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Proceedings Papers

Single Point Diamond Turning of Silicon by Using Micro-Laser Assisted Machining Technique

Hossein Mohammadi, H. Bogac Poyraz, Deepak Ravindra, John A. Patten
Proc. ASME. MSEC2014, Volume 2: Processing, V002T02A057, June 9–13, 2014
Paper No: MSEC2014-4138
DOI: https://doi.org/10.1115/MSEC2014-4138
View Paper titled, Single Point Diamond Turning of Silicon by Using Micro-Laser Assisted Machining Technique
Click here to open pdf in another window PDF for Single Point Diamond Turning of Silicon by Using Micro-Laser Assisted Machining Technique
Topics: Diamond turning, Lasers, Machining, Silicon, Cutting tools, Semiconductor wafers, Brittleness, Diamonds, Fiber lasers, Crystals
Proceedings Papers

Micro-Laser Assisted Feasibility Test on Soda-Lime-Glass

Deepak Ravindra, Surya Chaitanya Ponthapalli, John Patten
Proc. ASME. MSEC2013, Volume 1: Processing, V001T01A079, June 10–14, 2013
Paper No: MSEC2013-1200
DOI: https://doi.org/10.1115/MSEC2013-1200
View Paper titled, Micro-Laser Assisted Feasibility Test on Soda-Lime-Glass
Click here to open pdf in another window PDF for Micro-Laser Assisted Feasibility Test on Soda-Lime-Glass
Topics: Glass, Lasers, Brittleness, Heating, Diamond tools, Fracture toughness, Glass containers, Machinery, Manufacturing, Stress
Proceedings Papers

The Annealing Effect of the High-Pressure Phases of Silicon During Micro-Laser Assisted Machining

Deepak Ravindra, Muralidhar K. Ghantasala, John Patten
Proc. ASME. ISFA2012, ASME/ISCIE 2012 International Symposium on Flexible Automation, 533-539, June 18–20, 2012
Paper No: ISFA2012-7207
DOI: https://doi.org/10.1115/ISFA2012-7207
View Paper titled, The Annealing Effect of the High-Pressure Phases of Silicon During Micro-Laser Assisted Machining
Click here to open pdf in another window PDF for The Annealing Effect of the High-Pressure Phases of Silicon During Micro-Laser Assisted Machining
Topics: Annealing, High pressure (Physics), Lasers, Machining, Silicon, Cutting, Brittleness, Ceramics, Crystals, Damage
Proceedings Papers

Studying the Temperature Effect During the High-Pressure Phase Transformation of Silicon via Indentations

Deepak Ravindra, John Patten, Muralidhar K. Ghantasala
Proc. ASME. MSEC2012, ASME 2012 International Manufacturing Science and Engineering Conference, 521-525, June 4–8, 2012
Paper No: MSEC2012-7323
DOI: https://doi.org/10.1115/MSEC2012-7323
View Paper titled, Studying the Temperature Effect During the High-Pressure Phase Transformation of Silicon via Indentations
Click here to open pdf in another window PDF for Studying the Temperature Effect During the High-Pressure Phase Transformation of Silicon via Indentations
Topics: High pressure (Physics), Phase transitions, Silicon, Temperature, Machining, Lasers, Brittleness, Pressure, Ceramics, Cutting tools
Proceedings Papers

Force Analysis, Mechanical Energy and Laser Heating Evaluation of Scratch Tests on Silicon Carbide (4H-SiC) in Micro-Laser Assisted Machining (µ-LAM) Process

Amir R. Shayan, Huseyin Bogac Poyraz, Deepak Ravindra, Muralidhar Ghantasala, John A. Patten
Proc. ASME. MSEC2009, ASME 2009 International Manufacturing Science and Engineering Conference, Volume 1, 827-832, October 4–7, 2009
Paper No: MSEC2009-84207
DOI: https://doi.org/10.1115/MSEC2009-84207
View Paper titled, Force Analysis, Mechanical Energy and Laser Heating Evaluation of Scratch Tests on Silicon Carbide (4H-SiC) in Micro-Laser Assisted Machining (µ-LAM) Process
Click here to open pdf in another window PDF for Force Analysis, Mechanical Energy and Laser Heating Evaluation of Scratch Tests on Silicon Carbide (4H-SiC) in Micro-Laser Assisted Machining (µ-LAM) Process
Topics: Heating, Lasers, Machining, Silicon, Cutting tools, Cutting, Atomic force microscopy, Diamonds, Geometry, Laser beams
Proceedings Papers

Single Point Diamond Turning Effects on Surface Quality and Subsurface Damage in Ceramics

Deepak Ravindra, John A. Patten, Jun Qu
Proc. ASME. MSEC2009, ASME 2009 International Manufacturing Science and Engineering Conference, Volume 1, 707-713, October 4–7, 2009
Paper No: MSEC2009-84113
DOI: https://doi.org/10.1115/MSEC2009-84113
View Paper titled, Single Point Diamond Turning Effects on Surface Quality and Subsurface Damage in Ceramics
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Topics: Ceramics, Damage, Diamond turning, Surface quality, Machining, Acoustics, Brittleness, Microscopy, Optical microscopy, Quartz
Proceedings Papers

Improving the Surface Roughness of a CVD Coated Silicon Carbide Disk by Performing Ductile Regime Single Point Diamond Turning

Deepak Ravindra, John Patten
Proc. ASME. MSEC2008, ASME 2008 International Manufacturing Science and Engineering Conference, Volume 1, 155-161, October 7–10, 2008
Paper No: MSEC_ICM&P2008-72145
DOI: https://doi.org/10.1115/MSEC_ICMP2008-72145
View Paper titled, Improving the Surface Roughness of a CVD Coated Silicon Carbide Disk by Performing Ductile Regime Single Point Diamond Turning
Click here to open pdf in another window PDF for Improving the Surface Roughness of a CVD Coated Silicon Carbide Disk by Performing Ductile Regime Single Point Diamond Turning
Topics: Chemical vapor deposition, Diamond turning, Disks, Silicon, Surface roughness, Machining, Surface quality, Brittleness, Ceramics, Diamond tools