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Dapeng Liu
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Journal Articles

A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

Dapeng Liu, Seungbae Park
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2014, 136(3): 034501.
Paper No: EP-13-1094
https://doi.org/10.1115/1.4026661
Published Online: May 5, 2014
View Article titled, A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5
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Topics: Diffusion (Physics), Simulation, Temperature, Transients (Dynamics), Materials properties
Journal Articles

Three-Dimensional and 2.5 Dimensional Interconnection Technology: State of the Art

Dapeng Liu, Seungbae Park
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. March 2014, 136(1): 014001.
Paper No: EP-13-1038
https://doi.org/10.1115/1.4026615
Published Online: February 18, 2014
View Article titled, Three-Dimensional and 2.5 Dimensional Interconnection Technology: State of the Art
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Topics: Bonding, Manufacturing, Semiconductor wafers, Solders, Packaging, Low temperature
Proceedings Papers

An Experimental and Numerical Study of the Behavior of the Thin Glass Edge Under Ball Drop Impact

Liang Xue, Dapeng Liu, Hohyung Lee, Da Yu, Satish Chaparala, Seungbae Park
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73293
https://doi.org/10.1115/IPACK2013-73293
View Paper titled, An Experimental and Numerical Study of the Behavior of the Thin Glass Edge Under Ball Drop Impact
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Topics: Glass