Search Results | ASME Digital Collection

1-20 of 37

Sort by

Sort Order Select

Proceedings Papers

Evaluation of Electromigration Coupling Different Physics Fields in Numerical Simulation

Chongyang Cai, Jiefeng Xu, Yangyang Lai, Junbo Yang, Huayan Wang, Suresh Ramalingam, Gamal Refai-Ahmed, Seungbae Park

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 25–27, 2022

Paper No: IPACK2022-97338

DOI: https://doi.org/10.1115/IPACK2022-97338

View Paper

Journal Articles

Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks

Yaser Hadad, Vahideh Radmard, Srikanth Rangarajan, Mahdi Farahikia, Gamal Refai-Ahmed, Paul R. Chiarot, Bahgat Sammakia

J. Electron. Packag. June 2021, 143(2): 021007.

Paper No: EP-19-1111

DOI: https://doi.org/10.1115/1.4048590

Published Online: October 30, 2020

View Article

Topics: Design, Electrical resistivity, Flow (Dynamics), Pumps, Temperature, Optimization, Microchannels, Coolants, Pareto optimization, Heat flux

Proceedings Papers

Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications

Suresh Parameswaran, Gamal Refai-Ahmed, Suresh Ramalingam, Boon Ang

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, August 27–30, 2018

Paper No: IPACK2018-8300

DOI: https://doi.org/10.1115/IPACK2018-8300

View Paper

Topics: Internet of things, Stress, Vehicles, Circuits, Computer software, Cooling, Cycles, Energy dissipation, Flip-chip packages, Modeling

Journal Articles

Solving Thermal Issues in a Three-Dimensional-Stacked-Quad-Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through-Silicon-Vias

Anjali Chauhan, Bahgat Sammakia, Furat F. Afram, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer

J. Electron. Packag. December 2013, 135(4): 041006.

Paper No: EP-12-1106

DOI: https://doi.org/10.1115/1.4025531

Published Online: November 5, 2013

View Article

Topics: Cooling, Flow (Dynamics), Heat sinks, Microchannels, Temperature

Journal Articles

High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices

Maxat N. Touzelbaev, Josef Miler, Yizhang Yang, Gamal Refai-Ahmed, Kenneth E. Goodson

J. Electron. Packag. September 2013, 135(3): 031001.

Paper No: EP-12-1066

DOI: https://doi.org/10.1115/1.4024747

Published Online: July 24, 2013

View Article

Topics: Filters, Modeling, Temperature, Thermal management, Transfer functions, Transients (Dynamics), Geometry, Filtration

Proceedings Papers

Liquid Cooling of a Stacked Quad-Core Processor and DRAM Using Laminar Flow in Microchannels

Anjali Chauhan, Bahgat Sammakia, Furat F. Afram, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 927-940, November 11–17, 2011

Paper No: IMECE2011-65866

DOI: https://doi.org/10.1115/IMECE2011-65866

View Paper

Topics: Cooling, Laminar flow, Microchannels, Flow (Dynamics), Heat sinks, Thermal resistance, Delays, Design, Energy dissipation, Reliability

Proceedings Papers

Thermal-Aware Power Migration in Many-Core Processors

Avinash Raghu, Saket Karajgikar, Dereje Agonafer, Bahgat Sammakia, Gamal Refai-Ahmed

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 385-392, November 12–18, 2010

Paper No: IMECE2010-40232

DOI: https://doi.org/10.1115/IMECE2010-40232

View Paper

Topics: Computation, Cooling, Currents, Design, Junctions, Leakage, Reliability, Temperature, Thermal management

Proceedings Papers

Fast Prediction of Temperature Evolution in Electronic Devices for Run-Time Thermal Management Applications

Yizhang Yang, Sridhar Sundaram, Gamal Refai-Ahmed, Maxat Touzelbaev

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 245-251, November 12–18, 2010

Paper No: IMECE2010-40462

DOI: https://doi.org/10.1115/IMECE2010-40462

View Paper

Topics: Temperature, Thermal management, Algorithms, Computation, Finite element model, Electronic systems, Excitation, Filters, Heat, Impulse (Physics)

Journal Articles

Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar, Gamal Refai-Ahmed

J. Electron. Packag. March 2012, 134(1): 011009.

DOI: https://doi.org/10.1115/1.4006137

Published Online: March 21, 2012

View Article

Topics: Heat, Heating, Joules, Temperature, Transients (Dynamics), Transmission lines, Steady state, Resistors, Currents, Simulation

Proceedings Papers

Enhanced Thermal Map Prediction and Floor Plan Optimization in Electronic Devices Considering Sub-Continuum Thermal Effects

David Romero, Aydin Nabovati, Gamal Refai-Ahmed, Daniel P. Sellan, Saeed Ghalambor, Niket Shah, Dereje Agonafer, Cristina H. Amon

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 241-249, July 6–8, 2011

Paper No: IPACK2011-52161

DOI: https://doi.org/10.1115/IPACK2011-52161

View Paper

Topics: Optimization, Temperature effects, Thermal conductivity, Energy generation, Heat transfer, Reliability, Semiconductors (Materials), Simulation, Temperature gradient

Proceedings Papers

Robust Thermal Management for Embedded CPU and GPUs in Displays

Sung Ki Kim, Woo Young Kan, Sang Hak Kim, Vincent Tan, Gamal Refai-Ahmed, Ali Akbar Merrikh

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 7-11, July 6–8, 2011

Paper No: IPACK2011-52014

DOI: https://doi.org/10.1115/IPACK2011-52014

View Paper

Topics: Graphics processing units, Thermal management, Design, Reliability, Brightness (Photometry), Circuits, Corners (Structural elements), Energy dissipation, Heat, Manufacturing

