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Evan Colgan
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Journal Articles

Embedded Two-Phase Cooling of Large Three-Dimensional Compatible Chips With Radial Channels

Mark Schultz, Fanghao Yang, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, Pritish Parida, John Knickerbocker, Timothy Chainer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021005.
Paper No: EP-15-1084
DOI: https://doi.org/10.1115/1.4033309
Published Online: April 25, 2016
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Topics: Coolants, Cooling, Flow (Dynamics), Heat, Pressure drop, Temperature, Vehicles, Sensors, Silicon
Proceedings Papers

Embedded Two-Phase Cooling of Large 3D Compatible Chips With Radial Channels

Mark Schultz, Fanghao Yang, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, Pritish Parida, John Knickerbocker, Timothy Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A007, July 6–9, 2015
Paper No: IPACK2015-48348
DOI: https://doi.org/10.1115/IPACK2015-48348
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Topics: Cooling, Coolants, Temperature, Vehicles, Flux (Metallurgy), Heat, Dimensions, Flow (Dynamics), Heating, Pressure drop
Proceedings Papers

Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits

Arvind Sridhar, Chin Lee Ong, Stefan Paredes, Bruno Michel, Thomas Brunschwiler, Pritish Parida, Evan Colgan, Timothy Chainer, Catherine Gorle, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A039, July 6–9, 2015
Paper No: IPACK2015-48690
DOI: https://doi.org/10.1115/IPACK2015-48690
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Topics: Cavities, Cooling, Design, Integrated circuits, Fluids, Pressure, Blocks (Building materials), Computer simulation, Construction, Drainage
Proceedings Papers

Local Measurements of Flow Boiling Heat Transfer on Hot Spots in 3D Compatible Radial Microchannels

Fanghao Yang, Mark Schultz, Pritish Parida, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, John Knickerbocker, Timothy Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A006, July 6–9, 2015
Paper No: IPACK2015-48341
DOI: https://doi.org/10.1115/IPACK2015-48341
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Heating, Temperature, Cooling, Resistance thermometers, Coolants, Density
Proceedings Papers

Development of an Experimental Facility for Investigating Single-Phase Liquid Flow in Microchannels

Mark E. Steinke, Satish G. Kandlikar, J. H. Magerlein, Evan Colgan, Alan D. Raisanen
Proc. ASME. ICMM2005, ASME 3rd International Conference on Microchannels and Minichannels, Parts A and B, 233-243, June 13–15, 2005
Paper No: ICMM2005-75070
DOI: https://doi.org/10.1115/ICMM2005-75070
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Topics: Flow (Dynamics), Microchannels, Temperature, Copper, Heat transfer, Microchannel flow, Resistors, Silicon, Borosilicate glasses, Fluids