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Proceedings Papers

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Kaiser Matin, Avram Bar-Cohen, Joseph J. Maurer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A024, July 6–9, 2015
Paper No: IPACK2015-48334
DOI: https://doi.org/10.1115/IPACK2015-48334
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Topics: Cooling, Modeling, Simulation, Critical heat flux, Corrosion, Design, Electrodiffusion, Erosion, Fluids, Gallium nitride
Journal Articles

Nanothermal Interface Materials: Technology Review and Recent Results

Avram Bar-Cohen, Kaiser Matin, Sreekant Narumanchi
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. December 2015, 137(4): 040803.
Paper No: EP-15-1063
DOI: https://doi.org/10.1115/1.4031602
Published Online: October 9, 2015
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Topics: Copper, Cycles, Electrical resistivity, Solders, Teams, Temperature, Testing, Thermal resistance, Bonding, Accelerated life testing
Journal Articles

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski, Darin Sharar
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. March 2015, 137(1): 010801.
Paper No: EP-14-1069
DOI: https://doi.org/10.1115/1.4028890
Published Online: November 14, 2014
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Topics: Cooling, Copper, Flat heat pipes, Fluids, Heat, Heat pipes, Silicon, Stress, Teams, Thermal conductivity