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Proceedings Papers

Thermal Modeling of a Liquid-Cooled Electric Machine

Edward Jih, Kanghua Chen, Thomas Abraham, Feng Liang
Proc. ASME. IMECE2001, Heat Transfer: Volume 5 — Computational, Aerospace and Environmental Heat Transfer, 193-200, November 11–16, 2001
Paper No: IMECE2001/HTD-24303
DOI: https://doi.org/10.1115/IMECE2001/HTD-24303
View Paper titled, Thermal Modeling of a Liquid-Cooled Electric Machine
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Topics: Automotive industry, Computational fluid dynamics, Contact resistance, Cooling, Design, Electric motors, Epoxy adhesives, Epoxy resins, Fuel cell vehicles, Heat transfer
Proceedings Papers

Design of Liquid Cooled Coldplate for the Inverter of the Hybrid Electric Vehicle

C. Edward Jih, K. Chen, T. Abraham, V. Siddapureddy, R. Poulson, V. A. Sankaran
Proc. ASME. IMECE2000, Heat Transfer: Volume 4, 357-363, November 5–10, 2000
Paper No: IMECE2000-1540
DOI: https://doi.org/10.1115/IMECE2000-1540
View Paper titled, Design of Liquid Cooled Coldplate for the Inverter of the Hybrid Electric Vehicle
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Topics: Design, Hybrid electric vehicles, Computational fluid dynamics, Fins, Coolants, Flow (Dynamics), Gates (Closures), Heat, Packaging, Pressure drop
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Michael Degner, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031118.
Paper No: EP-20-1032
DOI: https://doi.org/10.1115/1.4047883
Published Online: August 17, 2020
View Article titled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling in another window
Topics: Computational fluid dynamics, Design, Fluids, Manifolds, Microchannels, Pressure drop, Simulation, Coolers
Proceedings Papers

Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm 2 ) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Mike Degner, Kenneth E. Goodson
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A021, October 7–9, 2019
Paper No: IPACK2019-6472
DOI: https://doi.org/10.1115/IPACK2019-6472
View Paper titled, Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm 2 ) Power Electronics Cooling
Open the PDF for Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm 2 ) Power Electronics Cooling in another window
Topics: Computational fluid dynamics, Computer cooling, Coolers, Heat flux, Manifolds, Microchannels, Silicon, Water
Proceedings Papers

Thermal Modeling of a Liquid-Cooled PM Traction Motor

Edward Jih, Thomas Abraham, Stephen Stella, Roy Davis, Bert Dinger, Raymond Ong
Proc. ASME. IMECE2003, Heat Transfer, Volume 1, 259-266, November 15–21, 2003
Paper No: IMECE2003-42512
DOI: https://doi.org/10.1115/IMECE2003-42512
View Paper titled, Thermal Modeling of a Liquid-Cooled PM Traction Motor
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Topics: Engines, Modeling, Motors, Traction
Journal Articles

Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints

Edward Jih, Yi-Hsin Pao
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 94–99.
DOI: https://doi.org/10.1115/1.2792087
Published Online: June 1, 1995
View Article titled, Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints
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Topics: Design, Resistors, Solder joints, Finite element analysis, Capacitors, Cracking (Materials), Creep, Electronic packaging, Failure, Fatigue
Journal Articles

An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints

Yi-Hsin Pao, Ratan Govila, Scott Badgley, Edward Jih
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 1–8.
DOI: https://doi.org/10.1115/1.2909296
Published Online: March 1, 1993
View Article titled, An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints
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Topics: Fatigue, Finite element analysis, Fracture (Materials), Solder joints, Solders, Stress, Creep, Alloys, Cycles, Failure
Journal Articles

A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS

Yi-Hsin Pao, Edward Jih, Bruce E. Artz, Larry W. Cathey
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. December 1992, 114(4): 470–472.
DOI: https://doi.org/10.1115/1.2905483
Published Online: December 1, 1992
View Article titled, A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS
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Topics: Temperature, Thermal expansion, Errors, Electronic packages, Engineers, Error analysis, Finite element analysis, Finite element model, Modeling, Temperature effects