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1-7 of 7
Hamza Salih Erden
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031116.
Paper No: EP-20-1018
Published Online: August 5, 2020
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6309
Proceedings Papers
Parameter Estimation for Lumped Capacitance Modeling of CRAH Units During Chilled Water Interruption
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A026, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48430
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031005.
Paper No: EP-13-1107
Published Online: May 5, 2014
Proceedings Papers
Dale C. Ringham, Dan J. Rice, Brian S. Granetz, Hamza Salih Erden, H. Ezzat Khalifa, Roger R. Schmidt
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A022, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73268
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A023, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73281
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A024, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73282