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Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 7–9, 2019

Paper No: IPACK2019-6400

DOI: https://doi.org/10.1115/IPACK2019-6400

View Paper titled, Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa

Topics: Cooling, Heat exchangers, Manifolds, Microchannels

Journal Articles

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede

J. Electron. Packag. March 2020, 142(1): 011003.

Paper No: EP-19-1014

DOI: https://doi.org/10.1115/1.4044476

Published Online: September 19, 2019

View Article titled, Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Topics: Bonding, Electronics, High temperature, Manufacturing, Stress, Tension-leg platforms, Thermal stresses, Tin, Transients (Dynamics), Temperature

Journal Articles

Two-Phase Performance of a Hybrid Jet Plus Multipass Microchannel Heat Sink

Shailesh N. Joshi, Danny J. Lohan, Ercan M. Dede

J. Thermal Sci. Eng. Appl. February 2020, 12(1): 011019.

Paper No: TSEA-18-1466

DOI: https://doi.org/10.1115/1.4044347

Published Online: September 7, 2019

View Article titled, Two-Phase Performance of a Hybrid Jet Plus Multipass Microchannel Heat Sink

Topics: Boiling, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer, Heat transfer coefficients, Microchannels, Pressure drop, Temperature, Pressure

Journal Articles

Design, Fabrication, and Performance Evaluation of a Hybrid Wick Vapor Chamber

Feng Zhou, Yanghe Liu, Ercan M. Dede

J. Heat Transfer. August 2019, 141(8): 081802.

Paper No: HT-18-1761

DOI: https://doi.org/10.1115/1.4043797

Published Online: June 12, 2019

View Article titled, Design, Fabrication, and Performance Evaluation of a Hybrid Wick Vapor Chamber

Topics: Design, Heat flux, Vapors, Thermal resistance, Temperature, Heat, Cooling, Flat heat pipes

Journal Articles

Special Issue on InterPACK 2018

Ercan M. Dede, Lauren Boteler, Changqing Chen, Przemyslaw Jakub Gromala, Benjamin Leever, Wei Li

J. Electron. Packag. September 2019, 141(3): 030301.

Paper No: EP-19-1036

DOI: https://doi.org/10.1115/1.4043484

Published Online: May 8, 2019

View Article titled, Special Issue on InterPACK 2018

Topics: Electronic packaging, Electronics, Microelectromechanical systems, Design, Internet of things, Condition monitoring, Data centers, Electric vehicles, Energy conversion, Engineering teachers

Journal Articles

Optimal Design of Three-Dimensional Heat Flow Structures for Power Electronics Applications

Ercan M. Dede, Yanghe Liu, Shailesh N. Joshi, Feng Zhou, Danny J. Lohan, Jong-Won Shin

J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021011.

Paper No: TSEA-18-1001

DOI: https://doi.org/10.1115/1.4041440

Published Online: December 5, 2018

View Article titled, Optimal Design of Three-Dimensional Heat Flow Structures for Power Electronics Applications

Topics: Design, Flow (Dynamics), Gates (Closures), Heat, Optimization, Temperature, Electronics, Manufacturing

Journal Articles

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura

J. Electron. Packag. March 2018, 140(1): 010904.

Paper No: EP-17-1093

DOI: https://doi.org/10.1115/1.4039020

Published Online: March 2, 2018

View Article titled, Thermal Metamaterials for Heat Flow Control in Electronics

Topics: Composite materials, Design, Electronics, Flow control, Heat, Heat flux, Metamaterials, Printed circuit boards, Temperature, Anisotropy

Proceedings Papers

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 29–September 1, 2017

Paper No: IPACK2017-74112

DOI: https://doi.org/10.1115/IPACK2017-74112

View Paper titled, Thermal Metamaterials for Heat Flow Control in Electronics

Topics: Electronics, Flow control, Heat, Metamaterials, Flow (Dynamics), Anisotropy, Blocks (Building materials), Circuit design, Composite materials, Design

Proceedings Papers

Local-Scale Simulations of Nucleate Boiling on Micrometer-Featured Surfaces

Hariswaran Sitaraman, Gilberto Moreno, Ercan M. Dede, Shailesh N. Joshi, Feng Zhou, Sreekant Narumanchi

Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T11A011, July 9–12, 2017

Paper No: HT2017-4710

DOI: https://doi.org/10.1115/HT2017-4710

View Paper titled, Local-Scale Simulations of Nucleate Boiling on Micrometer-Featured Surfaces

Topics: Engineering simulation, Nucleate boiling, Simulation, Cavities, Computational fluid dynamics, Nucleation (Physics), Bubbles, Buoyancy, Convection, Deformation

Proceedings Papers

Combined Lumped and Continuum Parameter Design Optimization of Electro-Thermal Systems.

Danny J. Lohan, James T. Allison, Ercan M. Dede, Masanori Ishigaki

Proc. ASME. IDETC-CIE2016, Volume 2B: 42nd Design Automation Conference, V02BT03A013, August 21–24, 2016

Paper No: DETC2016-60218

DOI: https://doi.org/10.1115/DETC2016-60218

View Paper titled, Combined Lumped and Continuum Parameter Design Optimization of Electro-Thermal Systems.

