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J. Punch
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Proceedings Papers
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 865-875, July 19–23, 2009
Paper No: HT2009-88279
Proceedings Papers
An Experimental Characterization of Miniature Scale Cold Plates for Electronics Cooling Applications
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3, 267-274, July 8–12, 2007
Paper No: HT2007-32537
Proceedings Papers
An Investigation of Thermal and Velocity Fields for a Confined Jet Over the RE Range of 1,000-24,000
Proc. ASME. HT2008, Heat Transfer: Volume 2, 709-717, August 10–14, 2008
Paper No: HT2008-56220
Proceedings Papers
Proc. ASME. HT2005, Heat Transfer: Volume 4, 549-552, July 17–22, 2005
Paper No: HT2005-72514
Proceedings Papers
M. Reid, J. Punch, B. Rodgers, T. Galkin, T. Stenberg, O. Rusanenc, E. Elonen, M. Vile`n, K. Va¨keva¨inen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1271-1276, July 17–22, 2005
Paper No: IPACK2005-73353
Proceedings Papers
Proc. ASME. IMECE2006, Fluids Engineering, 81-87, November 5–10, 2006
Paper No: IMECE2006-14283
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 112–119.
Published Online: October 2, 2000