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Proceedings Papers

A Three-Face Utilized Heat Sink Design for 3-D Integrated 75 kVA Intelligent Power Stage (IPS)

Abdul Basit Mirza, Xiaoqiang Xu, Asif Imran Emon, Fang Luo, Shikui Chen
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A008, October 25–27, 2022
Paper No: IPACK2022-97886
https://doi.org/10.1115/IPACK2022-97886
View Paper titled, A Three-Face Utilized Heat Sink Design for 3-D Integrated 75 kVA Intelligent Power Stage (IPS)
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Topics: Design, Heat sinks, Optimization
Proceedings Papers

Topology Optimization of Heat Sink for 3d Integrated Power Converters

Xiaoqiang Xu, Abdul Basit Mirza, Lingfeng Gao, Fang Luo, Shikui Chen
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A009, October 25–27, 2022
Paper No: IPACK2022-98066
https://doi.org/10.1115/IPACK2022-98066
View Paper titled, Topology Optimization of Heat Sink for 3d Integrated Power Converters
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Topics: Heat sinks, Optimization, Power converters, Topology, Design, Convection, Cooling, Computer simulation, Density, Filtration
Proceedings Papers

Topology Optimization of Permanent Magnets for Generators Using Level Set Methods

Jiawei Tian, Ran Zhuang, Juan Cilia, Arvind Rangarajan, Fang Luo, Jon Longtin, Shikui Chen
Proc. ASME. IDETC-CIE2022, Volume 3B: 48th Design Automation Conference (DAC), V03BT03A037, August 14–17, 2022
Paper No: DETC2022-90601
https://doi.org/10.1115/DETC2022-90601
View Paper titled, Topology Optimization of Permanent Magnets for Generators Using Level Set Methods
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Topics: Generators, Optimization, Permanent magnets, Topology, Design, Machinery, Magnetic materials, Equipment performance, Generative design, Magnetic fields
Journal Articles

Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics

Hayden Carlton, Ange Iradukunda, Asif Imran, Sarah Myane, Noah Akey, Fang Luo, David Huitink
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. June 2022, 144(2): 024502.
Paper No: EP-21-1049
https://doi.org/10.1115/1.4053642
Published Online: February 16, 2022
View Article titled, Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics
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Topics: Electromagnetic interference, Electronics, Nanocomposites, Silicones, Nanoparticles, Iron
Proceedings Papers

Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module

Hayden Carlton, Md Maksudul Hossain, Arman Ur Rashid, Yuxiang Chen, Alan Mantooth, Asif Imran, Fang Luo, John Harris, Alexis Krone, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 26–28, 2021
Paper No: IPACK2021-72726
https://doi.org/10.1115/IPACK2021-72726
View Paper titled, Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module
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Topics: Bridges (Structures), Cooling, Gallium nitride, Gates (Closures), Optimization
Proceedings Papers

Multifunctional Magnetic Nanocomposite Encapsulant for EMI Shielding in Power Electronics

Hayden Carlton, Ange Iradukunda, David Huitink, Sarah Myane, Noah Akey, Asif Imran, Fang Luo
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 27–29, 2020
Paper No: IPACK2020-2576
https://doi.org/10.1115/IPACK2020-2576
View Paper titled, Multifunctional Magnetic Nanocomposite Encapsulant for EMI Shielding in Power Electronics
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Topics: Electronics, Nanocomposites
Journal Articles

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

Reece Whitt, Skyler Hudson, David Huitink, Zhao Yuan, Asif Emon, Fang Luo
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041004.
Paper No: EP-20-1034
https://doi.org/10.1115/1.4048493
Published Online: October 12, 2020
View Article titled, Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization
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Topics: Additive manufacturing, Coolants, Cooling, Design, Electromagnetic interference, Flat heat pipes, Flow (Dynamics), Fluids, Heat, Heat transfer
Journal Articles

Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications

Ange-Christian Iradukunda, Josh Kasitz, Hayden Carlton, David Huitink, Amol Deshpande, Fang Luo
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031109.
Paper No: EP-20-1009
https://doi.org/10.1115/1.4046935
Published Online: May 4, 2020
View Article titled, Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications
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Topics: Electrical properties, Electronics, Iron, Nanocomposites, Nanoparticles, Phase change materials, Temperature, Thermal conductivity, Thermal properties, Heat
Proceedings Papers

Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization

Reece Whitt, David Huitink, Skyler Hudson, Bakhtiyar Nafis, Zhao Yuan, Balaji Narayanasamy, Amol Deshpande, Fang Luo, Asif Imran, Zion Clarke, Sonya Smith
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A015, October 7–9, 2019
Paper No: IPACK2019-6442
https://doi.org/10.1115/IPACK2019-6442
View Paper titled, Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization
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Topics: Additive manufacturing, Design, Flat heat pipes, Optimization, Heat, Convection, Heat sinks, Nonmetallic materials, Thermal management, Density