Topics: Design, Optimization, Circuits, Circuit design, Damping, Electrical components, Electronics, Energy gap, Flat heat pipes, Semiconductors (Materials)

Journal Articles

Modular Design for a Single-Phase Manifold Mini/Microchannel Cold Plate

Feng Zhou, Yan Liu, Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede

J. Thermal Sci. Eng. Appl. June 2016, 8(2): 021010.

Paper No: TSEA-15-1162

DOI: https://doi.org/10.1115/1.4031932

Published Online: December 8, 2015

View Article titled, Modular Design for a Single-Phase Manifold Mini/Microchannel Cold Plate

Topics: Coolants, Design, Flow (Dynamics), Heat sinks, Manifolds, Microchannels, Pressure drop, Cooling, Temperature

Proceedings Papers

Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Ercan M. Dede, Shailesh N. Joshi, Feng Zhou

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A001, July 6–9, 2015

Paper No: IPACK2015-48027

DOI: https://doi.org/10.1115/IPACK2015-48027

View Paper titled, Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Topics: Heat sinks, Manufacturing, Optimization, Testing, Topology, Computer-aided design, Design, Aluminum, Convection, Cooling

Proceedings Papers

Modular Flow Structure Design for a Single-Phase Manifold Microchannel Cold Plate

Feng Zhou, Yan Liu, Shailesh N. Joshi, Yanghe Liu, Ercan M. Dede

Paper No: IPACK2015-48029

DOI: https://doi.org/10.1115/IPACK2015-48029

View Paper titled, Modular Flow Structure Design for a Single-Phase Manifold Microchannel Cold Plate

Topics: Design, Flow (Dynamics), Manifolds, Microchannels, Cooling, Shapes, Coolants, Temperature, Channel flow, Computer cooling

Journal Articles

Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Ercan M. Dede, Shailesh N. Joshi, Feng Zhou

J. Mech. Des. November 2015, 137(11): 111403.

Paper No: MD-15-1084

DOI: https://doi.org/10.1115/1.4030989

Published Online: October 12, 2015

View Article titled, Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Topics: Design, Heat sinks, Manufacturing, Optimization, Topology, Convection, Computer-aided design

Journal Articles

Boiling Heat Transfer From an Array of Round Jets With Hybrid Surface Enhancements

Matthew J. Rau, Suresh V. Garimella, Ercan M. Dede, Shailesh N. Joshi

J. Heat Transfer. July 2015, 137(7): 071501.

Paper No: HT-14-1040

DOI: https://doi.org/10.1115/1.4029969

Published Online: July 1, 2015

View Article titled, Boiling Heat Transfer From an Array of Round Jets With Hybrid Surface Enhancements

Topics: Boiling, Critical heat flux, Fins, Flow (Dynamics), Heat transfer, Jets, Pressure drop, Heat flux, Coating processes, Coatings

Proceedings Papers

An Experimental Study of a Single-Device Jet Impingement Cooler With Phase Change Using HFE-7100 and a Vapor Extraction Manifold

Shailesh N. Joshi, Matthew J. Rau, Ercan M. Dede

Proc. ASME. IMECE2013, Volume 8B: Heat Transfer and Thermal Engineering, V08BT09A021, November 15–21, 2013

Paper No: IMECE2013-63249

DOI: https://doi.org/10.1115/IMECE2013-63249

View Paper titled, An Experimental Study of a Single-Device Jet Impingement Cooler With Phase Change Using HFE-7100 and a Vapor Extraction Manifold

Topics: Manifolds, Vapors, Pressure, Coolants, Design, Flat heat pipes, Heat transfer coefficients, Heat transfer, Containment, Cooling

Proceedings Papers

An Experimental Study of a Multi-Device Jet Impingement Cooler With Phase Change Using HFE-7100

Shailesh N. Joshi, Matthew J. Rau, Ercan M. Dede, Suresh V. Garimella

Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A004, July 14–19, 2013

Paper No: HT2013-17059

DOI: https://doi.org/10.1115/HT2013-17059

View Paper titled, An Experimental Study of a Multi-Device Jet Impingement Cooler With Phase Change Using HFE-7100

Topics: Cooling, Critical heat flux, Density, Design, Electronics, Fluids, Flux (Metallurgy), Heart failure, Heat, Heat transfer

Proceedings Papers

Investigation of Liquid Flow in a Multi-Pass Branching Microchannel System

Ercan M. Dede

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1071-1080, November 9–15, 2012

Paper No: IMECE2012-85483

DOI: https://doi.org/10.1115/IMECE2012-85483

View Paper titled, Investigation of Liquid Flow in a Multi-Pass Branching Microchannel System

Topics: Flow (Dynamics), Microchannels, Design, Engineering simulation, Fluid dynamics, Heat sinks, Heat transfer, Manifolds, Manufacturing, Pressure drop

Journal citation

NARROW

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Two-Phase Performance of a Hybrid Jet Plus Multipass Microchannel Heat Sink

Design, Fabrication, and Performance Evaluation of a Hybrid Wick Vapor Chamber

Special Issue on InterPACK 2018

Optimal Design of Three-Dimensional Heat Flow Structures for Power Electronics Applications

Thermal Metamaterials for Heat Flow Control in Electronics

Thermal Metamaterials for Heat Flow Control in Electronics

Local-Scale Simulations of Nucleate Boiling on Micrometer-Featured Surfaces

Combined Lumped and Continuum Parameter Design Optimization of Electro-Thermal Systems.

Modular Design for a Single-Phase Manifold Mini/Microchannel Cold Plate

Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Modular Flow Structure Design for a Single-Phase Manifold Microchannel Cold Plate

Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Boiling Heat Transfer From an Array of Round Jets With Hybrid Surface Enhancements

An Experimental Study of a Single-Device Jet Impingement Cooler With Phase Change Using HFE-7100 and a Vapor Extraction Manifold

An Experimental Study of a Multi-Device Jet Impingement Cooler With Phase Change Using HFE-7100

Investigation of Liquid Flow in a Multi-Pass Branching Microchannel System

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