Proceedings Papers

Single-Phase Microchannel Cooling for Stacked Single Core Chip and DRAM

Anjali Chauhan, Bahgat Sammakia, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer

Paper No: IPACK2011-52137

DOI: https://doi.org/10.1115/IPACK2011-52137

View Paper

Topics: Cooling, Microchannels, Heat sinks, Thermal management, Thermal resistance, Architecture, Cooling systems, Energy dissipation, Silicon

Proceedings Papers

Single-Phase Liquid Cooling of a Quad-Core Processor

Anjali Chauhan, Bahgat Sammakia, Furat F. Afram, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer

Paper No: IPACK2011-52139

DOI: https://doi.org/10.1115/IPACK2011-52139

View Paper

Topics: Cooling, Flow (Dynamics), Microchannels, Energy dissipation, Heat, Temperature, Cooling systems, Design, Engineering standards, Failure

Proceedings Papers

Reduced-Order Fluidic Model for Flow Instabilities in Two-Phase Microfluidic Heat Exchangers

Josef L. Miler, Gamal Refai-Ahmed, Maxat N. Touzelbaev, Milnes P. David, Julie E. Steinbrenner, Kenneth E. Goodson

Proc. ASME. ICNMM2010, ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels: Parts A and B, 155-161, August 1–5, 2010

Paper No: FEDSM-ICNMM2010-30878

DOI: https://doi.org/10.1115/FEDSM-ICNMM2010-30878

View Paper

Topics: Flow instability, Heat exchangers, Microfluidics, Bubbles, Flow (Dynamics), Circuits, Modeling, Transients (Dynamics), Boiling, Cooling

Proceedings Papers

Effects of Transient Heating on Two-Phase Flow Response in Microchannel Heat Exchangers

Josef L. Miler, Roger Flynn, Gamal Refai-Ahmed, Maxat Touzelbaev, Milnes David, Julie Steinbrenner, Kenneth E. Goodson

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 563-569, July 19–23, 2009

Paper No: InterPACK2009-89325

DOI: https://doi.org/10.1115/InterPACK2009-89325

View Paper

Topics: Heat exchangers, Microchannels, Transient heat transfer, Two-phase flow, Heating, Bubbles, Heat sinks, Microfluidics, Nucleation (Physics), Steady state

Proceedings Papers

Multi-Objective Optimization of Graphite Heat Spreader for Portable Systems Applications

Nikhil Lakhkar, Arijit Banerjee, Gamal Refai-Ahmed, Dereje Agonafer

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 571-578, July 19–23, 2009

Paper No: InterPACK2009-89341

DOI: https://doi.org/10.1115/InterPACK2009-89341

View Paper

Topics: Flat heat pipes, Graphite, Pareto optimization, Cooling, Copper, Laptop computers, Temperature, Thermal conductivity, Weight (Mass), Density

Proceedings Papers

Improving the Performance of an Impingement Heat Sink by Modifying the Fin Shapes

Sravan Gondipalli, Bahgat Sammakia, Gamal Refai-Ahmed

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 273-282, July 19–23, 2009

Paper No: InterPACK2009-89076

DOI: https://doi.org/10.1115/InterPACK2009-89076

View Paper

Topics: Heat sinks, Shapes

Proceedings Papers

Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance

Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmed

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 111-118, July 19–23, 2009

Paper No: InterPACK2009-89188

DOI: https://doi.org/10.1115/InterPACK2009-89188

View Paper

Topics: Clocks, Computer simulation, Computers, Control equipment, Junctions, Pareto optimization, Product reliability, Temperature, Temperature gradient

Proceedings Papers

Thermal Characterization of Planar Interconnect Architectures Under Transient Currents

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar, Gamal Refai-Ahmed

Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1381-1389, November 13–19, 2009

Paper No: IMECE2009-11996

DOI: https://doi.org/10.1115/IMECE2009-11996

View Paper

Topics: Architecture, Currents, Thermal characterization, Transients (Dynamics), Heating, Joules, Finite element analysis, Finite element model, Heat, Microelectronic devices

Journal Articles

Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture

Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmed

J. Electron. Packag. June 2010, 132(2): 021008.

DOI: https://doi.org/10.1115/1.4001852

Published Online: June 25, 2010

View Article

Topics: Junctions, Temperature, Pareto optimization, Delays, Temperature gradient, Engines

Journal citation

NARROW

Evaluation of Electromigration Coupling Different Physics Fields in Numerical Simulation

Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks

Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications

Solving Thermal Issues in a Three-Dimensional-Stacked-Quad-Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through-Silicon-Vias

High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices

Liquid Cooling of a Stacked Quad-Core Processor and DRAM Using Laminar Flow in Microchannels

Thermal-Aware Power Migration in Many-Core Processors

Fast Prediction of Temperature Evolution in Electronic Devices for Run-Time Thermal Management Applications

Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method

Enhanced Thermal Map Prediction and Floor Plan Optimization in Electronic Devices Considering Sub-Continuum Thermal Effects

Robust Thermal Management for Embedded CPU and GPUs in Displays

Single-Phase Microchannel Cooling for Stacked Single Core Chip and DRAM

Single-Phase Liquid Cooling of a Quad-Core Processor

Reduced-Order Fluidic Model for Flow Instabilities in Two-Phase Microfluidic Heat Exchangers

Effects of Transient Heating on Two-Phase Flow Response in Microchannel Heat Exchangers

Multi-Objective Optimization of Graphite Heat Spreader for Portable Systems Applications

Improving the Performance of an Impingement Heat Sink by Modifying the Fin Shapes

Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance

Thermal Characterization of Planar Interconnect Architectures Under Transient Currents

Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only