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Proceedings Papers

Additively Printed Flexible Temperature Sensor for Wearable Applications

Pradeep Lall, Hyesoo Jang, Jinesh Narangaparambil, Kartik Goyal, Curtis Hill
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 26–28, 2021
Paper No: IPACK2021-74071
DOI: https://doi.org/10.1115/IPACK2021-74071
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Topics: Reliability, Temperature sensors
Proceedings Papers

Reliability and SOH Degradation of Thin Li-ion Batteries Under Various Flexing Conditions

Pradeep Lall, Hyesoo Jang, Ved Soni, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 26–28, 2021
Paper No: IPACK2021-74065
DOI: https://doi.org/10.1115/IPACK2021-74065
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Topics: Batteries, Lithium-ion batteries, Reliability
Proceedings Papers

Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition

Pradeep Lall, Hyesoo Jang, Curtis Hill, Libby Creel
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 27–29, 2020
Paper No: IPACK2020-2644
DOI: https://doi.org/10.1115/IPACK2020-2644
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Topics: Biometry, Fatigue life, Flexible electronics, Reliability, Sensors
Proceedings Papers

Twist Reliability Assessment of Flexible Battery in Wearable Applications

Pradeep Lall, Hyesoo Jang, Scott Miller
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 27–29, 2020
Paper No: IPACK2020-2647
DOI: https://doi.org/10.1115/IPACK2020-2647
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Topics: Batteries, Reliability
Proceedings Papers

Folding-Reliability of Flexible Electronics in Wearable Applications

Pradeep Lall, Hyesoo Jang, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, October 7–9, 2019
Paper No: IPACK2019-6584
DOI: https://doi.org/10.1115/IPACK2019-6584
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Topics: Fatigue life, Flexible electronics, Reliability, Electronics, Stress, Failure mechanisms, Experimental analysis, Failure analysis, Robustness, Skin