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Proceedings Papers

Investigation of Vaned Diffuser Splitters on the Performance and Flow Control of High Pressure Ratio Centrifugal Compressors

Xiao He, Xinqian Zheng, Jie Wei, Hanxuan Zeng
Proc. ASME. GT2016, Volume 2D: Turbomachinery, V02DT42A008, June 13–17, 2016
Paper No: GT2016-56255
DOI: https://doi.org/10.1115/GT2016-56255
View Paper titled, Investigation of Vaned Diffuser Splitters on the Performance and Flow Control of High Pressure Ratio Centrifugal Compressors
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Topics: Compressors, Diffusers, Flow control, High pressure (Physics), Shock (Mechanics), Flow separation, Chords (Trusses), Flow (Dynamics), Pressure, Design
Proceedings Papers

Hybrid Cooling Technology for Large-Scale Computing Systems: From Back to the Future

Jie Wei
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 107-111, July 6–8, 2011
Paper No: IPACK2011-52045
DOI: https://doi.org/10.1115/IPACK2011-52045
View Paper titled, Hybrid Cooling Technology for Large-Scale Computing Systems: From Back to the Future
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Topics: Cooling, Water, Convection, Architecture, Cooling systems, Design, Energy consumption, Flow (Dynamics), Low temperature, Maintainability
Proceedings Papers

Design of the Moderator and Cryogenic System for Generating Cold-Neutrons at the CPHS

Qixi Feng, Quanke Feng, Bin Zhong, Tianjiao Liang, Takeshi Kawai, Jie Wei, C.-K. Loong
Proc. ASME. ICONE18, 18th International Conference on Nuclear Engineering: Volume 3, 171-173, May 17–21, 2010
Paper No: ICONE18-29492
DOI: https://doi.org/10.1115/ICONE18-29492
View Paper titled, Design of the Moderator and Cryogenic System for Generating Cold-Neutrons at the CPHS
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Topics: Design, Neutrons, Neutron sources, Hadrons, Materials characterization, Methane, Neutron diffraction, Optimization, Proton beams, Resolution (Optics)
Proceedings Papers

Challenges in Package Cooling of High Performance Servers

Jie Wei
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 501-507, July 8–12, 2007
Paper No: IPACK2007-33637
DOI: https://doi.org/10.1115/IPACK2007-33637
View Paper titled, Challenges in Package Cooling of High Performance Servers
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Topics: Cooling, Composite materials, Energy dissipation, Heat, Thermal conductivity, Density, Diamonds, Flat heat pipes, Heat conduction, Heat pipes
Proceedings Papers

Monitoring Acoustic Noise in Steel Pipelines

Dieter Meinert, Michael Gorny, Ansgar Pollmann, Jie-Wei Chen, Andrea Garbi
Proc. ASME. IPC2008, 2008 7th International Pipeline Conference, Volume 1, 509-516, September 29–October 3, 2008
Paper No: IPC2008-64115
DOI: https://doi.org/10.1115/IPC2008-64115
View Paper titled, Monitoring Acoustic Noise in Steel Pipelines
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Topics: Acoustics, Noise (Sound), Pipelines, Steel, Damage, Inspection, Pipes, Sensors
Proceedings Papers

Assessing Capabilities and Limitations of Air- and Liquid-Cooling for Low Profile Servers

Albert Chan, Jie Wei
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 445-450, July 17–22, 2005
Paper No: IPACK2005-73293
DOI: https://doi.org/10.1115/IPACK2005-73293
View Paper titled, Assessing Capabilities and Limitations of Air- and Liquid-Cooling for Low Profile Servers
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Topics: Cooling
Proceedings Papers

Thermal Management of Fujitsu High-End Unix Servers

Jie Wei, Masahiro Suzuki
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 469-475, July 17–22, 2005
Paper No: IPACK2005-73313
DOI: https://doi.org/10.1115/IPACK2005-73313
View Paper titled, Thermal Management of Fujitsu High-End Unix Servers
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Topics: Computers, Cooling, Thermal management
Proceedings Papers

Thermal Design and Packaging of a Prototype Refrigeration Cooling System for CMOS-Based MCMs

Jie Wei, Hideo Kubo, Junichi Ishimine
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 351-356, July 6–11, 2003
Paper No: IPACK2003-35156
DOI: https://doi.org/10.1115/IPACK2003-35156
View Paper titled, Thermal Design and Packaging of a Prototype Refrigeration Cooling System for CMOS-Based MCMs
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Topics: Complementary metal oxide semiconductors, Cooling, Cooling systems, Design, Engineering prototypes, Low temperature, Packaging, Refrigeration
Proceedings Papers

Study on Alternative Cooling Methods Beyond Next Generation Microprocessors

Albert Chan, Jie Wei
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 97-102, July 6–11, 2003
Paper No: IPACK2003-35041
DOI: https://doi.org/10.1115/IPACK2003-35041
View Paper titled, Study on Alternative Cooling Methods Beyond Next Generation Microprocessors
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Topics: Cooling, Heat sinks, Refrigeration