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Proceedings Papers

Tenocytes, Phenotypes, Biomarkers and Functions: Roles in Bioartificial Tendons

A. J. Banes, J. Qi, J. M. Dmochowski, M. Tsuzaki, A. N. Banes, D. Bynum, S. Gomez, M. E. Wall
Proc. ASME. SBC2011, ASME 2011 Summer Bioengineering Conference, Parts A and B, 673-674, June 22–25, 2011
Paper No: SBC2011-53656
DOI: https://doi.org/10.1115/SBC2011-53656
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Topics: Tendons, Bone, Blood vessels, Cartilage, Muscle
Proceedings Papers

Incorporating Cost and Resource Efficiency Into the Development of Green Recycling Technologies

Q. Z. Yang, G. J. Qi, H. C. Low
Proc. ASME. IDETC-CIE2010, Volume 6: 15th Design for Manufacturing and the Lifecycle Conference; 7th Symposium on International Design and Design Education, 483-490, August 15–18, 2010
Paper No: DETC2010-29138
DOI: https://doi.org/10.1115/DETC2010-29138
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Topics: Nickel, Recycling
Proceedings Papers

Use of Printed Circuit Board as Electrode in EHD-Enhanced Condensation Experiments for a Shell/Tube Bundle Heat Exchanger

J. Wu, M. M. Ohadi, S. Dessiatoun, J. Qi
Proc. ASME. HT2005, Heat Transfer: Volume 2, 589-592, July 17–22, 2005
Paper No: HT2005-72832
DOI: https://doi.org/10.1115/HT2005-72832
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Topics: Condensation, Electrodes, Heat exchangers, Printed circuit boards, Shells, Electric fields, Electrohydrodynamics, Heat flux, Heat transfer, Refrigerants
Proceedings Papers

A Packaging Solution for Pressure Sensor MEMS

J. Wei, G. J. Qi, Z. F. Wang, Y. F. Jin, P. C. Lim, C. K. Wong
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 113-118, November 15–21, 2003
Paper No: IMECE2003-42824
DOI: https://doi.org/10.1115/IMECE2003-42824
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Topics: Bonding, Etching, Microelectromechanical systems, Packaging, Pressure sensors, Semiconductor wafers, Vacuum
Proceedings Papers

Electrohydrodynamically (EHD) Augmented External Condensation for R-134a in a Tube Bundle Heat Exchanger

J. Wu, M. M. Ohadi, S. Thorpe, J. Qi
Proc. ASME. IMECE2003, Heat Transfer, Volume 4, 123-128, November 15–21, 2003
Paper No: IMECE2003-42351
DOI: https://doi.org/10.1115/IMECE2003-42351
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Topics: Condensation, Heat exchangers, Heat transfer, Electric fields, Condensers (steam plant), Electrohydrodynamics, Heat flux, Heat transfer coefficients, Refrigerants, Temperature
Journal Articles

Constitutive Modeling of the Stress-Stretch Behavior of Two-Dimensional Triangulated Macromolecular Networks Containing Folded Domains

M. Arslan, M. C. Boyce, H. J. Qi, C. Ortiz
Journal: Journal of Applied Mechanics
Article Type: Research Papers
J. Appl. Mech. January 2008, 75(1): 011020.
DOI: https://doi.org/10.1115/1.2745373
Published Online: February 6, 2008
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Topics: Chain, Deformation, Membranes, Stress, Tension, Shear (Mechanics), Constitutive equations, Erythrocytes, Density, Lipid bilayers
Proceedings Papers

Thermal Performance of Micro-Structured Evaporation Surfaces: Application to Cooling of High Flux Microelectronics

E. Al-Hajri, M. Ohadi, S. V. Dessiatoun, J. Qi
Proc. ASME. IMECE2005, Heat Transfer, Part A, 799-805, November 5–11, 2005
Paper No: IMECE2005-82583
DOI: https://doi.org/10.1115/IMECE2005-82583
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Topics: Cooling, Evaporation, Microelectronic devices, Copper, Heat transfer coefficients, Pool boiling, Density, Electronics, Fluids, Forced convection
Proceedings Papers

Experimental Study on Embedded-Wire Electrode for EHD-Enhanced Condensation in a Shell/Tube Bundle Heat Exchanger

J. Wu, M. M. Ohadi, S. Dessiatoun, J. Qi
Proc. ASME. IMECE2005, Heat Transfer, Part B, 311-315, November 5–11, 2005
Paper No: IMECE2005-81815
DOI: https://doi.org/10.1115/IMECE2005-81815
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Topics: Condensation, Electrodes, Heat exchangers, Shells, Wire, Heat transfer, Condensed matter, Floods, Heat transfer coefficients, Printed circuit boards