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Proceedings Papers

Thermodynamic Assessment of Sn-Co-Cu Lead-Free Solder Alloy

Libin Liu, Cristina Andersson, Johan Liu, Y. C. Chan
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 141-145, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35126
https://doi.org/10.1115/IPACK2003-35126
View Paper titled, Thermodynamic Assessment of Sn-Co-Cu Lead-Free Solder Alloy
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Topics: Alloys, Lead-free solders, Phase diagrams, Tin
Proceedings Papers

Characterisation of Anisotropic Conductive Adhesive Compression During the Assembly Process

David C. Whalley, Helge Kristiansen, Johan Liu
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 183-189, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35238
https://doi.org/10.1115/IPACK2003-35238
View Paper titled, Characterisation of Anisotropic Conductive Adhesive Compression During the Assembly Process
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Topics: Adhesives, Anisotropy, Compression, Manufacturing, Flow (Dynamics), Particulate matter, Resins, Actuators, Adhesive resins, Capacitance
Journal Articles

Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load

Yan Zhang, Johan Liu, Ragnar Larsson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021010.
https://doi.org/10.1115/1.2912183
Published Online: May 15, 2008
View Article titled, Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load
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Topics: Ball-Grid-Array packaging, Computer simulation, Deformation, Diffraction patterns, Displacement, Interferometers, Modeling, Solders, Stress, Manufacturing
Journal Articles

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Caroline Chen, Zonghe Lai, Zhaonian Cheng, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 177–183.
https://doi.org/10.1115/1.2227057
Published Online: August 7, 2005
View Article titled, Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
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Topics: Adhesives, Contact resistance, Finite element methods, Flip-chip devices, Reliability, Simulation, Stress, Temperature, Warping, Flip-chip
Journal Articles

Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate

Liqiang Cao, Zonghe Lai, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 43–46.
https://doi.org/10.1115/1.1846066
Published Online: March 21, 2005
View Article titled, Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate
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Topics: Adhesion, Adhesives, Anisotropy, Testing, Fracture toughness, Reliability, Pressure
Journal Articles

Characterization of Substrate Materials for System-in-a-Package Applications

Liu Chen, Anders S. G. Andræ, Gang Zou, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 195–201.
https://doi.org/10.1115/1.1648057
Published Online: July 8, 2004
View Article titled, Characterization of Substrate Materials for System-in-a-Package Applications
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Topics: Ceramics, Cooling, Density, Epoxy resins, Finite element methods, Manufacturing, Microwaves, Reliability, System-in-package, Thermal expansion
Journal Articles

Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles

G. B. Dou, Y. C. Chan, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 609–616.
https://doi.org/10.1115/1.1604808
Published Online: December 15, 2003
View Article titled, Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles
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Topics: Particulate matter, Nickel
Journal Articles

Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate

Johan Liu, Zonghe Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 240–245.
https://doi.org/10.1115/1.1478059
Published Online: July 26, 2002
View Article titled, Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate
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Topics: Adhesive joints, Adhesives, Contact resistance, Cycles, Failure, Flip-chip, Reliability, Temperature, Testing, Electrical resistance