Transfer functions

Proceedings Papers

Experimental Investigation of Scaling Effect on Thermal Transport in Nanoscale Hotspots

Keivan Etessam-Yazdani, Mehdi Asheghi, Hendrik F. Hamann

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 349-356, July 8–12, 2007

Paper No: HT2007-32868

DOI: https://doi.org/10.1115/HT2007-32868

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Topics: Dimensions, Electrical resistance, Heating, Joules, Nanoscale phenomena, Platinum, Sensors, Silicon, Temperature distribution, Temperature measurement

Proceedings Papers

Evaluation of Thermal Characterization Techniques and Tools for Thermal Conductivity Measurement of Sub 100 Angstrom Thick Silicon Layers

Keivan Etessam-Yazdani, Mehdi Asheghi

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 937-941, July 8–12, 2007

Paper No: HT2007-32904

DOI: https://doi.org/10.1115/HT2007-32904

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Topics: Silicon, Thermal characterization, Thermal conductivity measurement, Bridges (Structures), Heating, Joules, Metals, Phonons, Steady state, Temperature measurement

Proceedings Papers

Impact of Thermal Sub-Continuum Effects on Electrical Performance of Silicon-on-Insulator Transistors

Keivan Etessam-Yazdani, Rozana Hussin, Mehdi Asheghi

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2087-2095, July 17–22, 2005

Paper No: IPACK2005-73182

DOI: https://doi.org/10.1115/IPACK2005-73182

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Topics: Silicon-on-insulator, Transistors, Heating, Gates (Closures), Electromagnetic scattering, Phonons, Radiation scattering, Scattering (Physics), Silicon, Simulation

Proceedings Papers

Modeling of Localized Heating Effect in Sub-Micron Silicon Transistors

Keivan Etessam-Yazdani, Sadegh M. Sadeghipour, Mehdi Asheghi

Proc. ASME. HT2003, Heat Transfer: Volume 1, 93-96, July 21–23, 2003

Paper No: HT2003-47272

DOI: https://doi.org/10.1115/HT2003-47272

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Topics: Heating, Modeling, Silicon, Transistors, Phonons, Dimensions, Boundary-value problems, Electrons, Geometry, Heat

Proceedings Papers

Thermal Transport in Novel Silicon Transistors

Keivan Etessam-Yazdani, Wenjun Liu, Yizhang Yang, Mehdi Asheghi

Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 297-306, November 13–19, 2004

Paper No: IMECE2004-62238

DOI: https://doi.org/10.1115/IMECE2004-62238

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Topics: Silicon, Transistors, Silicon-on-insulator, Gates (Closures), Thermal conductivity, Complementary metal oxide semiconductors, Heating, Interface roughness, Nanoscale phenomena, Phonons

Journal citation

NARROW

Fast and Accurate Simulation of Heat Transfer in Microarchitectures Using Frequency Domain Techniques

Spatial Frequency Domain Analysis of Heat Transfer in Microelectronic Chips With Applications to Temperature Aware Computing

Experimental Investigation of Scaling Effect on Thermal Transport in Nanoscale Hotspots

Evaluation of Thermal Characterization Techniques and Tools for Thermal Conductivity Measurement of Sub 100 Angstrom Thick Silicon Layers

Impact of Thermal Sub-Continuum Effects on Electrical Performance of Silicon-on-Insulator Transistors

Modeling of Localized Heating Effect in Sub-Micron Silicon Transistors

Thermal Transport in Novel Silicon Transistors

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Fast and Accurate Simulation of Heat Transfer in Microarchitectures Using Frequency Domain Techniques

Spatial Frequency Domain Analysis of Heat Transfer in Microelectronic Chips With Applications to Temperature Aware Computing

Experimental Investigation of Scaling Effect on Thermal Transport in Nanoscale Hotspots

Evaluation of Thermal Characterization Techniques and Tools for Thermal Conductivity Measurement of Sub 100 Angstrom Thick Silicon Layers

Impact of Thermal Sub-Continuum Effects on Electrical Performance of Silicon-on-Insulator Transistors

Modeling of Localized Heating Effect in Sub-Micron Silicon Transistors

Thermal Transport in Novel Silicon Transistors

Journals

Conference Proceedings

eBooks

Resources

Opportunities

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